EEWORLDEEWORLDEEWORLD

Part Number

Search

TSM-149-01-FM-DV

Description
.025 SQ. TERMINAL STRIPS
CategoryThe connector   
File Size271KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Download Datasheet Parametric View All

TSM-149-01-FM-DV Overview

.025 SQ. TERMINAL STRIPS

TSM-149-01-FM-DV Parametric

Parameter NameAttribute value
Connector typeConnector
Contact typeMale pin
Spacing - Mating0.100"(2.54mm)
Number of pins98
Number of rows2
Line spacing - patching0.100"(2.54mm)
Number of pins loadedall
styleBoard to Board or Cable
shieldUncovered
Installation typesurface mount
Terminationwelding
Fastening typepush-pull
Contact Length - Mating0.230"(5.84mm)
Contact length - terminal-
Overall contact length-
Insulation height0.100"(2.54mm)
Contact shapeSquare
Contact surface treatment - matinggold
Contact Surface Treatment Thickness - Mating3.00µin(0.076µm)
Contact Surface Preparation - Columntin
Contact materialPhosphor bronze
Insulation MaterialsLiquid Crystal Polymer (LCP)
characteristic-
Operating temperature-55°C ~ 125°C
Intrusion protection-
Material flammability ratingUL94 V-0
Insulation colorblack
Rated current-
Rated voltage-
Joint stack height-
Contact Surface Treatment Thickness - Column-
application-
F-218 (Rev
10OCT17)
TSM–116–02–S–DV–LC
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 30 µ" GOLD
TSM–121–01–T–SV
(2.54 mm) .100"
SMT .025" SQ POST HEADER
Board Mates:
SSW, SSQ, SSM, BSW, ESW,
ESQ, BCS, SLW, CES, HLE
Cable Mates:
IDSS, IDSD, SMSD, SMSS
TSM
1
NO. PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
ROW
OPTION
SPECIFICATIONS
For complete specifications
and recommended PCB layouts
see www.samtec.com?TSM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +105 °C with Tin;
-55 °C to +125 °C with Gold
Voltage Rating:
475 VAC -SV/-DV mated with
BCS or SSM
RoHS Compliant:
Yes
MATES
TSM/SSW
TSM/SSM
TSM/HLE
CURRENT RATING
(PER PIN)
4.7 A
5.4 A
4.1 A
02
thru
36
–01
= .230" (5.84 mm) Post Height IDSS, IDSD)
(Mates with SSW, BCS, SSM,
Post
Height
= Gold flash on post,
Matte Tin on tail
–F
–L
= 10 µ" (0.25 µm) Gold on post,
Matte Tin on tail
.320" (8.13
–02
= (Mates withmm) Post Height
SSM -DH)
.420" (10.67
Height
–03
= (For Bottom mm) PostPass Through)
Mount &
.120" (3.05
–04
= (Mates withmm) Post Height
SLW, CES, HLE)
= 30 µ" (0.76 µm) Gold on post,
Matte Tin on tail
–S
–T
= Matte Tin
= Single Row Vertical Pin
–SV
2 PINS POWERED
36
(2.54) .100 x No. of positions
(2.54)
.100
PROCESSING
Lead–Free Solderable:
Yes
-DH/-SH Lead Coplanarity:
(0.15 mm) .006" max (02-36)*
-DV/-SV Lead Coplanarity:
(0.10 mm) .004" max (02-05)
(0.13 mm) .005" max (06-10)*
(0.15 mm) .006" max (11-36)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
(2.54)
.100
01
(0.64)
.025
SQ
(1.14)
.045
REF
Post
Height
(2.54)
.100
(3.81)
.150
APPLICATIONS
SSM
TSM
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
HORIZONTAL
(1.40)
.055
(1.78)
.070
= Single Row
Horizontal Pin
–SH
(2.54) .100 x No. of positions
36
01
(3.05)
.120
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Edge Mount and
Locking Clips for –SV
• Solder Locks for –DH and
Shrouds for –DV
• Other platings
Contact Samtec.
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
(1.58)
.062
DIA
(2)
Optional Alignment Pin (–A)
(No. of positions x (2.54) .100) – (5.08) .200
(0.64)
.025
SQ
Post
Height
(2.54)
.100
(2.03)
.080
–01= (4.57) .180
–02, –03, –04 = (4.82) .190
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Some Misunderstandings of FPGA Learning
Reprinted from the Internet, the author is unknown.I have been the administrator of many QQ groups related to FPGA learning and discussion for many years. For a long time, many newcomers who have join...
FPGA小牛 FPGA/CPLD
High-speed circuit design and simulation analysis: Cadence example design details
Circuit design, especially modern high-speed circuit system design, is a job that changes with each passing day as electronic technology develops. It is very interesting and challenging. The purpose o...
arui1999 Download Centre
I would like to ask a question about ultrasonic binary gas concentration measurement?
Has anyone in the forum done research on ultrasonic binary gas concentration measurement? For example, measuring oxygen concentration in air-oxygen mixed gas. I see such sensors on the Internet, but m...
qzc飘曳 Sensor
3D Library in AD
The 3D library in AD has been imported. Also attached is a website where you can download 3D models yourself.http://www.3dcontentcentral.cn/default.aspx...
mcu_mouse PCB Design
Voice chip API8108A
When I use the voice chip API8108A, the sound is relatively low. I don’t know why....
img2007 Embedded System
LED Basics: 12 Important LED Performance Indicators
[p=26, null, left][font=Arial, Helvetica, sans-serif][color=#000000]To have a deep understanding of LED, we need to understand not only some basic knowledge of LED, but also the performance index of L...
qwqwqw2088 LED Zone

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2199  716  754  2673  183  45  15  16  54  4 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号