Product Data Sheet
VL-COMm-33
COM Express Mini CPU Module
55 x 84 mm
(2.17 x 3.31”)
Overview
The VL-COMm-33 is an extremely small and rugged Computer on
Module (COM) based on the industry-standard COM Express mini
form factor. Roughly the size of a credit card, the VL-COMm-33 has
been engineered to meet the requirements of aviation, defense,
industrial control, and medical applications while adhering to
stringent regulatory standards. The VL-COMm-33 is manufactured
to IPC-A-610 Class 2 standards. Equipped with an Intel Atom
“Bay Trail” E38xx processor, it is designed to withstand extreme
temperature, impact, and vibration.
Available in single, dual, and quad core versions, the COMm-33
provides extreme performance for its size. It does so at moderate
power consumption (3.5 to 7.25W typical), in a very small package.
The COMm-33 provides compatibility with a broad range of standard
x86 application development tools for reduced development time.
The VL-COMm-33 utilizes advanced Intel technologies to maxi-
mize performance. Intel Virtualization Technology allows one
VL-COMm-33 system to function as multiple “virtual” platforms.
This enables computing activities to be isolated into separate
partitions for increased application flexibility and reliability. Intel
64 architecture delivers 64-bit computing when combined with
supporting software.
Highlights
Intel® Atom™ Bay Trail E38xx processor
Extremely small COM Express™ mini form factor
Industrial temp. (-40º to +85ºC)
Wide input voltage (4.75V–20V)
On-board RAM
On-board eMMC Flash storage (optional)
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Product Data Sheet
Overview
...continued
The integrated Intel Gen-7 graphics core
provides hardware-accelerated MPEG-
4/H.264 and MPEG-2 video encoding and
decoding. A standard LVDS output supports
flat panel displays. An SDVO output supports
a variety of signaling interfaces including
VGA and DVI.
The standard COM Type 10 pin-out provides
industry-standard system interfaces that
include Gigabit Ethernet with network boot
capability, a single USB 3.0/2.0 and six USB
2.0 ports, two serial ports, Intel High-Definition
Audio (HDA), LPC, I2C, SPI, and SMBus to the
carrier board. A dual SATA 3 Gb/s interface
supports high-capacity storage. Optional
on-board eMMC memory supports up to
8 GB of Flash.
Designed and tested for industrial tempera-
ture (-40º to +85ºC) operation, the rugged
VL-COMm-33 also meets MIL-STD-202G
specifications for shock and vibration.
Soldered-down RAM provides additional
ruggedization for use in extremely harsh
environments.
The VL-COMm-33 is supported by a variety of
thermal heat dissipation solutions, including
a standard heat plate, heat sink, fan for heat
sink, heat pipe, and other cooling / mounting
solutions.
A wide input voltage range of 4.75 to 20 volts
simplifies system power supply requirements.
It is fully compatible with 12V automotive-type
power systems.
The VL-COMm-33 is backed by a five-year
warranty, 5+ year off-the-shelf availability
guarantee, and expert US-based technical
support. Product Life Extension options
support availability through the year 2025.
The VL-COMm-33 is compatible with a variety
of popular x86 operating systems including
Windows, Windows Embedded, Linux, and
VxWorks.
Product customization is available, even in
low quantities. Options include conformal
coating, splash screen configuration,
application-specific testing, BOM revision
locks, special labeling, etc.
A compatible carrier card is required for
operation of this COM module. Contact
VersaLogic for custom designed carrier
boards that meet your exact requirements.
Please contact a VersaLogic Sales Engineer
for more information.
Features
1
Intel Atom “Bay Trail” Processor
High performance CPU in quad-, dual- or single-
core versions. Low power consumption.
Wide Input Voltage Range
Accepts 4.75 to 20 volts (nominal 12V input)
Flash Memory
Up to 8 GB of on-board eMMC flash storage.
2
RAM
Up to 4 GB soldered-down RAM.
I/O Interfaces
SATA, PCIe, USB 3.0, USB 2.0, GPIO, serial,
HD audio, LPC, SMBus SPI, and I2C.
COM Express Mini Form Factor
Extremely small (55 mm x 84 mm) with
Type 10 pin-out.
Industrial Temperature Operation
Rated -40° to +85°C for harsh environments.
2
MIL-STD-202G
Qualified for high shock / vibration environments.
High-performance Video
Integrated Intel Gen 7 graphics core supports
DirectX 11, OpenGL 4.0, and H.264, MPEG-2
encoding/decoding. LVDS video output.
1
Network
Gigabit Ethernet (GbE) with remote boot support.
VersaLogic Corporation, 12100 SW Tualatin Rd., Tualatin, OR 97062 | (503) 747-2261 | Info@VersaLogic.com | www.VersaLogic.com
VL-COMm-33
COM Express Mini CPU Module
Specifications
General
Form Factor
Board Size
Weight
Processor
COM Express mini (Type 10)
55 mm x 84 mm (2.17” x 3.31”)
31 grams (1.09 oz.)
Intel Atom E38xx platform. 512K 8-way L2 cache per core.
Intel 64-bit instructions, Virtualization Technology (VT),
and new AES instructions.
Model
Idle
Typical Max.
S3
VL-COMm-33EAP
VL-COMm-33EBP
VL-COMm-33EDP
Input Voltage
System Reset &
Hardware Monitors
Manufacturing
Standards
Regulatory
Compliance
2.5W
3.5W
3.5W
3.5W
5.6W
7.3W
4.5W
8.0W
11.0W
0.4W
0.4W
0.4W
OEM Flat Panel
Interface
∆
Video
General
Integrated high-performance video. Intel Gen-7 graphics
core with 4 Execution Units and Turbo Boost. Supports
DirectX 11, OpenGL 4.0, VP8, MPEG2, H.264, and VC1.
Up to 224 MB shared DRAM
1x DDI (Digital Display Interface) with support for
1.1. Multiplexed with HDMI/DVI ports. Supports Hot-Plug
detect.
Multiplexed with DisplayPort (DP)/DVI. Supports
Hot-Plug detect
Multiplexed with HDMI/DP ports. Supports Hot-Plug
detect.
Single-channel LVDS interface. 18/24-bit.
Up to 1920 x 1200 (60 Hz).
VRAM
Desktop Display
Interface
∆
Power Requirements
(@ +12V)
§
4.75V–20V (nominal 12V operation)
Voltage rails monitored. Watchdog timer with
programmable timeout (1 µS to 10 min.).
IPC-A-610 Class 2
RoHS (2002/95/CE)
Mass Storage
Rotating Drive / Flash
Two SATA 3 Gb/s ports
∆
/ Solid-State Drives
‡ Optional eMMC 4.5 onboard flash up to 8 GB MLC
Network Interface
Ethernet †
∆
One autodetect 10BaseT/100BaseTX/1000BaseT port.
Network boot option.
Environmental
Operating
Temperature
Storage Temperature
Cooling
-40° to +85°C. Derate -1.1°C per 305m (1,000 ft.) above
2,300m (7,500 ft.). ¤
CPU die must be kept below 90°C
-40° to +85°C
Thermal solution required.
CPU die must be kept below 90°C.
See heat plate, heat sink, fan, and heat pipe options.
All models: 100 LFM (30 LMM)
LFM = Linear Feet per Minute
LMM = Linear Meters per Minute
Type 10 I/O Interfaces
USB 3.0/2.0
‡
∆
USB 2.0
‡
∆
COM 1 / 2
∆
GPIO
∆
Audio
∆
PCIe
∆
SMBus
∆
LPC
∆
SPI
∆
I2C
∆
Control
∆
One host port
Six host ports
Two-wire, CMOS levels. 16C550 compatible.
4 lines multiplexed with the SD card interface
High Definition Audio (HDA)/digital audio interface with
support for multiple codecs.
Three PCIe (Gen 2) lanes
1 MHz
33 MHz
Supports alternative BIOS flash device only.
Fast mode multi-master I²C Bus
Wake, reset, and power
Airflow
Altitude
¤
Thermal Shock
Humidity
Vibration, Sinusoidal
Sweep
¥
Vibration, Random
¥
Mechanical Shock
¥
Operating
Storage
To 4,570m (15,000 ft.)
To 12,000m (40,000 ft.)
5°C/min. over operating temperature
Less than 95%, noncondensing
MIL-STD-202G, Method 204, Modified Condition A: 2g
constant acceleration from 5 to 500 Hz, 20 min. per axis
MIL-STD-202G, Method 214A, Condition A: 5.35g rms,
5 min. per axis
MIL-STD-202G, Method 213B, Condition G: 20g half-sine,
11 ms duration per axis
Software
BIOS
Sleep Mode
Operating Systems
AMI Aptio UEFI BIOS with OEM enhancements.
Field reprogrammable.
ACPI 3.0. Support for S3 suspend state.
Compatible with most x86 operating systems including
Windows, Windows Embedded, Linux, and VxWorks
Memory
System RAM
2 GB or 4 GB of soldered-on DDR3L SDRAM. 1333 MT/s.
§ Represents operation at +25°C and +12V supply running Windows XP with LVDS display, SATA,
GbE, COM, and USB keyboard/mouse. Typical power computed as the mean value of Idle and
Maximum power specifications. Maximum power measured with 95% CPU utilization.
† IEEE 1588 Precision Time Protocol (PTP) compatible
‡ Bootable storage device
∆ Available via Type 10 I/O connector
¤ Extended altitude specifications available upon request
¥ MIL-STD-202G shock and vibe levels are used to illustrate the extreme ruggedness of this
product in general. Testing to higher levels and/or different types of shock or vibration methods can
be accommodated per the specific requirements of the application. Contact a VersaLogic Sales
Engineer for further information.
Specifications are subject to change without notification. Intel and Atom are trademarks of Intel
Corp. microSD is a trademark of SD-3C, LLC. Embedded Processing Unit is a trademark of
VersaLogic Corp. All other trademarks are the property of their respective owners.
Tailor COMm-33 to Your Exact Requirements
Customization options are available in quantities as low as
100 pieces.
Conformal Coating
Custom Testing
Custom Labeling
BIOS Modifications
Software and Drivers
Revision Locks
Environmental Screening
Application-Specific Testing
And more –
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VL-COMm-33
Product Data Sheet
COM Express Mini CPU Module
Ordering Information
Model
VL-COMm-33EA
VL-COMm-33EB
VL-COMm-33ED
Processor CPU Cores
Atom E3815
1
Atom E3827
2
Atom E3845
4
Speed
1.46 GHz
1.75 GHz
1.91 GHz
RAM
2 GB
2 GB
4 GB
eMMC
Flash
None
4 GB
8 GB
Bay Trail Computer
A Complete Embedded Processing Solution
– Available Off-the-Shelf! –
Accessories
Part Number
Hardware
VL-HDW-410A
Description
55 x 84 x 6 mm Heat plate to mount to VL-COMM-33 module.
Includes thermal interface material, mounting screws (4), and thermal
compound paste (Arctic Silver).
55 x 84 x 6 mm Heat plate that mounts to VL-COMM-33 module.
Includes thermal interface material. Does not include thermal paste or
mounting screws.
55 x 84 x 15.5 mm Passive heat sink. Mounts to HDW-410 heat plate.
12V Cooling fan for optional use with HDW-406 heat sink.
75 x 84 x 2 mm Mounting adaptor plate, flat. Simplifies installation in
many situations. Attaches to HDW-410 heat plate.
Heat pipe connector plate. Mounts to HDW-410 heat plate.
Thermal compound paste (Arctic Alumina)
VL-HDW-410B
VL-HDW-406
VL-HDW-411
VL-HDW-405
VL-HDW-408
VL-HDW-401
Based on the VL-COMm-33, the Hawk is an extremely small
and rugged complete embedded computer—available fully
assembled and tested off-the-shelf! Roughly the size of a credit
card and less than one inch thick, the Hawk is the embedded
industry’s smallest, lightest, ultra-rugged embedded x86
computer. This complete embedded computer is designed to
withstand extreme temperature, impact, and vibration.
CPU
Model
Processor Cores Speed
VL-EPU-3310-EAP Atom E3815
1
1.46 GHz
VL-EPU-3310-EBP Atom E3827
2
1.75 GHz
VL-EPU-3310-EDP Atom E3845
4
1.91 GHz
eMMC
Flash
None
4 GB
8 GB
Call VersaLogic Sales at (503) 747-2261 for more information!
RAM
2 GB
2 GB
4 GB
Cooling
Heat plate
Heat plate
Heat plate
Highlights
A complete x86 embedded computer
-40° to +85°C Operating Temperature
Extremely small (55 x 84 x 22 mm)
Shock & vibration per MIL-STD-202G
4th Generation Intel
®
Atom™ processor (“Bay Trail”)
- E3845 (quad core) or
- E3827 (dual core) or
- E3815 (single core)
Up to 4GB DDR3L soldered-on RAM
Gigabit Ethernet
LVDS video output
Mini PCIe Socket / with mSATA support
USB 2.0 ports
Serial I/O
Take the Risk out of Embedded Computing
Whether it’s selecting the optimum solution for your application,
sharing expertise during development, or on-time delivery of
defect-free products, VersaLogic is here to make sure your
project goes smoothly from initial concept through the extended
life of your program. Contact us today to learn more.
SATA
Wide Input Voltage Range - 8 to 17 volts
Fanless operation
For more information, visit: www.versalogic.com/hawk
ISO 9001:2008 Certi ed
7/27/16
12100 SW Tualatin Rd., Tualatin, OR 97062 | (503) 747-2261 | Info@VersaLogic.com | www.VersaLogic.com
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