Digital Output Ground Voltage (OGND) ........ –0.3V to 1V
Analog Input Voltage (Note 3) ...... –0.3V to (V
DD
+ 0.3V)
Digital Input Voltage..................... –0.3V to (V
DD
+ 0.3V)
Digital Output Voltage ................ –0.3V to (OV
DD
+ 0.3V)
Power Dissipation .............................................1500mW
Operating Temperature Range
LTC2222C, LTC2223C .............................. 0°C to 70°C
LTC2222I, LTC2223I ............................–40°C to 85°C
Storage Temperature Range .................. –65°C to 125°C
ORDER INFORMATION
LEAD FREE FINISH
LTC2222CUK#PBF
LTC2222IUK#PBF
LTC2223CUK#PBF
LTC2223IUK#PBF
TAPE AND REEL
LTC2222CUK#TRPBF
LTC2222IUK#TRPBF
LTC2223CUK#TRPBF
LTC2223IUK#TRPBF
PART MARKING*
LTC2222UK
LTC2222UK
LTC2223UK
LTC2223UK
PACKAGE DESCRIPTION
48-Lead 7mm
×
7mm Plastic DFN
48-Lead 7mm
×
7mm Plastic DFN
48-Lead 7mm
×
7mm Plastic DFN
48-Lead 7mm
×
7mm Plastic DFN
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
0°C to 70°C
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
GND 13
V
DD
14
GND 15
ENC
+
16
ENC
–
17
SHDN 18
OE
19
CLOCKOUT 20
DO 21
OGND 22
OV
DD
23
D1 24
22223fb
2
LTC2222/LTC2223
ELECTRICAL CHARACTERISTICS
PARAMETER
Resolution (No Missing Codes)
Integral Linearity Error (Note 5)
Differential Linearity Error
Integral Linearity Error (Note 5)
Differential Linearity Error
Offset Error (Note 6)
Gain Error
Offset Drift
Full-Scale Drift
Transition Noise
Internal Reference
External Reference
SENSE = 1V
External Reference
Differential Analog Input
Differential Analog Input
Single-Ended Analog Input
Single-Ended Analog Input
l
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C.
LTC2222
CONDITIONS
l
l
l
LTC2223
MAX
1.3
1
MIN
12
–1.1
–0.8
TYP
±0.3
±0.2
±1
±0.2
30
2.5
–30
–2.5
±3
±0.5
±10
±30
±15
0.5
30
2.5
MAX
1.1
0.8
UNITS
Bits
LSB
LSB
LSB
LSB
mV
%FS
μV/C
ppm/C
ppm/C
LSB
RMS
MIN
12
–1.3
–1
TYP
±0.3
±0.2
±1
±0.2
–30
–2.5
±3
±0.5
±10
±30
±15
0.5
ANALOG INPUT
SYMBOL
V
IN
V
IN
,
CM
I
IN
I
SENSE
I
MODE
t
AP
t
JITTER
CMRR
PARAMETER
The
l
denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at T
A
= 25°C.
(Note 4)
CONDITIONS
3.1V < V
DD
< 3.5V
Differential Input
Single-Ended Input (Note 7)
0 < A
IN+
, A
IN–
< V
DD
0V < SENSE < 1V
Figure 8 Test Circuit
l
l
l
l
l
M
IN
1
0.5
–1
–1
TYP
±0.5 to ±1
1.6
1.6
MAX
1.9
2.1
1
1
UNITS
V
V
V
μA
μA
μA
MHz
ns
ps
RMS
dB
Analog Input Range (A
IN+
– A
IN–
)
Analog Input Common Mode (A
IN+
+ A
IN–
)/2
Analog Input Leakage Current
SENSE Input Leakage
MODE Pin Pull-Down Current to GND
Full Power Bandwidth
Sample and Hold Acquisition Delay Time
Sample and Hold Acquisition Delay Time Jitter
Analog Input Common Mode Rejection Ratio
10
775
0
0.15
80
22223fb
3
LTC2222/LTC2223
DYNAMIC ACCURACY
SYMBOL
SNR
PARAMETER
Signal-to-Noise Ratio
The
l
denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at T
A
= 25°C.
A
IN
= –1dBFS. (Note 4)
LTC2222
CONDITIONS
30MHz Input (1V Range)
30MHz Input (2V Range)
70MHz Input (1V Range)
70MHz Input (2V Range)
140MHz Input (1V Range)
140MHz Input (2V Range)
250MHz Input (1V Range)
250MHz Input (2V Range)
l
LTC2223
MAX
MIN
67.5
TYP
63.6
68.5
63.5
68.4
63.5
68.0
63.0
67.3
73
84
84
84
84
84
81
80
75
90
90
90
90
90
90
90
90
67
63.6
68.5
63.6
68.3
81
MAX
UNITS
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dBc
MIN
67
TYP
63.5
68.4
63.4
68.3
63.2
67.9
62.7
67.0
SFDR
Spurious Free Dynamic Range
30MHz Input (1V Range)
30MHz Input (2V Range)
70MHz Input (1V Range)
70MHz Input (2V Range)
140MHz Input (1V Range)
140MHz Input (2V Range)
250MHz Input (1V Range)
250MHz Input (2V Range)
l
72
84
84
84
84
81
81
77
77
90
90
90
90
90
90
90
90
SFDR
Spurious Free Dynamic Range
4th Harmonic or Higher
30MHz Input (1V Range)
30MHz Input (2V Range)
70MHz Input (1V Range)
70MHz Input (2V Range)
140MHz Input (1V Range)
140MHz Input (2V Range)
250MHz Input (1V Range)
250MHz Input (2V Range)
S/(N+D)
Signal-to-Noise
Plus Distortion Ratio
30MHz Input (1V Range)
30MHz Input (2V Range)
70MHz Input (1V Range)
70MHz Input (2V Range)
l
66.5
63.5
68.4
63.5
68.2
81
IMD
Intermodulation Distortion
f
IN1
= 138MHz, f
IN2
= 140MHz
INTERNAL REFERENCE CHARACTERISTICS
PARAMETER
V
CM
Output Voltage
V
CM
Output Tempco
V
CM
Line Regulation
V
CM
Output Resistance
3.1V < V
DD
< 3.5V
–1mA < I
OUT
< 1mA
CONDITIONS
I
OUT
= 0
(Note 4)
MIN
1.575
TYP
1.600
±25
3
4
MAX
1.625
UNITS
V
ppm/°C
mV/V
Ω
22223fb
4
LTC2222/LTC2223
DIGITAL INPUTS AND DIGITAL OUTPUTS
SYMBOL
V
ID
V
ICM
R
IN
C
IN
V
IH
V
IL
I
IN
C
IN
PARAMETER
Differential Input Voltage
Common Mode Input Voltage
Input Resistance
Input Capacitance
High Level Input Voltage
Low Level Input Voltage
Input Current
Input Capacitance
(Note 7)
V
DD
= 3.3V
V
DD
= 3.3V
V
IN
= 0V to V
DD
(Note 7)
l
l
l
The
l
denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at T
A
= 25°C.
(Note 4)
CONDITIONS
l
MIN
0.2
1.1
TYP
MAX
UNITS
V
Encode Inputs (ENC
+
, ENC
–
)
Internally Set
Externally Set (Note 7)
1.6
1.6
6
3
2
0.8
–10
3
10
V
V
kΩ
pF
V
V
μA
pF
l
2.5
Logic Inputs (OE, SHDN)
Logic Outputs
OV
DD
= 3.3V
C
OZ
I
SOURCE
I
SINK
V
OH
V
OL
Hi-Z Output Capacitance
Output Source Current
Output Sink Current
High Level Output Voltage
Low Level Output Voltage
OE
= High (Note 7)
V
OUT
= 0V
V
OUT
= 3.3V
I
O
= –10μA
I
O
= –200μA
I
O
= 10μA
I
O
= 1.6mA
I
O
= –200μA
I
O
= 1.6mA
I
O
= –200μA
I
O
= 1.6mA
l
l
3
50
50
3.1
3.295
3.29
0.005
0.09
2.49
0.09
1.79
0.09
0.4
pF
mA
mA
V
V
V
V
V
V
V
V
OV
DD
= 2.5V
V
OH
V
OL
V
OH
V
OL
High Level Output Voltage
Low Level Output Voltage
High Level Output Voltage
Low Level Output Voltage
OV
DD
= 1.8V
POWER REQUIREMENTS
SYMBOL
V
DD
OV
DD
IV
DD
P
DISS
P
SHDN
P
NAP
PARAMETER
Analog Supply Voltage
Output Supply Voltage
Analog Supply Current
Power Dissipation
Shutdown Power
Nap Mode Power
The
l
denotes the specifications which apply over the full operating temperature
When designing a low-power electronic product, I need to find a microcontroller with a frequency of more than 50MHZ and less than 100 pins that can run the OS-II system. According to the accreditation...
Meng ChuanliangAbstractShielding is an important method to suppress interference. Good grounding is an important measure to ensure the stable operation of industrial control system and eliminate inter...
The collection phase of the NXP LPC54100 experience collection contest ended on May 24th. The internal voting phase begins now and ends this Thursday (May 28th, 2015). While the official awards ceremo...
I use 2407dsp to make a hardware circuit for video signal processing, and I need to use rs422 serial port to connect to the camera. Thanks everyone! ! ! [:$]...
As a new generation of microcontroller, ADμC812 has powerful functions and broader application prospects than previous single-chip microcomputers. In actual applications, it is found that the chip its...
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
Sailing is gaining more and more attention. How to use modern technology to assist training and improve competition results is particularly important. Considering the real-time data collection in t...[Details]
As cellular phones become more advanced, the power consumption of the system during operation and the power consumption during standby are also increasing. Therefore, the power management design of...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
Product series: PB-B-RS232/485 interface (hereinafter sometimes referred to as "interface") is a product in the PROFIBUS bus bridge series.
The main purpose of the bridge series ...[Details]
1 Introduction
Building Automation System (BAS) is a distributed monitoring system (DCS) designed according to distributed information and control theory. It is the result of the mutual de...[Details]
Since the No. 4 blast furnace of Handan Iron and Steel was put into operation in 1993, its external equipment has been seriously aged, and the original PLC control system TDC3000 of the hot blast furn...[Details]
1 Introduction
With the development of control, computer, communication, network technology, etc., a new control technology, namely fieldbus, has emerged in the field of industrial control...[Details]
introduction
MEMS is a high-tech that has flourished on the basis of integrated circuit production technology and dedicated micro-electromechanical processing methods. Pressure sensors develop...[Details]
Only a small number of LED manufacturers can produce high-quality LEDs. For applications that are only used for simple indication, low-quality LEDs are sufficient. However, high-quality LEDs must...[Details]
System Overview
The system consists of a signal preprocessing circuit, a single-chip computer AT89C2051, a systematic LED display module, a serial port data storage circuit and system software...[Details]
1. Introduction
With the increasing popularity of fully automatic washing machines, consumers have higher and higher requirements for their environmenta...[Details]
One in five car failures are caused by batteries, a problem that will become more serious in the coming years as electric-by-wire, start/stop engine management and hybrid (electric/gas) vehicles be...[Details]
Currently, the commonly used solar cell technologies include monocrystalline silicon solar cells and polycrystalline silicon thin-film solar cells. Production process: Monocrystalline silicon solar...[Details]
The production process of lithium batteries does not mention the previous processes such as material preparation, winding, liquid injection, and packaging, but only talks about the final formation ...[Details]
MCU
京公网安备 11010802033920号
EEWORLD
