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ZVN0120A

Description
N-CHANNEL ENHANCEMENT MODE VERTICAL DMOS FET
CategoryDiscrete semiconductor    The transistor   
File Size15KB,1 Pages
ManufacturerZetex Semiconductors
Websitehttp://www.zetex.com/
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ZVN0120A Overview

N-CHANNEL ENHANCEMENT MODE VERTICAL DMOS FET

ZVN0120A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZetex Semiconductors
package instructionCYLINDRICAL, O-PBCY-W3
Reach Compliance Codeunknow
ECCN codeEAR99
ConfigurationSINGLE
Minimum drain-source breakdown voltage200 V
Maximum drain current (Abs) (ID)0.16 A
Maximum drain current (ID)0.16 A
Maximum drain-source on-resistance16 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
Maximum feedback capacitance (Crss)7 pF
JEDEC-95 codeTO-92
JESD-30 codeO-PBCY-W3
JESD-609 codee0
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature200 °C
Package body materialPLASTIC/EPOXY
Package shapeROUND
Package formCYLINDRICAL
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)0.7 W
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formWIRE
Terminal locationBOTTOM
transistor applicationsSWITCHING
Transistor component materialsSILICON
N-CHANNEL ENHANCEMENT
MODE VERTICAL DMOS FET
ZVN0120A
ISSUE 2 – MARCH 94
FEATURES
* 200 Volt V
DS
* R
DS(on)
=16Ω
APPLICATIONS
* Telephone handsets
REFER TO ZVN0124A FOR GRAPHS
D
G
S
E-Line
TO92 Compatible
SYMBOL
V
DS
I
D
I
DM
V
GS
P
tot
T
j
:T
stg
VALUE
200
160
2
±
20
700
-55 to +150
UNIT
V
mA
A
V
mW
°C
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
Drain-Source Voltage
Continuous Drain Current at T
amb
=25°C
Pulsed Drain Current
Gate Source Voltage
Power Dissipation at T
amb
=25°C
Operating and Storage Temperature Range
ELECTRICAL CHARACTERISTICS (at T
amb
= 25°C unless otherwise stated).
PARAMETER
Drain-Source Breakdown
Voltage
Gate-Source Threshold
Voltage
Gate-Body Leakage
Zero Gate Voltage Drain
Current
On-State Drain Current(1)
Static Drain-Source On-State
Resistance (1)
Forward Transconductance
(1)(2)
Input Capacitance (2)
Common Source Output
Capacitance (2)
Reverse Transfer
Capacitance (2)
Turn-On Delay Time (2)(3)
Rise Time (2)(3)
Turn-Off Delay Time (2)(3)
Fall Time (2)(3)
SYMBOL MIN.
BV
DSS
V
GS(th)
I
GSS
I
DSS
200
1
3
20
10
100
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
100
85
20
7
7
8
16
8
500
16
MAX.
UNIT CONDITIONS.
V
V
nA
µA
µA
mA
mS
pF
pF
pF
ns
ns
ns
ns
(1) Measured under pulsed conditions. Width=300µs. Duty cycle
≤2%
V
DD
≈25V,
I
D
=250mA
V
DS
=25 V, V
GS
=0V, f=1MHz
I
D
=1mA, V
GS
=0V
ID=1mA, V
DS
= V
GS
V
GS
=± 20V, V
DS
=0V
V
DS
=200 V, V
GS
=0
V
DS
=160 V, V
GS
=0V,
T=125°C
(2)
V
DS
=25 V, V
GS
=10V
V
GS
=10V,I
D
=250mA
V
DS
=25V,I
D
=250mA
3-349
Sample test.
(
2
)

ZVN0120A Related Products

ZVN0120A
Description N-CHANNEL ENHANCEMENT MODE VERTICAL DMOS FET
Is it Rohs certified? incompatible
Maker Zetex Semiconductors
package instruction CYLINDRICAL, O-PBCY-W3
Reach Compliance Code unknow
ECCN code EAR99
Configuration SINGLE
Minimum drain-source breakdown voltage 200 V
Maximum drain current (Abs) (ID) 0.16 A
Maximum drain current (ID) 0.16 A
Maximum drain-source on-resistance 16 Ω
FET technology METAL-OXIDE SEMICONDUCTOR
Maximum feedback capacitance (Crss) 7 pF
JEDEC-95 code TO-92
JESD-30 code O-PBCY-W3
JESD-609 code e0
Number of components 1
Number of terminals 3
Operating mode ENHANCEMENT MODE
Maximum operating temperature 200 °C
Package body material PLASTIC/EPOXY
Package shape ROUND
Package form CYLINDRICAL
Polarity/channel type N-CHANNEL
Maximum power dissipation(Abs) 0.7 W
Certification status Not Qualified
surface mount NO
Terminal surface Tin/Lead (Sn/Pb)
Terminal form WIRE
Terminal location BOTTOM
transistor applications SWITCHING
Transistor component materials SILICON

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