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74HCT1G08GW,125

Description
IC GATE AND 1CH 2-INP 5TSSOP
Categorylogic    logic   
File Size171KB,12 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
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74HCT1G08GW,125 Overview

IC GATE AND 1CH 2-INP 5TSSOP

74HCT1G08GW,125 Parametric

Parameter NameAttribute value
Brand NameNexperia
MakerNexperia
Parts packaging codeTSSOP
package instructionTSSOP,
Contacts5
Manufacturer packaging codeSOT353-1
Reach Compliance Codecompliant
Factory Lead Time8 weeks
Samacsys Description74HC(T)1G08 - 2-input AND gate@en-us
seriesHCT
JESD-30 codeR-PDSO-G5
JESD-609 codee3
length2 mm
Logic integrated circuit typeAND GATE
Humidity sensitivity level1
Number of functions1
Number of entries2
Number of terminals5
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)27 ns
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width1.25 mm
74HC1G08; 74HCT1G08
2-input AND gate
Rev. 5 — 14 March 2018
Product data sheet
1
General description
The 74HC1G08; 74HCT1G08 is a single 2-input AND gate. Inputs include clamp diodes.
This enables the use of current limiting resistors to interface inputs to voltages in excess
of V
CC
.
2
Features
Input levels:
For 74HC1G08: CMOS level
For 74HCT1G08: TTL level
Symmetrical output impedance
High noise immunity
Low power dissipation
Balanced propagation delays
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from −40 °C to +85 °C and −40 °C to +125 °C
3
Ordering information
Package
Temperature range Name
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic surface-mounted package; 5 leads
Version
SOT353-1
-40 °C to +125 °C
TSSOP5
Table 1. Ordering information
Type number
74HC1G08GW
74HCT1G08GW
74HC1G08GV
74HCT1G08GV
-40 °C to +125 °C
SC-74A
SOT753

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Description IC GATE AND 1CH 2-INP 5TSSOP IC GATE AND 1CH 2-INP 5TSOP 74HC(T)1G08 - 2-input AND gate TSSOP 5-Pin 74HC(T)1G08 - 2-input AND gate TSSOP 5-Pin 74HC(T)1G08 - 2-input AND gate TSSOP 5-Pin 74HC(T)1G08 - 2-input AND gate TSSOP 5-Pin 74HC(T)1G08 - 2-input AND gate TSSOP 5-Pin
Brand Name Nexperia Nexperia Nexperia Nexperia Nexperia Nexperia Nexperia
Maker Nexperia Nexperia Nexperia Nexperia Nexperia Nexperia Nexperia
Parts packaging code TSSOP TSOP TSSOP TSSOP TSSOP TSSOP TSSOP
package instruction TSSOP, TSOP, TSSOP, TSSOP, TSSOP, TSSOP-5 TSSOP,
Contacts 5 5 5 5 5 5 5
Manufacturer packaging code SOT353-1 SOT753 SOT353-1 SOT353-1 SOT353-1 SOT353-1 SOT353-1
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
series HCT HCT HC/UH HC/UH HCT HCT HCT
JESD-30 code R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5
length 2 mm 2.9 mm 2.05 mm 2.05 mm 2.05 mm 2.05 mm 2.05 mm
Logic integrated circuit type AND GATE AND GATE AND GATE AND GATE AND GATE AND GATE AND GATE
Number of functions 1 1 1 1 1 1 1
Number of entries 2 2 2 2 2 2 2
Number of terminals 5 5 5 5 5 5 5
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSOP TSSOP TSSOP TSSOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd) 27 ns 27 ns 135 ns 135 ns 27 ns 27 ns 27 ns
Maximum seat height 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 6 V 6 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 2 V 2 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.95 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 1.25 mm 1.5 mm 1.25 mm 1.25 mm 1.25 mm 1.25 mm 1.25 mm
Peak Reflow Temperature (Celsius) 260 260 - - NOT SPECIFIED 260 -
Maximum time at peak reflow temperature 30 30 - - NOT SPECIFIED 30 -

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