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MR2535L
Overvoltage
Transient Suppressors
Medium Current
Designed for applications requiring a low voltage rectifier with
reverse avalanche characteristics for use as reverse power transient
suppressors. Developed to suppress transients in the automotive
system, these devices operate in the forward mode as standard
rectifiers or reverse mode as power avalanche rectifier and will protect
electronic equipment from overvoltage conditions.
Features
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•
•
•
•
•
Avalanche Voltage 24 to 32 V
High Power Capability
Economical
Increased Capacity by Parallel Operation
Pb−Free Packages are Available*
MICRODE AXIAL
CASE 194
STYLE 1
Mechanical Characteristics:
•
Case: Epoxy, Molded
•
Weight: 2.5 Grams (Approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•
Maximum Lead Temperature for Soldering Purposes:
350°C 3/8″ from Case for 10 Seconds at 5 lbs. Tension
•
Polarity: Indicated by Diode Symbol or Cathode Band
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Rating
DC Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Repetitive Peak Reverse Surge Current
(Time Constant = 10 ms, Duty Cycle
≤
1%,
T
C
= 25°C)
Average Rectified Forward Current
(Single Phase, Resistive Load, 60 Hz,
T
C
= 125°C) (Figure 4)
Non−Repetitive Peak Surge Current Surge
Supplied at Rated Load Conditions
Halfwave, Single Phase
Operating and Storage Junction
Temperature Range
Symbol
V
RRM
V
RWM
V
R
I
RSM
Value
20
Unit
V
MARKING DIAGRAM
MR2535LAYYWW
G
G
62
A
A
YY
WW
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
I
O
6.0
A
ORDERING INFORMATION
I
FSM
600
A
Device
MR2535L
T
J
, T
stg
−65 to +175
°C
MR2535LG
MR2535LRL
MR2535LRLG
Package
Microde Axial
Microde Axial
(Pb−Free)
Microde Axial
Microde Axial
(Pb−Free)
Shipping
†
1000 Units/Box
1000 Units/Box
800/Tape & Reel
800/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MR2535L/D
1
June, 2006 − Rev. 7
MR2535L
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead @ Both Leads to Heatsink,
Equal Length
Thermal Resistance Junction−to−Case
Lead Length
1/4″
3/8″
1/2″
Symbol
R
qJL
Max
7.5
10
13
0.8
(Note 1)
Unit
°C/W
R
qJC
°C/W
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted)
Characteristic
Instantaneous Forward Voltage (Note 2) (i
F
= 100 A, T
C
= 25°C)
Reverse Current (V
R
= 20 Vdc, T
C
= 25°C)
Breakdown Voltage (Note 2) (I
R
= 100 mAdc, T
C
= 25°C)
Breakdown Voltage (Note 2) (I
R
= 90 A, T
C
= 150°C, PW = 80
ms)
Breakdown Voltage Temperature Coefficient
Forward Voltage Temperature Coefficient @ I
F
= 10 mA
1. Typical.
2. Pulse Test: Pulse Width
≤
300
ms,
Duty Cycle
≤
2%.
IF, INSTANTANEOUS FORWARD CURRENT (A)
Symbol
v
F
I
R
V
(BR)
V
(BR)
V
(BR)TC
V
FTC
Min
−
−
24
−
−
−
Max
1.1
200
32
40
0.096
(Note 1)
2
(Note 1)
Unit
V
nAdc
V
V
%/°C
mV/°C
1000
1000
IR, REVERSE CURRENT (nA)
V
R
= 20 V
100
100
T
J
= 125°C
75°C
10
25°C
10
1
0.1
0.01
1
600
700
800
900
1000
V
F
, INSTANTANEOUS FORWARD VOLTAGE (mV)
25
50
75
100
125
150
T
J
, JUNCTION TEMPERATURE (°C)
Figure 1. Typical Forward Voltage
IF(avg), AVERAGE FORWARD CURRENT (A)
Figure 2. Typical Reverse Current versus
Junction Temperature
25
Both leads to heatsink with equal length
I
F(peak)
/I
F(avg)
=
p
4000
3500
C, CAPACITANCE (pF)
3000
2500
2000
1500
1000
0
5
10
15
20
25
V
R
, DC BLOCKING VOLTAGE (V)
T
J
= 25°C
20
15
10 mm
L = 6.25 mm
10
15 mm
5
0
20
40
60
80
100
120
140
160
180
T
L
, LEAD TEMPERATURE (°C)
Figure 3. Typical Capacitance
Figure 4. Maximum Current Ratings
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2
MR2535L
1
r(t), TRANSIENT THERMAL
RESISTANCE (NORMALIZED)
R
q
JL, THERMAL RESISTANCE
JUNCTION TO LEAD (
°
C/W)
45
40
35
30
25
20
15
10
5
0
0.001
0.01
0.1
t, TIME (S)
1
10
100
0
5
Both leads to heatsink (equal length)
10
15
20
25
Typical
Typical
Single to heatsink
Maximum
Maximum
0.1
L = 6.25 mm, both leads to heatsink (equal length)
0.01
LEAD LENGTH (mm)
Figure 5. Thermal Response
Figure 6. Steady State Thermal Resistance
IRSM, PEAK REVERSE CURRENT (A)
100
T
J
= 25°C
10000
PRSM, PEAK REVERSE POWER (W)
T
J
= 25°C
1000
10
1
10
100
1000
t, TIME CONSTANT (mS)
100
1
10
100
1000
t, TIME CONSTANT (mS)
Figure 7. Maximum Peak Reverse Current
Figure 8. Maximum Peak Reverse Power
1000
W RSM, PEAK REVERSE ENERGY (J)
PEAK REVERSE POWER (W)
2400
2000
1600
1200
800
400
0
1
10
100
1000
25
50
75
100
125
150
t, TIME CONSTANT (mS)
T
L
, LEAD TEMPERATURE (°C)
Time Constant = 10 mS
T
J
= 25°C
100
10
Time Constant = 100 mS
1
Figure 9. Maximum Reverse Energy
Figure 10. Reverse Power Derating
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3
MR2535L
1.20
1.18
V Z(Irsm) /V Z(100 mA)
1.16
1.14
1.12
1.10
1.08
1.06
1.04
1.02
1.00
10 20
30
40
50
60
70
80
90
100 110 120
I
RSM
, REPETITIVE PEAK REVERSE SURGE CURRENT (A)
PW = 80
mS,
T
L
= 25°C
Figure 11. Typical Clamping Factor
2
W
dl/dt Limitation
100
mH
0 − 150 V
50 mF
MR2535L
Figure 12. Load Dump Test Circuit
100
dl/dt < 1 A/ms
80
60
(%)
40
20
0
0
0.1
t (50%)
t (37%)
0.2
t (10%)
t, TIME (S)
0.3
0.5
0.4
t (37%) = Time Constant
t (50%) = 0.7 t (37%)
t (10%) = 2.3 t (37%)
Figure 13. Load Dump Pulse Current
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4
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