S6E1A12B0AGP20000 datasheet, PDF

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S6E1A12B0AGP20000: DescriptionIC MCU 32BIT 88KB FLASH 32LQFP; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，98 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

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S6E1A12B0AGP20000 Overview

IC MCU 32BIT 88KB FLASH 32LQFP

S6E1A12B0AGP20000 Parametric

Parameter Name	Attribute value
core processor	ARM® Cortex®-M0+
core size	32-bit
speed	40MHz
Connectivity	CSIO，I²C，LINbus，UART/USART
Peripheral	DMA，LVD，POR，PWM，WDT
Number of I/Os	23
Program storage capacity	88KB（88K x 8）
Program memory type	flash memory
EEPROM capacity	-
RAM capacity	6K x 8
Voltage - Power Supply (Vcc/Vdd)	2.7 V ~ 5.5 V
data converter	A/D 5x12b
Oscillator type	internal
Operating temperature	-40°C ~ 105°C（TA）
Package/casing	32-LQFP
Supplier device packaging	32-LQFP（7x7）

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The following document contains information on Cypress products. The document has the

ordering part numbering with the prefix “S”. Cypress will offer these products to new and existing

customers with the updated ordering part number (updated last digit).

How to Check the Ordering Part Number

1. Go to

www.cypress.com/pcn.

2. Enter the keyword (for example, ordering part number) in the

SEARCH PCNS

field and click

Apply.

3. Click the corresponding title from the search results.

4. Download the Affected Parts List file, which has details of all changes

For More Information

Please contact your local sales office for additional information about Cypress products and

solutions.

About Cypress

Cypress is the leader in advanced embedded system solutions for the world's most innovative

automotive, industrial, smart home appliances, consumer electronics and medical products.

Cypress' microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable,

high-performance memories help engineers design differentiated products and get them to market

first. Cypress is committed to providing customers with the best support and development

resources on the planet enabling them to disrupt markets by creating new product categories in

record time. To learn more, go to

www.cypress.com.

S6E1A Series

Contents

1. Product Lineup .................................................................................................................................................................. 6

2. Packages ........................................................................................................................................................................... 7

3. Pin Assignment ................................................................................................................................................................. 8

4. Pin Descriptions .............................................................................................................................................................. 13

5. I/O Circuit Type................................................................................................................................................................ 24

6. Handling Precautions ..................................................................................................................................................... 30

6.1

Precautions for Product Design ................................................................................................................................... 30

6.2

Precautions for Package Mounting .............................................................................................................................. 31

6.3

Precautions for Use Environment ................................................................................................................................ 33

7. Handling Devices ............................................................................................................................................................ 34

8. Block Diagram ................................................................................................................................................................. 37

9. Memory Size .................................................................................................................................................................... 38

10. Memory Map .................................................................................................................................................................... 38

11. Pin Status in Each CPU State ........................................................................................................................................ 41

12. Electrical Characteristics ............................................................................................................................................... 45

12.1 Absolute Maximum Ratings ......................................................................................................................................... 45

12.2 Recommended Operating Conditions.......................................................................................................................... 46

12.3 DC Characteristics....................................................................................................................................................... 47

12.3.1 Current Rating .............................................................................................................................................................. 47

12.3.2 Pin Characteristics ....................................................................................................................................................... 50

12.4 AC Characteristics ....................................................................................................................................................... 51

12.4.1 Main Clock Input Characteristics .................................................................................................................................. 51

12.4.2 Sub Clock Input Characteristics ................................................................................................................................... 52

12.4.3 Built-in CR Oscillation Characteristics .......................................................................................................................... 53

12.4.4 Operating Conditions of Main PLL (In the case of using the main clock as the input clock of the PLL) ....................... 54

12.4.5 Operating Conditions of Main PLL

(In the case of using the built-in high-speed CR clock as the input clock of the main PLL).......................................... 54

12.4.6 Reset Input Characteristics .......................................................................................................................................... 55

12.4.7 Power-on Reset Timing................................................................................................................................................ 55

12.4.8 Base Timer Input Timing .............................................................................................................................................. 56

12.4.9 CSIO/UART Timing ...................................................................................................................................................... 57

12.4.10 External Input Timing ................................................................................................................................................ 73

12.4.11 QPRC Timing ........................................................................................................................................................... 74

12.4.12 I

C Timing ................................................................................................................................................................. 76

12.4.13 SW-DP Timing .......................................................................................................................................................... 77

12.5 12-bit A/D Converter .................................................................................................................................................... 78

12.6 Low-voltage Detection Characteristics ........................................................................................................................ 81

12.6.1 Low-voltage Detection Reset ....................................................................................................................................... 81

12.6.2 Low-voltage Detection Interrupt ................................................................................................................................... 82

12.7 Flash Memory Write/Erase Characteristics ................................................................................................................. 83

12.8 Return Time from Low-Power Consumption Mode ...................................................................................................... 84

12.8.1 Return Factor: Interrupt ................................................................................................................................................ 84

12.8.2 Return Factor: Reset .................................................................................................................................................... 86

13. Ordering Information ...................................................................................................................................................... 88

14. Package Dimensions ...................................................................................................................................................... 89

15. Major Changes ................................................................................................................................................................ 94

Document Number: 002-05091 Rev.*C

Page 4 of 97

S6E1A12B0AGP20000 Related Products

	S6E1A12B0AGP20000	S6E1A11C0AGN2B000	S6E1A12C0AGN2B000
Description	IC MCU 32BIT 88KB FLASH 32LQFP	IC MCU 32BIT 56KB FLASH	IC MCU 32BIT 88KB FLASH
core processor	ARM® Cortex®-M0+	ARM® Cortex®-M0+	ARM® Cortex®-M0+
core size	32-bit	32-bit	32-bit
speed	40MHz	40MHz	40MHz
Connectivity	CSIO，I²C，LINbus，UART/USART	CSIO，I²C，LINbus，UART/USART	CSIO，I²C，LINbus，UART/USART
Peripheral	DMA，LVD，POR，PWM，WDT	DMA，LVD，POR，PWM，WDT	DMA，LVD，POR，PWM，WDT
Number of I/Os	23	37	37
Program storage capacity	88KB（88K x 8）	56KB（56K x 8）	88KB（88K x 8）
Program memory type	flash memory	flash memory	flash memory
RAM capacity	6K x 8	6K x 8	6K x 8
Voltage - Power Supply (Vcc/Vdd)	2.7 V ~ 5.5 V	2.7 V ~ 5.5 V	2.7 V ~ 5.5 V
data converter	A/D 5x12b	A/D 8x12b	A/D 8x12b
Oscillator type	internal	internal	internal
Operating temperature	-40°C ~ 105°C（TA）	-40°C ~ 105°C（TA）	-40°C ~ 105°C（TA）

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