EEWORLDEEWORLDEEWORLD

Part Number

Search

3MIC 3M661X DLF 3MIL 4 IN

Description
LAPPING FILM DIAMOND 4"
CategoryTools and equipment   
File Size58KB,2 Pages
Manufacturer3M
Websitehttp://3M.com/esd
Environmental Compliance
Download Datasheet Parametric View All

3MIC 3M661X DLF 3MIL 4 IN Overview

LAPPING FILM DIAMOND 4"

3MIC 3M661X DLF 3MIL 4 IN Parametric

Parameter NameAttribute value
typepolishing film
Specificationdiamond
size/dimensions4.00" diameter (101.6mm)
Supporting products/related productsThe optical fiber connector
weight-
Technical Data
November, 2007
3M
Diamond Lapping Film 600X Series
Product Description
Our 3M™ Diamond Lapping Films are comprised of
tightly graded diamond mineral uniformly coated on a
polyester film backing. Enables long abrasive life with a
superior finish throughout the life of the product. Available
with or without PSA (Pressure Sensitive Adhesive) backing.
Backing
Polyester Film
Nominal thickness: 1 mil, 1.5 mil, 2 mil, 3 mil
Actual thickness: .92 mil, 1.46 mil, 1.97 mil,
2.97 mil, (± 0.05)
Ultimate tensile strength - 26,500 psi (typical)
Applications
Fiber optic connector processing, flat lapping,
roll superfinishing.
Mineral Size Grading Chart
Micron Grade
(nominal)
0.1
Color
Green
White
Lavender
Light Green
Pink
Brown
Blue
Orange
Burgundy
Green
Amber
Amber
Substrates
Ceramics, glass, stone, carbide, composites, exotic alloys
and other hard materials.
0.5
1.0
1.5
3.0
Key Features
• Long life
• Produces superior surface finish
• Reduces overall process time
• Produces high yields
• Eliminates slurries
• Consistent results throughout life of product
Used in many applications and on a multitude of machines
6.0
9.0
15.0
20.0
30.0
45.0
60.0
3M I.D. Number
Backing Thickness
Plain back
PSA back
1 mil 1.5 mil 2 mil
631X
n/a
641X
n/a
3 mil
3 mil
3 mil 3 mil
651X 660XV 661X 662XW 663X
n/a
n/a
668X 666XW 664X
Bonding Resins
3M™ Diamond Lapping Films 631X, 641X, 651X and
661X/668X: Standard resin
3M™ Diamond Lapping Films 660XV, 662XW/666XW:
Softer, tougher resin system with higher diamond content
3M™ Diamond Lapping Films 663X/664X: Hardest resin
Converted Forms
Sheets, Discs and Rolls.
Maximum width 12 in.
3
I have a question about HDLC.
Definition of the control area of HDLC Frame name 1 byte control field Description I RRR (P/F) SSS0 Information transmission frame. RRR is the receive frame count, SSS is the send frame count. Regardi...
mshop Embedded System
AFE4110 DEMO PEN EVM
TI has also proposed an application solution for the newly launched AFE4110 MCU, using the MCU to make an electronic thermometer.Description The AFE4110 Demo Pen demonstrates an accurate low-cost sing...
wstt Microcontroller MCU
Get to know TI's new high-voltage amplifier!
[size=4] Three new amplifiers that combine high speed and precision enable designers to create more accurate circuits for error-sensitive applications. The new devices enable more precise measurements...
qwqwqw2088 Analogue and Mixed Signal
Designing TMS320C2X/C5X Application Programs with C Language (Part 1)
1. Memory ModeThe TMS320C2X/C5X fixed-point processor has two types of memory: program memory and data memory. The program memory mainly contains executable program code, while the data memory mainly ...
yijiang DSP and ARM Processors
con、pin problem
What should the end without the pin of PIN, CON, HEDAER be connected to?...
无泪的哭泣 PCB Design
AT89S51 Experiment and Practice Tutorial
This tutorial includes the following contents: 1. Introduction to AT89S51 microcontroller experiment and practice system board 2. Use of Keil C software 3. Use of AT89S51 microcontroller downloader so...
幻天 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1597  2712  1618  2687  1385  33  55  28  53  49 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号