4A Micro Hybrid FPC-to-Board Connectors
BM22 Series
63% Reduction in footprint (Compared to
the dimensions of Hirose’s W-to-B DF57H)
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
4.65mm(DF57H-4pos)
2.64mm
■Features
1. 4A current rating
The space-saving design utilizes two power
contacts that can carry up to 4A of current, and
signal contacts that can also carry 0.3A of
current. This is all delivered in a small connector
that features a small mounting depth of 2.64mm.
(Fig.1)
4.24mm
6.5mm(DF57H-4pos)
Fig.1
Vacuum Pick-up Area
0.72mm
0.7mm
2. Two point contact structure
The structure utilizes two points on each contact to
ensure a secure connection for both types of
contacts (power and signal). (Fig.2.3)
3. Good mating operability
The connector contributes to the enhanced mating
operability by giving a click feeling which is effective in
preventing incomplete mating, and mating self-
alignment of 0.3mm which is secured by the guide ribs.
Fig.2
Mating Cross-Section Diagram
Two-Point Contact
Structure
Signal Contact
Two-Point Contact
Structure
Power Contact
Fig.3
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
2015.6
②
1
BM22 Series●4A Micro Hybrid FPC-to-Board Connectors
■Product
Specifications
Ratings
Current
rating
Voltage
rating
Operating
Storage
Power contact : 4A
-35 to 85°C (Note 1)
-10 to 60ç (Note 2)
temperature range
Signal contact : 0.3A temperature range
Operating
Storage
50V AC/DC
20 to 80%
40 to 70% (Note 2)
humidity range
humidity range
Specification
Minimum of 100Mø
Conditions
Measured at 100V DC
Conduct 150V AC for 1 minute
Measured at 20mV AC, 1kHz, 1mA
Frequency : 10 to 55Hz, single amplitude of 0.75mm,
10 cycles in each of 3 axis directions for 5 minutes / cycle
96 hours at a temperature of 40 ±2ç and a
humidity range from 90 to 95%
Item
1. Insulation resistance
2. Withstanding voltage No flashover or insulation breakdown
3. Contact resistance
Signal contact : Max of 50mø
Power contact : Max of 30mø
No electrical discontinuity of 1µs or longer
Contact resistance : Signal contact Max of 50mø
Power contact Max of 30mø
Insulation resistance : Min of 50Mø
Contact resistance : Signal contact Max of 50mø
Power contact Max of 30mø
Insulation resistance : Min of 100Mø
Contact resistance : Signal contact Max of 50mø
Power contact Max of 30mø
No signs of melting or deformity on the
molded resin parts and no negative effects on
performance.
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
4. Vibration
5. Humidity
6. Temperature cycle
-55ç : 30 minutes
➝
85°C : 30 minutes, 5 cycles
7. Durability
8. Solder Heat
Resistance
10 mating cycles
Reflow : according to the Recommended Solder Profile
Hand soldering : Soldering iron temperature 350ç,
no more than 3 seconds of contact
Note 1 : Includes temperature rise caused by current flow.
Note 2 : The term "storage" here refers to products stored for a long period prior to board mounting and use. The operating
temperature and humidity range covers the non-energized condition of connectors after board mounting and the
temporary storage conditions during transportation, etc.
■Material
Product
Receptacle / Header
Contacts
Copper alloy
Gold plated
-- ---
--- --
Part
Insulator
Material
LCP
Finish
Black
UL standard
UL94V-0
■Product
Number Structure
●Receptacles
/ Headers
BM 22 −
*
S − V (51)
❶
❷
❸
❹
❺
❶
Series name : BM 22 / BM 22L
❷
Number of contacts :
4 (2 for signal and 2 for power)
6 (4 for signal and 2 for power)
❸
Connector type :
S : Receptacle
P : Header
❹
Termination type
V : Straight SMT
❺
Gold plated specification and packaging status
(51) : Gold plate thickness 0.05µm
Embossed tape packaging (10,000pcs/reel)
(53) : Gold plate thickness 0.05µm
Embossed tape packaging (1,000pcs/reel)
2
BM22 Series●4A Micro Hybrid FPC-to-Board Connectors
■Receptacles
SIGNAL
CONTACT No.3
SIGNAL
CONTACT No.4
A
D
0.15
POWER
CONTACT No.1
2.64
A
POWER
CONTACT No.2
0.25
SIGNAL
CONTACT No.6
SIGNAL
CONTACT No.5
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Recommended PCB layout
1.38±0.02
＋0.05
2.94
0
0
0.6±0.02
C MAX
0.25MIN
0.27±0.02
B±0.02
0.45±0.02
0.28MAX
1.04MAX
0.25±0.02
D±0.02
2.04MIN
＊
0.25±0.02
D±0.02
*: No conductive trace area
(No of routing different circuit; however the same circuit that is connected to the footprint is allowed, and soldering resist must be applied over the trace.)
Part No.
BM22-4S-V(51)
BM22-6S-V(51)
HRS No.
677-1002-6 51
677-1004-1 51
No. of Contacts
4
6
A
4.24
4.64
B
4.54
4.94
C
0.8
1.2
A
D
- --
--
0.4
Note: This product is packaged on reels; please place your orders for full reel quantities.
■Headers
SIGNAL
CONTACT No.4
SIGNAL
CONTACT No.3
B
C
F
0.15
2.64
2.14±0.02
A
2.94±0.02
POWER
CONTACT No.2
2
−0.05
B±0.02
Recommended metal mask dimensions
(mask thickness: 100 µm)
POWER
CONTACT No.1
SIGNAL
CONTACT No.5
0.75
SIGNAL
CONTACT No.6
Recommended PCB layout
D±0.02
E±0.02
0.25±0.02
F±0.02
Recommended metal mask dimensions
(mask thickness: 100 µm)
D±0.02
1.78±0.02
F±0.02
0.25±0.02
2.94±0.02
E±0.02
1.28
−0.05
Part No.
BM22L-4P-V(51)
BM22L-6P-V(51)
HRS No.
677-1006-7 51
677-1007-0 51
2.94
0
＋0.05
0
No. of Contacts
4
6
0.9
A
3
3.4
B
2.3
2.7
C
1.2
1.6
D
2.6
3.0
E
0.9
1.3
F
- --
--
0.4
Note: This product is packaged on reels; please place your orders for full reel quantities.
3
BM22 Series●4A Micro Hybrid FPC-to-Board Connectors
Embossed Tape Dimensions (complies with JIS C 0806)
●Receptacle
●Reel
dimensions
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
●Header
●Reel
dimensions
φ
φ
4
BM22 Series●4A Micro Hybrid FPC-to-Board Connectors
Usage Recommendations
1.Recommended Soldering
Profile
（ ）
∼
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
[Condition]
1. Peak temperature
2. Heat section
3. Preheat section
4. Number of reflow cycles
: Maximum of 250ç
: 220ç min., within 60 seconds
: 150 to 180ç, 90 to 120 seconds
: Maximum of 2 cycles
Note 1: The temperature represents the PCB surface temperature in the vicinity of the
connector lead section.
Note 2: For the use of Nitrogen reflow, mount the connectors with an oxygen density
of 1,000 ppm or higher. Consult Hirose for the condition less than 1,000 ppm.
2. Recommended manual
soldering condition
3. Recommended stencil
thickness and open area ratio
to PCB pattern area
4. Board warpage
5. Cleaning conditions
Soldering iron temperature: 340 ±10°C, soldering time: within 3 seconds
Thickness: 0.1 mm
Open area ratio: 85% for signal contact, and 60% for power contact on the Receptacle
side. 70% for both contacts on the Plug side
Maximum of 0.02 mm in the center of the connector, while using both ends of the
connector as reference point
We do not recommend cleaning these connectors. Cleaning them may alter the
mating/un-mating operations. If you do clean them, make sure you test that these
operations have not been compromised prior to use.
●
Do not mate or un-mate these connectors until they are mounted, failure to follow
this precaution can lead to deformation or damage to these connectors.
●
Provide another form of support to the PCB, this connector was not designed to be
the main form of support.
●
When mating/un-mating this connector, do not apply excessive twisting forces onto
the connector. These forces can damage the contacts and alter its performance.
●Do
not apply excessive amounts of flux as it may cause the flux to wick.
●
There may be a slight variance in the color of the molding between production lots;
this variance will not affect the performance of the connector.
●
Refer to the next page for the handling precautions when mating and un-mating
these connectors.
●
If the connector becomes disconnected due to impact, a fall or a counterforce to
the FPC, it may be necessary to hold the connector in place with an addition to the
device’s case or other cushioning material to hold the connector in place.
6. Precautions
5
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