4032-T-B1 B 915 datasheet, PDF

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4032-T-B1 B 915: DescriptionKIT DEV TEST EZRADIOPRO SI4032; CategoryDevelopment board/suite/development tools; File Size549KB，58 Pages; ManufacturerSilicon Laboratories Inc; Environmental Compliance

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4032-T-B1 B 915 Overview

KIT DEV TEST EZRADIOPRO SI4032

4032-T-B1 B 915 Parametric

Parameter Name	Attribute value
type	launcher
frequency	915MHz
Supporting products/related products	Si4032
What's included	plate

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Si4030/31/32-B1

Si4030/31/32 ISM T

RANSMITTER

Features



Frequency range



240–930 MHz (Si4031/32)



900–960 MHz (Si4030)

Output Power Range



+1 to +20 dBm (Si4032)



–8 to +13 dBm (Si4030/31)

Low Power Consumption



Si4032

85 mA @ +20 dBm



Si4030/31

30 mA @ +13 dBm

Data Rate = 0.123 to 256 kbps

FSK, GFSK, and OOK modulation

Power Supply = 1.8 to 3.6 V



Ultra low power shutdown mode

Wake-up timer

Integrated 32 kHz RC or 32 kHz

XTAL

Integrated voltage regulators

Configurable packet handler

TX 64 byte FIFO

Low battery detector

Temperature sensor and 8-bit ADC

–40 to +85 °C temperature range

Integrated voltage regulators

Frequency hopping capability

On-chip crystal tuning

20-Pin QFN package

Low BOM

Power-on-reset (POR)

Ordering Information:

See page 53.

Pin Assignments

Si4030/31/32

XOUT

nSEL

15 SCLK

14 SDI

13 SDO

12 VDD_DIG

GPIO_0

GPIO_1

GPIO_2

10 11 NC

VR_DIG

nIRQ

SDN

XIN

Applications



Remote control

Home security & alarm

Telemetry

Personal data logging

Toy control

Wireless PC peripherals



Remote meter reading

Remote keyless entry

Home automation

Industrial control

Sensor networks

Health monitors

VDD_RF 1

TX 2

NC 3

NC 4

NC 5

20 19 18 17 16

GND

PAD

Description

Silicon Laboratories’ Si4030/31/32 devices are highly integrated, single-chip

wireless ISM transmitters. The high-performance EZRadioPRO

family includes a

complete line of transmitters, receivers, and transceivers allowing the RF system

designer to choose the optimal wireless part for their application.

The Si4030/31/32 offers advanced radio features including continuous frequency

coverage from 240–960 MHz with adjustable power output levels of –8 to

+13 dBm on the Si4030/31 and +1 to +20 dBm on the Si4032. Power adjustments

are made in 3 dB steps. The Si4030/31/32’s high level of integration offers

reduced BOM cost while simplifying the overall system design. The Si4032’s

Industry leading +20 dBm output power ensures extended range and improved

link performance.

Additional system features such as an automatic wake-up timer, low battery

detector, 64 byte TX FIFO, and automatic packet handling reduce overall current

consumption and allow the use of lower-cost system MCUs. An integrated

temperature sensor, general purpose ADC, power-on-reset (POR), and GPIOs

further reduce overall system cost and size.

The direct digital transmit modulation and automatic PA power ramping ensure

precise transmit modulation and reduced spectral spreading ensuring compliance

with global regulations including FCC, ETSI, and ARIB regulations.

An easy-to-use calculator is provided to quickly configure the radio settings,

simplifying customer's system design and reducing time to market.

Patents pending

Rev 1.1 1/10

Si4030/31/32

Si4030/31/32-B1

ABLE

Section

ONTENTS

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

1.1. Definition of Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2.1. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3. Controller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3.1. Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3.2. Operating Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.3. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.4. System Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.5. Frequency Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

4. Modulation Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

4.1. Modulation Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

4.2. Modulation Data Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

5. Internal Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

5.1. Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

5.2. Power Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

5.3. Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

5.4. Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

6. Data Handling and Packet Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

6.1. TX FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

6.2. Packet Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

6.3. Packet Handler TX Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

6.4. Data Whitening, Manchester Encoding, and CRC . . . . . . . . . . . . . . . . . . . . . . . . . . 37

6.5. Synchronization Word Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

6.6. TX Retransmission and Auto TX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

7. Auxiliary Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

7.1. Smart Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

7.2. Microcontroller Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

7.3. General Purpose ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

7.4. Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

7.5. Low Battery Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

7.6. Wake-Up Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

7.7. GPIO Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

8. Reference Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48

9. Application Notes and Reference Designs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

10. Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

11. Register Table and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

12. Pin Descriptions: Si4030/31/32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

13. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Rev 1.1

Si4030/31/32-B1

IST

IGURES

Figure 1. SPI Timing.................................................................................................................. 15

Figure 2. SPI Timing—READ Mode ..........................................................................................16

Figure 3. SPI Timing—Burst Write Mode .................................................................................. 16

Figure 4. SPI Timing—Burst Read Mode .................................................................................. 16

Figure 5. State Machine Diagram.............................................................................................. 17

Figure 6. TX Timing................................................................................................................... 21

Figure 7. Frequency Deviation .................................................................................................. 25

Figure 8. FSK vs. GFSK Spectrums..........................................................................................27

Figure 9. Microcontroller Connections....................................................................................... 30

Figure 10. PLL Synthesizer Block Diagram............................................................................... 31

Figure 11. FIFO Threshold ........................................................................................................34

Figure 12. Packet Structure....................................................................................................... 35

Figure 13. Multiple Packets in TX Packet Handler .................................................................... 36

Figure 14. Operation of Data Whitening, Manchester Encoding, and CRC .............................. 37

Figure 15. Manchester Coding Example ...................................................................................37

Figure 16. POR Glitch Parameters............................................................................................ 39

Figure 17. General Purpose ADC Architecture ......................................................................... 41

Figure 18. Temperature Ranges using ADC8 ........................................................................... 43

Figure 19. WUT Interrupt and WUT Operation.......................................................................... 46

Figure 20. Si4031 Reference Design Schematic ...................................................................... 48

Figure 21. 20-Pin Quad Flat No-Lead (QFN) ............................................................................54

Figure 22. PCB Land Pattern .................................................................................................... 55

Rev 1.1

4032-T-B1 B 915 Related Products

	4032-T-B1 B 915	Si4031-B1-FM	Si4032-B1-FM	SI4032-B1-FMR	4031-T-B1 B 434	SI4030-B1-FM	4032-T-B1 B 868	SI4031-B1-FMR	SI4030-B1-FMR
Description	KIT DEV TEST EZRADIOPRO SI4032	RF transmitter si4431 ezradiopro transmitter +13dbm	RF transmitter si4032 ezradiopro transmitter +20dbm	IC TX 240-930MHZ 1-20DB 20QFN	KIT DEV TEST EZRADIOPRO SI4031	IC TX 900-960MHZ -8-13DB 20QFN	KIT DEV TEST EZRADIOPRO SI4032	IC TX 240-930MHZ -8-13DB 20QFN	IC TX 900-960MHZ -8-13DB 20QFN
Is it Rohs certified?	-	conform to	conform to	conform to	-	conform to	-	conform to	conform to
Parts packaging code	-	QFN	QFN	QFN	-	QFN	-	QFN	QFN
package instruction	-	MO-220VGGD-8 ,QFN-20	MO-220VGGD-8 ,QFN-20	MO-220VGGD-8 ,QFN-20	-	HVQCCN,	-	HVQCCN,	HVQCCN,
Contacts	-	20	20	20	-	20	-	20	20
Reach Compliance Code	-	compli	compli	compliant	-	compliant	-	compliant	compliant
ECCN code	-	EAR99	EAR99	EAR99	-	EAR99	-	EAR99	EAR99
Commercial integrated circuit types	-	TRANSMITTER IC	TRANSMITTER IC	TRANSMITTER IC	-	TRANSMITTER IC	-	TRANSMITTER IC	TRANSMITTER IC
JESD-30 code	-	S-XQCC-N20	S-XQCC-N20	S-XQCC-N20	-	S-XQCC-N20	-	S-XQCC-N20	S-XQCC-N20
length	-	4 mm	4 mm	4 mm	-	4 mm	-	4 mm	4 mm
Number of functions	-	1	1	1	-	1	-	1	1
Number of terminals	-	20	20	20	-	20	-	20	20
Maximum operating temperature	-	85 °C	85 °C	85 °C	-	85 °C	-	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-	-40 °C	-	-40 °C	-40 °C
Package body material	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED
encapsulated code	-	HVQCCN	HVQCCN	HVQCCN	-	HVQCCN	-	HVQCCN	HVQCCN
Package shape	-	SQUARE	SQUARE	SQUARE	-	SQUARE	-	SQUARE	SQUARE
Package form	-	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Maximum seat height	-	0.9 mm	0.9 mm	0.9 mm	-	0.9 mm	-	0.9 mm	0.9 mm
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	-	3.6 V	-	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	1.8 V	1.8 V	1.8 V	-	1.8 V	-	1.8 V	1.8 V
surface mount	-	YES	YES	YES	-	YES	-	YES	YES
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal form	-	NO LEAD	NO LEAD	NO LEAD	-	NO LEAD	-	NO LEAD	NO LEAD
Terminal pitch	-	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm	-	0.5 mm	0.5 mm
Terminal location	-	QUAD	QUAD	QUAD	-	QUAD	-	QUAD	QUAD
transmission media	-	RF	RF	RF	-	RF	-	RF	RF
width	-	4 mm	4 mm	4 mm	-	4 mm	-	4 mm	4 mm

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