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ZL50011GDG2

Description
TELECOM, DIGITAL TIME SWITCH, PBGA144
CategoryWireless rf/communication    Telecom circuit   
File Size631KB,83 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Environmental Compliance
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ZL50011GDG2 Overview

TELECOM, DIGITAL TIME SWITCH, PBGA144

ZL50011GDG2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerZarlink Semiconductor (Microsemi)
package instructionLBGA, BGA144,12X12,40
Reach Compliance Codeunknow
JESD-30 codeS-PBGA-B144
JESD-609 codee1
length13 mm
Number of functions1
Number of terminals144
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA144,12X12,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.25 mm
Maximum slew rate0.25 mA
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesDIGITAL TIME SWITCH
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width13 mm
ZL50011
Flexible 512 Channel DX with on-chip
DPLL
Data Sheet
Features
512 channel x 512 channel non-blocking switch at
2.048 Mbps, 4.096 Mbps or 8.192 Mbps
operation
Rate conversion between the ST-BUS inputs and
ST-BUS outputs
Integrated Digital Phase-Locked Loop (DPLL)
meets Telcordia GR-1244-CORE Stratum 4
specifications
DPLL provides reference monitor, jitter
attenuation and free run functions
Per-stream ST-BUS input with data rate selection
of 2.048 Mbps, 4.096 Mbps or 8.192 Mbps
Per-stream ST-BUS output with data rate
selection of 2.048 Mbps, 4.096 Mbps or
8.192 Mbps; the output data rate can be different
than the input data rate
Per-stream high impedance control output for
every ST-BUS output with fractional bit
advancement
Per-stream input channel and input bit delay
programming with fractional bit delay
ZL50011/QCC
ZL50011/GDC
ZL50011QCG1
ZL50011GDG2
**
March 2006
Ordering Information
160 Pin LQFP
Trays
144 Ball LBGA
Trays
160 Pin LQFP* Trays, Bake & Drypack
144 Ball LBGA** Trays, Bake & Drypack
*Pb Free Matte Tin
Pb Free Tin/Silver/Copper
-40°C to +85°C
Per-stream output channel and output bit delay
programming with fractional bit advancement
Multiple frame pulse outputs and reference clock
outputs
Per-channel constant throughput delay
Per-channel high impedance output control
Per-channel message mode
Per-channel Pseudo Random Bit Sequence
(PRBS) pattern generation and bit error detection
Control interface compatible to Motorola non-
multiplexed CPUs
Connection memory block programming capability
IEEE-1149.1 (JTAG) test port
3.3 V I/O with 5 V tolerant input
RESET
ODE
V
DD
V
SS
STi0-15
S/P Converter
Data Memory
P/S Converter
STo0-15
FPi
CKi
Input Timing
Connection Memory
Output HiZ Control
STOHZ0-15
REF
DPLL
Microprocessor
Interface
and
Internal
Output Timing
FPo0
CKo0
FPo1
CKo1
FPo2
CKo2
IC0 - 4
CLKBYPS
ICONN1
Registers
OSC
APLL
Test Port
V
DD_APLL
V
SS_APLL
DTA
D15 - 0
A11 - 0
XTALo
XTALi
Figure 1 - ZL50011 Functional Block Diagram
Zarlink Semiconductor US Patent No. 5,602,884, UK Patent No. 0772912,
France Brevete S.G.D.G. 0772912; Germany DBP No. 69502724.7-08
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2006, Zarlink Semiconductor Inc. All Rights Reserved.
TRST
TDO
TMS
SG1
TM1
TM2
R/W
TCK
DS
CS
TDI

ZL50011GDG2 Related Products

ZL50011GDG2 ZL50011QCG1
Description TELECOM, DIGITAL TIME SWITCH, PBGA144 TELECOM, DIGITAL TIME SWITCH, PQFP160
Is it Rohs certified? conform to conform to
Maker Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi)
package instruction LBGA, BGA144,12X12,40 LFQFP, QFP160,1.0SQ,20
Reach Compliance Code unknow unknow
JESD-30 code S-PBGA-B144 S-PQFP-G160
JESD-609 code e1 e3
length 13 mm 24 mm
Number of functions 1 1
Number of terminals 144 160
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LFQFP
Encapsulate equivalent code BGA144,12X12,40 QFP160,1.0SQ,20
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.25 mm 1.6 mm
Maximum slew rate 0.25 mA 0.25 mA
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
Telecom integrated circuit types DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER MATTE TIN
Terminal form BALL GULL WING
Terminal pitch 1 mm 0.5 mm
Terminal location BOTTOM QUAD
width 13 mm 24 mm
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