Eccostock®FFP
One Part Free Flowing Syntactic Foam Powder
FREE FLOWING SYNTACTIC FOAM POWDER
Eccostock FFP is a one-part, epoxy-based, free-flowing powder. It cures at elevated
temperatures to a rigid, non-burning syntactic foam. It is extremely light weight and provides
physical support as well as thermal insulation without increasing the weight or dielectric
constant. Eccostock FFP exhibits minimum shrinkage during cure, exerting minimum stress on
delicate components. Cured material can be easily removed with tools enabling access to
repair or replace components.Since cured Eccostock FFP is porous, application of an epoxy
coating will reduce moisture absorption.
FEATURES AND BENEFITS
•
Low cost
•
Low shrinkage during cure
•
No mixing required and easy to use as it is a
one part curing system
MARKETS
•
Commercial Telecom
•
Security and Defense
SPECIFICATIONS
TYPICAL PROPERTIES
Temperature Range °C (°F)
Density, g/cc
Compression Strength kPa (psi)
Dielectric Constant @ 8.6 GHz
Loss Tangent @ 8.6 GHz
Dielectric Strength, volts/mil
Thermal Conductivity W/mK
Volume Resistivity, ohm-cm
ECCOSTOCK FFP
-65 to 175 (-85 to 347)
0.24
1000 (150)
1.25
0.005
64
0.051
11
3.49 x 10
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
APPLICATIONS
•
Eccostock FFP is designed to infiltrate densely populated electronic packages, readily filling
available volumes around components. It been used to stabilize crystal oscillators as well as
other delicate components that need to be held in place or thermally protected.
•
Eccostock FFP has also found its way into machinery operating in high vibration
environments to keep electrical components from shaking apart.
•
Low shrinkage during cure makes
•
Eccostock FFP excellent for encapsulation applications.
AVAILABILITY
•
Eccostock FFP is readily available in pints, quarts, gallons, and 5 gallon containers. Pint and
quart containers are also available in squeeze bottles for ease of application.
Americas: +1.866.928.8181
Europe: +49.(0)8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
Eccostock® FFP
INSTRUCTIONS FOR USE
•
Refer to the MSDS for full safety information before opening the container. Measures
should be taken to avoid any contact with the skin and eyes, and a dust mask or respirator
should be used to avoid inhaling the product.
•
Mix the Eccostock FFP in the shipping container by lightly tumbling or shaking before use,
as some components may separate during shipping and storage.
•
In a well ventilated area, carefully pour the Eccostock FFP from a small paper cup or
dispense from a squeeze bottle into the device being filled.
•
Light to moderate vibration is recommended to maximize packing of the material.
•
Eccostock FFP bonds well to itself and most other substrates. Mold release wax is
recommended in applications where removal from a mold is necessary.
•
Shelf life is 6 months if stored in a cool dry place out of direct sunlight at 21 °C (70 °F).
•
Elevated temperature curing is required. Select one of the following recommended curing
times and temperatures:
Cure Times and Temperatures
24 hours at 100°C (212°F)
4 hours at 120°C (248°F)
2 hours at 150°C (302°F)
RFP-DS-FFP 112515
A
ny information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird
Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any
kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird
Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license
under any Laird Technologies or any third party intellectual property rights.
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