Rigado Inc.
3950 Fairview Industrial Dr.
Salem, Oregon 97302
866-6-RIGADO
modules@rigado.com
www.rigado.com/modules
R41Z Module for Thread and Bluetooth 4.2 LE
The
R41Z Module
from Rigado is a highly-integrated, ultra-low power
module that enables Bluetooth Low Energy and IEEE 802.15.4
connectivity based on the Kinetis KW41Z SoC from NXP
Semiconductors. With and ARM® Cortex™
M0+ processor, embedded
2.4GHz transceiver supporting FSK/GFSK and O-QPSK modulations, and
integrated antenna, the
R41Z
provides a complete RF solution with no
additional RF design allowing faster time to market. Equipped with the
ability to concurrently communicate over Bluetooth and Thread
connections, the R41Z offers an unprecedented level of connectivity in
a single module. With an internal DC-DC Converter and a wide supply
voltage range of 0.9V to 4.2V, the
R41Z
can be directly powered by
sources ranging from single alkaline cells to lithium polymer batteries.
1. Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Based on the NXP Kinetis KW41Z SoC
Complete RF solution with integrated
antenna
Integrated DC-DC converter
Arm® Cortex™-M0+
32-bit processor
Serial Wire Debug
Over-the-Air (OTA) firmware updates
512kB embedded flash memory
128kb RAM
25 GPIO, 2 dedicated analog pins
16-bit/500KSPS ADC
12-bit DAC
-40°C to +105°C Temperature Range
Rigado Software Suite
16 Capacitive Touch Sensing Inputs
•
•
•
•
•
•
•
•
•
•
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•
•
•
•
Two SPI Master/Slave (12Mbps)
Two I
2
C Master/Slave
UART (w/ CTS/RTS and DMA)
Low power comparator
Temperature sensor
Infrared communication interface
Nine low power modes
True Random Number Generator
128-bit AES HW encryption
32bit Real-Time Clock (RTC)
Wi-Fi coexistence support
Dimensions: 10.6 x 16.2 x 2.1mm
FCC: 2AA9B07
IC: 12208A-07
Japan: R210-109448
2. Applications
•
•
•
•
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Home/Office/Hotel Automation
Low-Power Sensor Networks
Home Appliances
Lighting Products
Climate Control
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Environmental Monitoring
Home Health Care
Safety and Security
Access Control
Smart Energy Management
R41Z-DS-V1.1
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R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
April 21, 2017
3. Ordering Information
Email
modules@rigado.com
for quotes and ordering, or visit
www.rigado.com/R41Z
Part Number
R41Z-TA-R
R41Z-TA-EVAL
Description
R41Z-TA module, Rev A, Tape & Reel, 1000 piece multiples
R41Z-TA Evaluation Kit with OpenSDA programmer
Table 1 - Ordering Part Numbers
4. Block Diagram
Figure 1 - Block Diagram
R41Z-DS-1.1
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R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
April 21, 2017
Table of Contents
1.
FEATURES ...................................................................................................................................................................1
2.
APPLICATIONS.............................................................................................................................................................1
3.
ORDERING INFORMATION ..........................................................................................................................................2
4.
BLOCK DIAGRAM.........................................................................................................................................................2
5.
QUICK SPECIFICATIONS ...............................................................................................................................................7
6.
PIN DESCRIPTIONS AND SIGNAL ROUTING ..................................................................................................................8
6.1
R41Z P
IN
D
ESCRIPTIONS
......................................................................................................................................................... 8
6.2
GPIO
AND
LLWU S
IGNALS
.................................................................................................................................................... 10
6.3
UART S
IGNALS
.................................................................................................................................................................... 11
6.4
SPI S
IGNALS
........................................................................................................................................................................ 11
6.5
I2C S
IGNALS
....................................................................................................................................................................... 11
6.6
T
OUCH
S
ENSING
I
NPUT
(TSI) S
IGNALS
...................................................................................................................................... 12
6.7
T
IMER
/PWM M
ODULE
(TPM) S
IGNALS
.................................................................................................................................. 12
6.8
R
ADIO
S
IGNALS
.................................................................................................................................................................... 13
6.8.1 W
I
-F
I
/BLE C
OEXISTENCE
S
IGNALS
......................................................................................................................................... 13
6.8.2 D
IRECT
T
EST
M
ODE
(DTM) S
IGNALS
...................................................................................................................................... 13
6.8.3 802.15.4 B
IT
S
TREAMING
M
ODE
(BSM) S
IGNALS
................................................................................................................... 13
6.9
C
ARRIER
M
ODULATOR
T
IMER
(CMT) S
IGNAL
............................................................................................................................. 13
6.10
RTC
AND
C
LOCK
S
IGNALS
....................................................................................................................................................... 14
6.11
S
INGLE
W
IRE
D
EBUG
(SWD)
AND
R
ESET
S
IGNALS
....................................................................................................................... 14
6.12
A
NALOG
S
IGNALS
................................................................................................................................................................. 14
7.
ELECTRICAL DESCRIPTION.......................................................................................................................................... 15
7.1
A
BSOLUTE
M
AXIMUM
R
ATINGS
............................................................................................................................................... 15
7.2
O
PERATING
C
ONDITIONS
........................................................................................................................................................ 15
7.3
DCDC C
ONVERTER
O
PERATION
............................................................................................................................................... 15
7.3.1 DCDC B
YPASS
M
ODE
......................................................................................................................................................... 16
7.3.2 DCDC B
UCK
M
ODE
............................................................................................................................................................ 17
7.3.3 DCDC B
OOST
M
ODE
.......................................................................................................................................................... 18
7.4
G
ENERAL
P
URPOSE
I/O
AND PORTS
.......................................................................................................................................... 20
7.5
A
NALOG
I/O
AND
VREF ........................................................................................................................................................ 21
7.5.1 A
NALOG
S
IGNALS
............................................................................................................................................................... 21
7.5.2 VDDA
AND
VREF .............................................................................................................................................................. 21
7.6
M
ODULE
R
ESET
................................................................................................................................................................... 21
7.7
D
EBUG AND
P
ROGRAMMING
................................................................................................................................................... 21
7.8
C
LOCKS
.............................................................................................................................................................................. 22
7.8.1 G
ENERAL
P
ARAMETERS
........................................................................................................................................................ 22
8.
FIRMWARE ................................................................................................................................................................ 23
8.1
F
ACTORY
I
MAGE
................................................................................................................................................................... 23
8.1.1 F
IRMWARE
V
ERSION
‘00’
..................................................................................................................................................... 23
8.2
M
AC
A
DDRESS
I
NFO
.............................................................................................................................................................. 23
9.
MECHANICAL DATA ................................................................................................................................................... 24
9.1
P
ACKAGE
D
IMENSIONS
.......................................................................................................................................................... 24
9.2
R
ECOMMENDED
PCB F
OOTPRINT
............................................................................................................................................ 25
10.
MODULE MARKING ................................................................................................................................................... 25
11.
RF DESIGN NOTES...................................................................................................................................................... 26
11.1
R
ECOMMENDED
RF
LAYOUT AND
G
ROUND
P
LANE
....................................................................................................................... 26
11.2
M
ECHANICAL
E
NCLOSURE
...................................................................................................................................................... 26
11.3
A
NTENNA
P
ATTERNS
............................................................................................................................................................. 27
11.3.1 X-Y P
LANE
........................................................................................................................................................................ 27
11.3.2 Y-Z P
LANE
........................................................................................................................................................................ 28
11.3.3 Z-X P
LANE
........................................................................................................................................................................ 28
12.
EVALUATION BOARDS ............................................................................................................................................... 29
13.
CUSTOM DEVELOPMENT ........................................................................................................................................... 29
14.
BLUETOOTH QUALIFICATION ..................................................................................................................................... 30
15.
REGULATORY STATEMENTS....................................................................................................................................... 30
R41Z-DS-1.1
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R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
April 21, 2017
15.1
15.2
15.3
15.4
15.5
15.6
15.7
16.
16.1
17.
17.1
17.2
17.3
18.
19.
20.
21.
FCC S
TATEMENT
.................................................................................................................................................................. 30
FCC I
MPORTANT
N
OTES
: ....................................................................................................................................................... 30
IC S
TATEMENT
: .................................................................................................................................................................... 32
IC I
MPORTANT
N
OTES
: .......................................................................................................................................................... 32
CE R
EGULATORY
: ................................................................................................................................................................. 33
J
APAN
(MIC) ...................................................................................................................................................................... 33
A
USTRALIA
/ N
EW
Z
EALAND
................................................................................................................................................... 34
SOLDER REFLOW TEMPERATURE-TIME PROFILE ........................................................................................................ 35
M
OISTURE
S
ENSITIVITY
L
EVEL
.................................................................................................................................................. 35
PACKAGING AND LABELING ...................................................................................................................................... 36
C
ARRIER
T
APE
D
IMENSION
..................................................................................................................................................... 36
R
EEL
P
ACKAGING
.................................................................................................................................................................. 36
P
ACKAGING
L
ABEL
................................................................................................................................................................ 37
CAUTIONS ................................................................................................................................................................. 37
LIFE SUPPORT POLICY ................................................................................................................................................ 38
DOCUMENT HISTORY ................................................................................................................................................ 38
RELATED DOCUMENTS .............................................................................................................................................. 38
R41Z-DS-1.1
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R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
April 21, 2017
Table of Figures
F
IGURE
1 - B
LOCK
D
IAGRAM
............................................................................................................................... 2
F
IGURE
2 - R41Z P
IN OUT
(T
OP
V
IEW
) ................................................................................................................. 8
F
IGURE
3 - S
CHEMATIC
: DCDC B
YPASS
M
ODE
E
XAMPLE
....................................................................................... 16
F
IGURE
4 - S
CHEMATIC
: DCDC B
UCK
M
ODE
E
XAMPLE
.......................................................................................... 17
F
IGURE
5 - S
CHEMATIC
: DCDC B
UCK
M
ODE
PSWITCH E
XAMPLE
.......................................................................... 18
F
IGURE
6 - S
CHEMATIC
: DCDC B
OOST
M
ODE
E
XAMPLE
........................................................................................ 19
F
IGURE
7 - PCB: B
OOST
M
ODE
S
UGGESTED
L
AYOUT
............................................................................................ 20
F
IGURE
8 - S
CHEMATIC
: L
OW
F
REQUENCY
C
RYSTAL
.............................................................................................. 22
F
IGURE
10 - R41Z MAC A
DDRESS ON
L
ABEL
....................................................................................................... 23
F
IGURE
11 - R41Z M
ODULE
D
IMENSIONS
........................................................................................................... 24
F
IGURE
12 - R41Z P
AD
L
AYOUT
(T
OP
V
IEW
) ....................................................................................................... 25
F
IGURE
13 - R41Z M
ODULE
M
ARKING
- R
EV
A .................................................................................................... 25
F
IGURE
14 - R41Z RF E
XAMPLE
B
ASED ON
EVAL B
OARD
...................................................................................... 26
F
IGURE
15 - X-Y-Z A
NTENNA
O
RIENTATION
........................................................................................................ 27
F
IGURE
16 - X-Y P
LANE
A
NTENNA
P
ATTERN
........................................................................................................ 27
F
IGURE
17 - Y-Z A
NTENNA
P
ATTERN
.................................................................................................................. 28
F
IGURE
18 - Z-X P
LANE
A
NTENNA
P
ATTERN
........................................................................................................ 28
F
IGURE
19 - R41Z E
VALUATION
B
OARD
.............................................................................................................. 29
F
IGURE
20 - R
EFLOW
P
ROFILE FOR
L
EAD
F
REE
S
OLDER
.......................................................................................... 35
F
IGURE
21 - C
ARRIER
T
APE
D
IMENSION
.............................................................................................................. 36
F
IGURE
22 - R
EEL
C
ARTONS
.............................................................................................................................. 36
F
IGURE
23 - P
ACKAGING
L
ABEL
......................................................................................................................... 37
R41Z-DS-1.1
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