Operating Temperature Range ..........................-40ºC to +125ºC
Junction Temperature ...................................................... +150ºC
Storage Temperature Range .............................-65ºC to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Package Thermal Characteristics
(Note 1)
TDFN (Multilayer)
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........41°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .................9°C/W
TDFN (Single Layer)
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........54°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .................9°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(V
DD
= +3.0V to +5.5V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
DD
= +5.0V and T
A
= +25ºC.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Supply Voltage Range
Supply Current
Disable Supply Current
Driver Output Resistance
Undervoltage Lockout
Threshold
Undervoltage Lockout
Threshold Hysteresis
T1, T2 Current Limit
T1, T2 Leakage Current
V
DD
I
DD
I
DIS
R
O
V
UVLO
V
UVLO_HYST
I
LIM
I
LKG
3.0V < V
DD
< 3.6V
4.5V < V
DD
< 5.5V
V
EN
= V
DD
, V
CLK
= 0V; T1, T2 = 0V or V
DD
1.1
1.2
-1
V
EN
= 0V, V
CLK
= 0V,
V
SPRD
= 0V, T1 and T2
not connected
V
HICLK
= 0V
V
HICLK
= V
DD
3.0
1.1
2.1
5.5
1.8
3.5
5
160
145
2.6
2.75
250
1.3
1.4
1.5
1.6
+1
350
300
2.9
V
mA
µA
mΩ
V
mV
A
µA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
V
EN
= V
DD
, T1, T2, CLK, SPRD, HICLK
connected to GND or V
DD
(Note 3)
I
OUT
= 500mA
V
DD
rising
V
DD
= 3.0V
V
DD
= 4.5V
www.maximintegrated.com
Maxim Integrated
│
2
MAX13253
1A, Spread-Spectrum, Push-Pull, Transformer
Driver for Isolated Power Supplies
Electrical Characteristics (continued)
(V
DD
= +3.0V to +5.5V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
DD
= +5.0V and T
A
= +25ºC.) (Note 2)
LOGIC SIGNALS (CLK,
EN,
HICLK, SPRD,
FAULT)
Input Logic-High Voltage
Input Logic-Low Voltage
Input Leakage Current
SPRD Pulldown Current
FAULT
Output Logic-Low
Voltage
FAULT
Leakage Current
AC CHARACTERISTICS
Switching Frequency
Frequency Spread
Spread Modulation Rate
CLK Input Frequency
CLK to T1, T2 Propagation
Delay
T1, T2 Duty Cycle
T1, T2 Slew Rate
Crossover Dead Time
Watchdog Timeout
PROTECTION
Thermal-Shutdown
Threshold
Thermal-Shutdown
Hysteresis
T
SHDN
T
SHDN_HYS
+160
30
ºC
ºC
f
SW
Df
SW
f
MOD
f
EXT
t
PD
D
t
SLEW
t
DEAD
t
WDOG
T1/T2 switching low
Internal or external clocking
Figure 2
Figure 2
20
Figure 2, V
CLK
= 0V,
V
SPRD
= 0V
Figure 1, V
SPRD
= V
DD
Figure 1, V
SPRD
= V
DD
V
HICLK
= 0V
V
HICLK
= V
DD
200
230
50
200
50
35
55
V
HICLK
= 0V
V
HICLK
= V
DD
237
564
250
600
±4
f
SW
/12
f
SW
/28
2000
263
636
kHz
%
kHz
kHz
ns
%
V/µs
ns
µs
V
IH
V
IL
I
IL
I
PD
V
OL
I
LKGF
EN,
CLK, SPRD, HICLK = 0V or 5.5V
V
SPRD
= V
DD
I
SINK
= 10mA
V
FAULT
= 5.5V,
FAULT
deasserted
-1
5
10
PARAMETER
SYMBOL
CONDITIONS
MIN
2
0.8
+1
20
0.4
1
TYP
MAX
UNITS
V
V
µA
µA
V
µA
Note 2:
All units are 100% production tested at T
A
= +25ºC. Specifications over temperature are guaranteed by design.
Note 3:
Disable supply current includes output switch-leakage currents.
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