AD8354-EVALZ datasheet, PDF - EEWORLD Datasheet

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AD8354-EVALZ: DescriptionBOARD EVAL FOR AD8354; CategoryDevelopment board/suite/development tools; File Size333KB，16 Pages; ManufacturerADI; Websitehttps://www.analog.com; Environmental Compliance

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BOARD EVAL FOR AD8354

AD8354-EVALZ Parametric

Parameter Name	Attribute value
type	amplifier
frequency	1MHz ~ 2.7GHz
Supporting products/related products	AD8354
What's included	plate

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Data Sheet

FEATURES

Fixed gain of 20 dB

Operational frequency of 1 MHz to 2.7 GHz

Linear output power up to 4 dBm

Input/output internally matched to 50 Ω

Temperature and power supply stable

Noise figure: 4.2 dB

Power supply: 3 V or 5 V

1 MHz to 2.7 GHz

RF Gain Block

AD8354

FUNCTIONAL BLOCK DIAGRAM

BIAS AND VREF

VPOS

INPT

VOUT

COM1

AD8354

Figure 1.

COM2

APPLICATIONS

VCO buffers

General Tx/Rx amplification

Power amplifier predrivers

Low power antenna drivers

GENERAL DESCRIPTION

The

AD8354

is a broadband, fixed-gain, linear amplifier that

operates at frequencies from 1 MHz up to 2.7 GHz. It is

intended for use in a wide variety of wireless devices, including

cellular, broadband, CATV, and LMDS/MMDS applications.

By taking advantage of ADI’s high performance, complementary Si

bipolar process, these gain blocks provide excellent stability

over process, temperature, and power supply. This amplifier is

single-ended and internally matched to 50 Ω with a return loss

of greater than 10 dB over the full operating frequency range.

The

AD8354

provides linear output power of nearly 4.3 dBm

with 20 dB of gain at 900 MHz when biased at 3 V and an

external RF choke is connected between the power supply and

the output pin. The dc supply current is 24 mA. At 900 MHz,

the output third-order intercept (OIP3) is greater than 18 dBm;

at 2.7 GHz, the OIP3 is 14 dBm.

The noise figure is 4.2 dB at 900 MHz. The reverse isolation

) is −33 dB at 900 MHz.

The

AD8354

can also operate with a 5 V power supply; in

which case, no external inductor is required. Under these

conditions, the

AD8354

delivers 4.88 dBm with 20 dB of gain

at 900 MHz. The dc supply current is 26 mA. At 900 MHz, the

OIP3 is greater than 19 dBm; at 2.7 GHz, the OIP3 is 15 dBm.

The noise figure is 4.4 dB at 900 MHz. The reverse isolation

) is −33 dB.

The

AD8354

is fabricated on ADI’s proprietary, high performance,

25 GHz, Si complementary, bipolar IC process. The

AD8354

available in a chip scale package that uses an exposed paddle for

excellent thermal impedance and low impedance electrical

connection to ground. It operates over a −40°C to +85°C

temperature range, and an evaluation board is also available.

Rev. E

Document Feedback

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Technical Support

www.analog.com

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Trademarks and registered trademarks are the property of their respective owners.

02722-001

AD8354

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings ............................................................ 5

ESD Caution .................................................................................. 5

Pin Configuration and Function Descriptions ............................. 6

Data Sheet

Typical Performance Characteristics ..............................................7

Theory of Operation ...................................................................... 13

Basic Connections ...................................................................... 13

Applications Information .............................................................. 14

Low Frequency Applications Below 100 MHz ........................... 14

Evaluation Board ............................................................................ 15

Outline Dimensions ....................................................................... 16

Ordering Guide .......................................................................... 16

REVISION HISTORY

11/13—Rev. D to Rev. E

Changes to Figure 2 .......................................................................... 6

Added Figure 35, Renumbered Sequentially .............................. 12

Added Exposed Pad Notation to Outline Dimensions ............. 16

Changes to Ordering Guide .......................................................... 16

3/09—Rev. C to Rev. D

Changes to Lead Temperature (Soldering, 60 sec) Parameter,

Table 3 ................................................................................................ 5

Changes to Ordering Guide .......................................................... 16

12/05—Rev. B to Rev. C

Changes to Table 1 ............................................................................ 3

Changes to Table 2 ............................................................................ 4

Moved Figure 39 to Page 15; Renumbered Sequentially ........... 15

Changes to Ordering Guide .......................................................... 16

8/05—Rev. A to Rev. B

Updated Format .................................................................. Universal

Changes to Product Title, Features, and General Description ....1

Changes to Basic Connections Section ....................................... 13

Added Low Frequency Applications Below 100 MHz Section 14

Changes to Ordering Guide .......................................................... 16

Updated Outline Dimensions ....................................................... 16

6/02—Rev. 0 to Rev. A

Changes to Ordering Guide .............................................................4

Replaced TPC 34 ............................................................................ 10

Updated Outline Dimensions ....................................................... 13

2/02—Revision 0: Initial Version

Rev. E | Page 2 of 16

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