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LLDB3-TP

Description
DIAC 28-36V 2A MINIMELF
Categorysemiconductor    Discrete semiconductor   
File Size333KB,3 Pages
ManufacturerMicro Commercial Co
Environmental Compliance
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LLDB3-TP Overview

DIAC 28-36V 2A MINIMELF

LLDB3-TP Parametric

Parameter NameAttribute value
Voltage - conduction28 ~ 36V
Current - Breakdown50µA
Current - Peak Output2A
Operating temperature-40°C ~ 125°C (TJ)
Package/casingDO-213AC, MINI-MELF, SOD-80
Supplier device packagingMini MELF
NOT RECOMMENDED FOR NEW DESIGNS
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla
Street Chatsworth

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$ %    !"#
LLDB3
SILICON
BIDIRECTIONAL
DIAC
Features
Breakover Voltage: 32V
Breakover Voltage Range: 28V to
36V
Lead Free Finish/RoHS Compliant(Note 3) ("P" Suffix designates
RoHS Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Maximum Ratings
Operating JunctionTemperature: -40 C to +125 C
Storage Temperature: -40 C to +125 C
o
o
o
o
MiniMELF
Electrical Characteristics @ 25
o
C Unless Otherwise Specified
Power dissipation
on Printed
Circuit(l=10mm)
Repetitive Peak
on-state Current
P
C
150mW
T
A
=50
o
C
t
p
=20us,f=120Hz
A
B
C
I
TRM
2.0A
Breakover Voltage
V
BO
Min Typ Max
28 32 36V
C=22nF(Note 2)
DIM
A
B
C
INCHES
MIN
.130
.008
.055
DIMENSIONS
MM
MIN
3.30
.20
1.40
Breakover Voltage
|+V
BO
|
Symmetry
±3V
MAX
.146
.016
.059
MAX
3.70
.40
1.50
NOTE
C=22nF(Note 2)
SUGGESTED SOLDER
PAD LAYOUT
Output
Voltage(Note 1)
Breakover
Current(Note 1)
Rise Time(Note 1)
V
o(min)
I
BO(max)
T
r
I
B(max)
5V
50uA
2.0us
10uA
V
B
=0.5V
BO(max)
C=22nF
0.075”
0.105
Leakage
Current(Note 1)
0.030”
NOTES:1.Electrical characteristics applicable in both forward and
reverse directions.
2.Connected in parallel with the devices.
3.Lead in Glass Exemption Applied,
see EU
Directive Annex 7(C)-I.
Revision:
B
www.mccsemi.com
1 of 3
2012/05/12

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