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R5F213G5CNNP#U0

Description
IC MCU 16BIT 24KB FLASH 24HWQFN
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size545KB,59 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance
Download Datasheet Parametric View All

R5F213G5CNNP#U0 Overview

IC MCU 16BIT 24KB FLASH 24HWQFN

R5F213G5CNNP#U0 Parametric

Parameter NameAttribute value
Brand NameRenesas
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRenesas Electronics Corporation
Parts packaging codeHWQFN
package instructionHVQCCN, LCC24,.16SQ,20
Contacts24
Manufacturer packaging codePWQN0024KC-A24
Reach Compliance Codecompliant
Has ADCYES
Other featuresIT ALSO OPERATES IN 1.8V AT 5MHZ
Address bus width
bit size16
CPU seriesR8C
maximum clock frequency20 MHz
DAC channelYES
DMA channelNO
External data bus width
JESD-30 codeS-PQCC-N24
length4 mm
Number of I/O lines20
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC24,.16SQ,20
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2/5 V
Certification statusNot Qualified
RAM (bytes)2048
rom(word)24576
ROM programmabilityFLASH
Maximum seat height0.8 mm
speed20 MHz
Maximum slew rate15 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width4 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Datasheet
R8C/3GC Group
RENESAS MCU
R01DS0036EJ0100
Rev.1.00
Oct 19, 2010
1.
1.1
Overview
Features
The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/3GC Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
R01DS0036EJ0100 Rev.1.00
Oct 19, 2010
Page 1 of 56
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