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BSR58,215

Description
JFET N-CH 40V 250MW SOT23
CategoryDiscrete semiconductor    The transistor   
File Size429KB,10 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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BSR58,215 Overview

JFET N-CH 40V 250MW SOT23

BSR58,215 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTO-236
package instructionPLASTIC, SMD, SST3, 3 PIN
Contacts3
Manufacturer packaging codeSOT23
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
ConfigurationSINGLE
Minimum drain-source breakdown voltage40 V
Maximum drain current (ID)0.005 A
Maximum drain-source on-resistance60 Ω
FET technologyJUNCTION
Maximum feedback capacitance (Crss)5 pF
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals3
Operating modeDEPLETION MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)0.225 W
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature40
transistor applicationsSWITCHING
Transistor component materialsSILICON
Base Number Matches1
BSR56; BSR57; BSR58
N-channel FETs
Rev. 3 — 25 June 2014
Product data sheet
1. Product profile
1.1 General description
Symmetrical silicon N-channel depletion type junction field-effect transistors (FETs) in a
plastic microminiature envelope designed for application in thick and thin-film circuits. The
transistors are intended for low-power, chopper or switching applications in industrial
service.
1.2 Features and benefits
Interchangeable drain and source connections
Small package
1.3 Applications
Low-power, chopper or switching applications
Thick and thin-film circuits
1.4 Quick reference data
Table 1.
Symbol
V
DS
I
DSS
Quick reference data
Parameter
drain-source voltage
drain leakage current
V
DS
= 15 V; V
GS
= 0 V;
T
mb
= 40
C
V
DS
= 15 V;
I
D
= 0.5 nA
V
DS
= 0 V; V
GS
=
10
V;
f = 1 MHz
I
D
= 20 mA; V
GSM
=
10
V
I
D
= 10 mA; V
GSM
=
6
V
I
D
= 5 mA; V
GSM
=
4
V
P
tot
R
DSon
total power dissipation
drain-source on-state
resistance
T
mb
= 40 °C
V
GS
= 0 V; I
D
= 0 A; f = 1 kHz
Static characteristics
-
<25
-
<40
-
<60
Conditions
BSR56
Min
-
-
-
>4
<10
-
Max
40
>50
-
-
-
<5
BSR57
Min
-
-
-
>2
<6
-
Max
40
>20
<100
-
-
<5
BSR58
Min
-
-
-
>0.8
<4
-
Max
40
>8
<80
-
-
<5
V
mA
mA
V
V
pF
Unit
V
GSoff
C
rs
gate-source cut-off
voltage
feedback capacitance
Switching time (V
DD
= 10 V; V
GS
= 0 V)
t
off
turn-off time
-
-
-
-
<25
-
-
250
-
-
-
-
-
<50
-
250
-
-
-
-
-
-
250
ns
ns
mW
<100 ns

BSR58,215 Related Products

BSR58,215 BSR56,215
Description JFET N-CH 40V 250MW SOT23 JFET N-CH 40V 0.25W SOT23
Brand Name NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to
Maker NXP NXP
Parts packaging code TO-236 TO-236
package instruction PLASTIC, SMD, SST3, 3 PIN PLASTIC, SMD, SST3, 3 PIN
Contacts 3 3
Manufacturer packaging code SOT23 SOT23
Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
Is Samacsys N N
Configuration SINGLE SINGLE
Minimum drain-source breakdown voltage 40 V 40 V
Maximum drain current (ID) 0.005 A 0.02 A
Maximum drain-source on-resistance 60 Ω 25 Ω
FET technology JUNCTION JUNCTION
Maximum feedback capacitance (Crss) 5 pF 5 pF
JESD-30 code R-PDSO-G3 R-PDSO-G3
JESD-609 code e3 e3
Humidity sensitivity level 1 1
Number of components 1 1
Number of terminals 3 3
Operating mode DEPLETION MODE DEPLETION MODE
Maximum operating temperature 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260
Polarity/channel type N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) 0.225 W 0.3 W
Certification status Not Qualified Not Qualified
surface mount YES YES
Terminal surface Tin (Sn) Tin (Sn)
Terminal form GULL WING GULL WING
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 40 40
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON
Base Number Matches 1 1

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