Accu-Guard
®
SMD Thin-Film Fuse
ACCU-GUARD
®
TECHNOLOGY
The Accu-Guard
®
series of fuses is based on thin-film tech-
niques. This technology provides a level of control on the
component electrical and physical characteristics that is
generally not possible with standard fuse technologies. This
has allowed AVX to offer a series of devices which are
designed for modern surface mount circuit boards which
require protection.
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
Cellular Telephones
Two-Way Radios
Computers
Battery Chargers
Rechargeable Battery Packs
Hard Disk Drives
PDA’s
LCD Screens
SCSI Interface
Digital Cameras
Video Cameras
FEATURES
• Accurate current rating
• Fast acting
• Small-standard 0402, 0603, 0805, 1206 and 0612
chip sizes
• Taped and reeled
• Completely compatible with all soldering systems
used for SMT
• Lead Free Series (F0402E, F0402G, F0603E, F0805B, F1206B)
APPROVAL FILE NUMBERS
• UL, cUL:
RCD#E143842
• UL (F0402G): RCD#E141069
DIMENSIONS
millimeters (inches)
F0402E and F0603E
B
F0603C, F0805B, F1206A and F1206B
B
1
F0402G
S
A
B
H
W
T
W
T
L
W
T
B
2
L
L
F0402G
L
W
T
B
A
S, H
1.00±0.05
(0.039±0.002)
0.58±0.04
(0.023±0.002)
0.35±0.05
(0.014±0.002)
0.48±0.05
(0.019±0.002)
0.20±0.05
(0.008±0.002)
0.05±0.05
(0.002±0.002)
F0402E
1.00±0.10
(0.039±0.004)
0.55±0.07
(0.022±0.003)
0.40±0.10
(0.016±0.004)
0.20±0.10
(0.008±0.004)
F0603E
1.60±0.10
(0.063±0.004)
0.81±0.10
(0.032±0.004)
0.63±0.10
(0.025±0.004)
0.35±0.15
(0.014±0.006)
F0603C
1.65±0.25
(0.065±0.010)
0.80±0.15
(0.031±0.006)
0.90±0.2
(0.035±0.008)
0.35±0.15
(0.014±0.006)
F0805B
2.1±0.2
(0.083±0.008)
1.27±0.1
(0.050±0.004)
0.90±0.2
(0.035±0.008)
0.30±0.15
(0.012±0.006)
F1206A/B
3.1±0.2
(0.122±0.008)
1.6±0.1
(0.063±0.004)
1.2±0.2
(0.047±0.008)
0.43±0.25
(0.017±0.010)
F0612D
1.65±0.25
(0.065±0.010)
3.1±0.2
(0.122±0.008)
0.90±0.2
(0.036±0.008)
0.35±0.15
(0.014±0.006)
HOW TO ORDER
F
Product
Fuse
1206
Size
See table for
standard sizes
A
Fuse Version
A=Accu-Guard®
B=Accu-Guard® II
C=Accu-Guard® II
0603
D=Accu-Guard® II
0612
E=Accu-Guard® II
0402, 0603
G=Accu-Guard® II
0402 Low Current
0R20
Rated Current
Current expressed in
Amps. Letter R
denotes decimal
point. e.g.
0.20A=0R20
1.75A=1R75
F
Fuse Speed
F=Fast
W
Termination
S=Nickel/Lead-
Free Solder
=coated
(Sn 100)
W=Nickel/solder
=coated
(Sn 63, Pb 37)
TR
Packaging
TR=Tape and reel
2
Accu-Guard
®
II
SMD Thin-Film Fuse
Accu-Guard
®
II is a version of Accu-Guard
®
fuses for a
wider range of current and voltage ratings. Constructed on
alumina substrates, Accu-Guard
®
II fuses display superior
electrical, mechanical and environmental properties.
Accu-Guard
®
II dimensions are standard 0402, 0603,
0805, 1206 and 0612 chip sizes, see page 2.
For F1206B and F0805B at -55°C is 107% of rating, at
+25°C 100% of rating, at +85°C 93% of rating, at +125°C
90% of rating. For F0805B 2.50A and 3.00A at +85°C 90%
of rating, at +125°C 90% of rating.
Interrupting rating: 50A.
Insulation resistance: >20MΩ guaranteed (after fusing at
rated voltage).
For F0612D at -55°C 107% of rating, at +25°C 100% of
rating, at +85°C 80% of rating, at +125°C 75% of rating.
ELECTRICAL SPECIFICATIONS
Operating temperature: -55°C to +125°C
Current carrying capacity:
For F0402E and F0603E at -55°C 107% of rating, at -25°C
100% of rating, at +125°C 80% of rating. For F0603C at
-55°C is 107% of rating, at +25°C 100% of rating, at +85°C
90% of rating, at +125°C 75% of rating.
Type
Part Number
F0402E0R25FSTR
F0402E0R50FSTR
F0402E0R75FSTR
F0402E1R00FSTR
F0402E1R50FSTR
F0402E2R00FSTR
F0603E0R25FSTR
F0603E0R37FSTR
F0603E0R50FSTR
F0603E0R75FSTR
F0603E1R00FSTR
F0603E1R25FSTR
F0603E1R50FSTR
F0603E1R75FSTR
F0603E2R00FSTR
F0603E2R50FSTR
F0603E3R00FSTR
F0603C0R25FWTR
F0603C0R37FWTR
F0603C0R50FWTR
F0603C0R75FWTR
F0603C1R00FWTR
F0603C1R25FWTR
F0603C1R50FWTR
F0603C1R75FWTR
F0603C2R00FWTR
F0603C2R50FWTR
F0603C3R00FWTR
F0805B0R25FW/STR
F0805B0R50FW/STR
F0805B0R75FW/STR
F0805B1R00FW/STR
F0805B1R25FW/STR
F0805B1R50FW/STR
F0805B2R00FW/STR
F0805B2R50FW/STR
F0805B3R00FW/STR
F1206B0R25FW/STR
F1206B0R50FW/STR
F1206B1R00FW/STR
F1206B1R50FW/STR
F1206B2R00FW/STR
F1206B3R00FW/STR
F0612D4R00FWTR
F0612D5R00FWTR
Current
Resistance
Rating 10% x I rated, 25°C
A
Ω (max.)
0.25
0.650
0.50
0.250
0.75
0.200
1.00
0.130
1.50
0.060
2.00
0.040
0.25
0.650
0.375
0.450
0.50
0.250
0.75
0.200
1.00
0.130
1.25
0.090
1.50
0.060
1.75
0.050
2.00
0.040
2.50
0.035
3.00
0.030
0.25
0.800
0.375
0.500
0.50
0.320
0.75
0.300
1.00
0.200
1.25
0.170
1.50
0.110
1.75
0.090
2.00
0.075
2.50
0.055
3.00
0.045
0.25
0.750
0.50
0.350
0.75
0.270
1.00
0.220
1.25
0.170
1.50
0.120
2.00
0.080
2.50
0.060
3.00
0.050
0.25
0.750
0.50
0.350
1.00
0.180
1.50
0.120
2.00
0.080
3.00
0.050
4.00
0.040
5.00
0.025
F0402E
F0603E
F0603C
F0805B
F1206B
F0612D
Voltage Drop
@1 x I rated, 25°C
mV (max.)
220
180
180
160
140
120
220
220
180
180
160
140
140
120
120
100
100
280
280
280
280
240
240
240
240
240
200
200
280
280
280
280
280
240
220
220
220
280
280
240
240
220
220
260
200
Fusing Current
(within 5 sec), 25°C
A
0.625
1.25
1.875
2.50
3.75
5.00
0.625
0.940
1.25
1.875
2.50
3.125
3.75
4.375
5.00
6.25
7.50
0.50
0.75
1.00
1.50
2.00
2.50
3.00
3.50
4.00
5.00
6.00
0.50
1.00
1.50
2.00
2.50
3.00
4.00
5.00
6.00
0.50
1.00
2.00
3.00
4.00
6.00
10
12.5
Pre-Arc
I
2
t @ 50A
A
2
-sec
0.00005*
0.0003
0.003
0.008
0.03
0.06
0.00005*
0.0001
0.0003
0.003
0.008
0.01
0.03
0.04
0.06
0.12
0.25
0.00003*
0.0001
0.0002
0.0015
0.004
0.007
0.012
0.02
0.03
0.05
0.1
0.00003*
0.0002
0.001
0.003
0.007
0.010
0.030
0.050
0.10
0.00003
0.0002
0.003
0.010
0.030
0.10
0.10
0.25
Rated
Voltage
V
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
24
24
16
16
63
63
63
63
63
63
63
63
63
63
63
63
63
63
63
32
32
*Current is limited to less than 50A at 32V due to internal fuse resistance.
7
Accu-Guard
®
II
SMD Thin-Film Fuse
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Leach Resistance
Conditions
Components completely immersed in a
solder bath at 235 ±5°C for 2 secs.
Completely immersed in a solder bath
at 260 ±5°C for 60 secs.
12 months minimum with components
stored in “as received” packaging.
Components mounted to a substrate.
A force of 5N applied normal to the
line joining the terminations and in
a line parallel to the substrate.
Components mounted to a substrate.
50 cycles -55°C to +125°C.
Per Mil-Std-202F
Method 201A and
Method 204D Condition D.
Tested as shown in diagram
Requirement
Terminations to be well tinned
No visible damage
Dissolution of termination
≤ 25% of area
ΔR/R<10%
Good solderability
No visible damage
Storage
Shear
Rapid Change of
Temperature
Vibration
No visible damage
Δ R/R<10%
No visible damage
ΔR/R<10%
No visible damage
ΔR/R<10%
Bend
3 mm
Deflection
45mm
45mm
Load Life
F0805B, F1206B
25°C, rated current, 20,000 hrs.
No visible damage
ΔR/R<10%
8
Accu-Guard
®
II
Lead-Free SMD Thin-Film Fuse
FUSE TIME – CURRENT CHARACTERISTICS
FOR TYPE F0402E (TYPICAL)
10
1
2.0A
1.5A
10
-1
Pre-
Arc
Time, 10
-2
sec
1.0A
0.75A
0.5A
0.25A
10
-3
10
-4
10
-5
10
-6
0.1
1
Current, Amp
10
100
9
Accu-Guard
®
II
Lead-Free SMD Thin-Film Fuse
FUSE PRE-ARC JOULE INTEGRALS VS CURRENT
FOR TYPE F0402E (TYPICAL)
100
10
1
Pre-
Arc
I
2
t,
A
2
sec
10
-1
2.0 A
10
-2
10
-3
1.5 A
1.0 A
10
-4
0.7 5A
0.5 A
0.2 5A
0
10
20
30
40
50
60
10
-5
10
-6
Current, Amp
10
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