R5F51308ADFK#30 datasheet, PDF

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R5F51308ADFK#30: Description32BIT MCU RX130 512K LQFP-64 -40; Categorysemiconductor The embedded processor and controller; File Size2MB，134 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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R5F51308ADFK#30 Overview

32BIT MCU RX130 512K LQFP-64 -40

R5F51308ADFK#30 Parametric

Parameter Name	Attribute value
core processor	RX
core size	32-bit
speed	32MHz
Connectivity	I²C，LINbus，SCI，SPI
Peripheral	DMA，LVD，POR，PWM，WDT
Number of I/Os	52
Program storage capacity	512KB（512K x 8）
Program memory type	flash memory
EEPROM capacity	8K x 8
RAM capacity	48K x 8
Voltage - Power Supply (Vcc/Vdd)	1.8 V ~ 5.5 V
data converter	A/D 14x12b，D/A 2x8b
Oscillator type	internal
Operating temperature	-40°C ~ 85°C（TA）
Package/casing	64-LQFP
Supplier device packaging	64-LQFP（14x14）

User Manual

【硬件手册】RX130 Group User's Manual: Hardware Rev.3.00

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Datasheet

RX130 Group

Renesas MCUs

R01DS0273EJ0300

Rev.3.00

Aug 09, 2018

32-MHz, 32-bit RX MCUs, 50 DMIPS, up to 512-KB flash memory,

up to 36 pins capacitive touch sensing unit, up to 6 comms channels, 12-bit A/D, D/A, RTC,

IEC60730 compliance, 1.8-V to 5.5-V single supply

Features

■ 32-bit RX CPU core

•

Max. operating frequency: 32 MHz

Capable of 50 DMIPS in operation at 32 MHz

•

Accumulator handles 64-bit results (for a single instruction) from

32-bit × 32-bit operations

•

Multiplication and division unit handles 32-bit × 32-bit operations

(multiplication instructions take one CPU clock cycle)

•

Fast interrupt

•

CISC Harvard architecture with 5-stage pipeline

•

Variable-length instructions, ultra-compact code

•

On-chip debugging circuit

PLQP0100KB-B

PLQP0080KB-B

PLQP0064GA-A

PLQP0064KB-C

PLQP0048KB-B

14 × 14mm, 0.5mm pitch

12 × 12mm, 0.5mm pitch

14 × 14mm, 0.8mm pitch

10 × 10mm, 0.5mm pitch

7 × 7mm, 0.5mm pitch

■ Low power design and architecture

•

Operation from a single 1.8-V to 5.5-V supply

Three low power consumption modes

Low power timer (LPT) that operates during the software standby state

Supply current

High-speed operating mode: 96 µA/MHz

Supply current in software standby mode: 0.37 µA

•

Recovery time from software standby mode: 4.8 µs

PWQN0048KB-A 7 × 7mm, 0.5mm pitch

■ MPC

•

Input/output functions selectable from multiple pins

■ On-chip flash memory for code, no wait states

•

64 K/128 K/256 K/383 K/512 Kbytes

Operation at 32 MHz, read cycle of 31.25 ns

No wait states for reading at full CPU speed

Programmable at 1.8 V

For instructions and operands

■ Up to 6 communication functions

■ On-chip data flash memory

•

8 Kbytes (1,000,000 program/erase cycles (typ.))

•

BGO (Background Operation)

•

SCI with many useful functions (up to 4 channels)

Asynchronous mode (Fine adjustable baud rate: 0 to 255/255), clock

synchronous mode, smart card interface mode

•

C bus interface: Transfer at up to 400 kbps, capable of SMBus

operation (one channel)

•

RSPI (one channel): Transfer at up to 16 Mbps

•

Two units integrated

•

Four pattern waveform matching supported

•

16-bit MTU: input capture, output compare, complementary PWM

output, phase counting mode (six channels)

•

8-bit TMR (four channels)

•

16-bit compare-match timers (two channels)

•

Capable of conversion within 1.4 μs

17 channels

Sampling time can be set for each channel

Conversion results compare features

Self-diagnostic function and analog input disconnection detection

assistance function

•

Double trigger (data duplication) function for motor control

■ Remote control signal reception

■ On-chip SRAM, no wait states

■ DTC

•

10 K/16 K/32 K/48 Kbytes size capacities

•

Four transfer modes

•

Transfer can be set for each interrupt source.

■ Up to 12 extended-function timersMPC

■ ELC

■ 12-bit A/D converter

•

Module operation can be initiated by event signals without using

interrupts.

•

Linked operation between modules is possible while the CPU is sleeping.

•

Eight types of reset, including the power-on reset (POR)

•

Low voltage detection (LVD) with voltage settings

•

External clock input frequency: Up to 20 MHz

Main clock oscillator frequency: 1 to 20 MHz

Sub clock oscillator frequency: 32.768 kHz

PLL circuit input: 4 MHz to 8 MHz

Low-speed on-chip oscillator: 4 MHz

High-speed on-chip oscillator: 32 MHz ± 1 %

IWDT-dedicated on-chip oscillator: 15 kHz

Generate a 32.768 kHz clock for the real-time clock

On-chip clock frequency accuracy measurement circuit (CAC)

■ Reset and supply management

■

Clock functions

■ D/A converter

•

Two channels

■ Capacitive touch sensing unit

•

Self-capacitance method: A single pin configures a single key,

supporting up to 36 keys

•

Mutual capacitance method: Matrix configuration with 36pins, supporting

up to 324 keys

■ Comparator B

•

Two channels

■ Realtime clock

■ General I/O ports

•

Adjustment functions (30 seconds, leap year, and error)

•

Calendar count mode or binary count mode selectable

•

15-kHz on-chip oscillator produces a dedicated clock signal to drive

IWDT operation.

•

Self-diagnostic and disconnection-detection assistance functions for

the A/D converter, clock frequency accuracy measurement circuit,

independent watchdog timer, RAM test assistance functions using the

DOC, etc.

•

5-V tolerant, open drain, input pull-up, switching of driving capacity

■ Independent watchdog timer

■ Temperature sensor

■ Unique ID

•

–40 to +85°C

•

–40 to +105°C

•

32-byte ID code for the MCU

■ Useful functions for IEC60730 compliance

■ Operating temperature range

■ Applications

•

General industrial and consumer equipment

R01DS0273EJ0300 Rev.3.00

Aug 09, 2018

Page 1 of 134

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