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DF15B(6.2)-20DP-0.65V(56)

Description
CONN HEADER 20POS 6.2MM DUAL SMD
CategoryThe connector   
File Size285KB,10 Pages
ManufacturerHirose Electric
Environmental Compliance
Download Datasheet Parametric View All

DF15B(6.2)-20DP-0.65V(56) Overview

CONN HEADER 20POS 6.2MM DUAL SMD

DF15B(6.2)-20DP-0.65V(56) Parametric

Parameter NameAttribute value
Connector typeconnector, housing contact
Number of pins20
spacing0.026"(0.65mm)
Number of rows2
Installation typesurface mount
characteristicFixed solder tail
Contact platinggold
Contact plating thickness3.90µin(0.099µm)
Joint stack height7mm,8mm
board height0.244"(6.20mm)
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
0.65mm Pitch SMT Board to Board Connector
DF15 Series
Corresponding to automatic mounting
The vacuum area is secured the automatic mounting
machine for vacuum.
Figure 1
sFeatures
1. Compatibility of Miniaturization with Service Efficiency
This series considers the service efficiency to set the pitch to 0.65mm, corresponding to the 0.5mm pitch DF12 series. This connector
widely covers the definition of the mounting space or the board to board size together with the DF12 series.
2. Broad Variations in Board to Board Size
The board to board size is specified at 1mm step between 4mm and 8mm.
Header/Receptacle
DF15#(3.2)-*DP-0.65V
DF15#(4.2)-*DP-0.65V
DF15#(6.2)-*DP-0.65V
DF15#(0.8)-*DS-0.65V
4
5
7
DF15#(1.8)-*DS-0.65V
5
6
8
Combinnation with H size Combinnation with H size
Note1: The stacking height is determined by adding the header and receptacle to the figures followed by the product name
DF15#.
Note2: The stacking height (H size) doesn't include the soldering paste thickness.
3. Correspond to Automatic Mounting
The connector has the vacuum area, which enables the automatic mounting by the embossed tape packaging.
4. Metal Fitting Available
The product including the metal fitting to prevent solder peeling is prepared, considering the mounting on FPC.
sApplications
Mobile phone, LCD(Liquid Crystal Display), MO(Optical Disk), Note PC
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