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MRF281SR1

Description
FET RF 65V 1.93GHZ NI-200S
CategoryDiscrete semiconductor    The transistor   
File Size411KB,7 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MRF281SR1 Overview

FET RF 65V 1.93GHZ NI-200S

MRF281SR1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
package instructionFLATPACK, R-CDFP-F2
Contacts2
Manufacturer packaging codeCASE 458B-03
Reach Compliance Codeunknown
ECCN codeEAR99
Shell connectionSOURCE
ConfigurationSINGLE
Minimum drain-source breakdown voltage65 V
FET technologyMETAL-OXIDE SEMICONDUCTOR
highest frequency bandS BAND
JESD-30 codeR-CDFP-F2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Maximum operating temperature200 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formFLATPACK
Peak Reflow Temperature (Celsius)260
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)20 W
Certification statusNot Qualified
surface mountYES
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperature40
transistor applicationsAMPLIFIER
Transistor component materialsSILICON
Freescale Semiconductor
Technical Data
Document Number: MRF281
Rev. 6, 10/2008
RF Power Field Effect Transistors
N--Channel Enhancement--Mode Lateral MOSFETs
Designed for digital and analog cellular PCN and PCS base station
applications with frequencies from 1000 to 2500 MHz. Characterized for
operation Class A and Class AB at 26 volts in commercial and industrial
applications.
Specified Two--Tone Performance @ 1930 MHz, 26 Volts
Output Power — 4 Watts PEP
Power Gain — 11 dB
Efficiency — 30%
Intermodulation Distortion — --29 dBc
Capable of Handling 10:1 VSWR, @ 26 Vdc,
2000 MHz, 4 Watts CW Output Power
Features
Excellent Thermal Stability
Characterized with Series Equivalent Large--Signal Impedance Parameters
S--Parameter Characterization at High Bias Levels
RoHS Compliant
In Tape and Reel. R1 Suffix = 500 Units per 12 mm, 7 inch Reel.
MRF281SR1
MRF281ZR1
1930-
-1990 MHz, 4 W, 26 V
LATERAL N-
-CHANNEL
BROADBAND
RF POWER MOSFETs
ARCHIVE INFORMATION
CASE 458B-
-03, STYLE 1
NI-
-200S
MRF281SR1
CASE 458C-
-03, STYLE 1
NI-
-200Z
MRF281ZR1
Table 1. Maximum Ratings
Rating
Drain--Source Voltage
Gate--Source Voltage
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
Storage Temperature Range
Case Operating Temperature
Operating Junction Temperature
Symbol
V
DSS
V
GS
P
D
T
stg
T
C
T
J
Value
--0.5, +65
±
20
20
0.115
-- 65 to +150
150
200
Unit
Vdc
Vdc
W
W/°C
°C
°C
°C
Table 2. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Symbol
R
θJC
Value
5.74
Unit
°C/W
Table 3. Electrical Characteristics
(T
C
= 25°C unless otherwise noted)
Characteristic
Off Characteristics
Drain--Source Breakdown Voltage
(V
GS
= 0, I
D
= 10
μAdc)
Zero Gate Voltage Drain Current
(V
DS
= 28 Vdc, V
GS
= 0)
Gate--Source Leakage Current
(V
GS
= 20 Vdc, V
DS
= 0)
V
(BR)DSS
I
DSS
I
GSS
65
74
10
1
Vdc
μAdc
μAdc
Symbol
Min
Typ
Max
Unit
NOTE --
CAUTION
-- MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
©
Freescale Semiconductor, Inc., 2008, 2010. All rights reserved.
MRF281SR1 MRF281ZR1
1
RF Device Data
Freescale Semiconductor
ARCHIVE INFORMATION

MRF281SR1 Related Products

MRF281SR1 MRF281ZR1
Description FET RF 65V 1.93GHZ NI-200S FET RF 65V 1.93GHZ NI-200Z
Is it Rohs certified? conform to conform to
Maker NXP NXP
package instruction FLATPACK, R-CDFP-F2 SMALL OUTLINE, R-CDSO-G2
Contacts 2 2
Manufacturer packaging code CASE 458B-03 CASE 458C-03
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Shell connection SOURCE SOURCE
Configuration SINGLE SINGLE
Minimum drain-source breakdown voltage 65 V 65 V
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
highest frequency band S BAND S BAND
JESD-30 code R-CDFP-F2 R-CDSO-G2
Number of components 1 1
Number of terminals 2 2
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 200 °C 200 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR
Package form FLATPACK SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260
Polarity/channel type N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) 20 W 20 W
Certification status Not Qualified Not Qualified
surface mount YES YES
Terminal form FLAT GULL WING
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 40 40
transistor applications AMPLIFIER AMPLIFIER
Transistor component materials SILICON SILICON
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