BUK7628-100A
N-channel TrenchMOS standard level FET
Rev. 2 — 26 April 2011
Product data sheet
1. Product profile
1.1 General description
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic
package using TrenchMOS technology. This product has been designed and qualified to
the appropriate AEC standard for use in automotive critical applications.
1.2 Features and benefits
AEC Q101 compliant
Low conduction losses due to low
on-state resistance
1.3 Applications
Automotive and general purpose
power switching
1.4 Quick reference data
Table 1.
Symbol
V
DS
I
D
P
tot
R
DSon
Quick reference data
Parameter
drain-source voltage
drain current
total power dissipation
drain-source on-state
resistance
non-repetitive
drain-source
avalanche energy
V
GS
= 10 V; I
D
= 25 A;
T
j
= 25 °C
I
D
= 30 A; V
sup
≤
25 V;
R
GS
= 50
Ω;
V
GS
= 5 V;
T
j(init)
= 25 °C; unclamped
Conditions
T
j
≥
25 °C; T
j
≤
175 °C
T
mb
= 25 °C
Min
-
-
-
-
Typ
-
-
-
20
Max Unit
100
47
166
28
V
A
W
mΩ
Static characteristics
Avalanche ruggedness
E
DS(AL)S
-
-
45
mJ
Nexperia
BUK7628-100A
N-channel TrenchMOS standard level FET
2. Pinning information
Table 2.
Pin
1
2
3
mb
Pinning information
Symbol Description
G
D
S
D
gate
drain
source
mounting base;
connected to drain
2
1
3
mb
D
Simplified outline
Graphic symbol
G
mbb076
S
SOT404 (D2PAK)
3. Ordering information
Table 3.
Ordering information
Package
Name
BUK7628-100A
D2PAK
Description
plastic single-ended surface-mounted package (D2PAK);
3 leads (one lead cropped)
Version
SOT404
Type number
BUK7628-100A
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 2 — 26 April 2011
2 of 13
Nexperia
BUK7628-100A
N-channel TrenchMOS standard level FET
4. Limiting values
Table 4.
Symbol
V
DS
V
DGR
V
GS
I
D
I
DM
P
tot
T
stg
T
j
I
S
I
SM
E
DS(AL)S
Limiting values
Parameter
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
peak drain current
total power dissipation
storage temperature
junction temperature
source current
peak source current
non-repetitive drain-source
avalanche energy
T
mb
= 25 °C
pulsed; T
mb
= 25 °C
I
D
= 30 A; V
sup
≤
25 V; R
GS
= 50
Ω;
V
GS
= 5 V; T
j(init)
= 25 °C; unclamped
T
mb
= 100 °C
T
mb
= 25 °C
T
mb
= 25 °C; pulsed
T
mb
= 25 °C
Conditions
T
j
≥
25 °C; T
j
≤
175 °C
R
GS
= 20 kΩ
Min
-
-
-20
-
-
-
-
-55
-55
-
-
-
Max
100
100
20
33
47
187
166
175
175
47
187
45
Unit
V
V
V
A
A
A
W
°C
°C
A
A
mJ
In accordance with the Absolute Maximum Rating System (IEC 60134).
Source-drain diode
Avalanche ruggedness
100
P
der
(%)
80
003aaf147
100
I
D
(%)
80
003aaf150
60
60
40
40
20
20
0
0
50
100
150
T
mb
(°C)
200
0
0
50
100
150
T
mb
(°C)
200
V
GS
≥
5 V
Fig 1.
Normalized total power dissipation as a
function of mounting base temperature
Fig 2.
Continuous drain current as a function of
mounting base temperature
BUK7628-100A
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 2 — 26 April 2011
3 of 13
Nexperia
BUK7628-100A
N-channel TrenchMOS standard level FET
10
3
I
DM
(A)
10
2
R
DS(on)
= V
DS
/ I
D
003aaf153
120
WDSS
(%)
003aaf168
t
p
= 1
µs
10
µs
100
µs
D.C.
1 ms
10 ms
100 ms
80
10
40
1
1
10
10
2
V
DS
(V)
10
3
0
20
60
100
140
180
T
(mb)
(°C)
T
mb
= 25 °C; I
DM
is single pulse
Fig 3.
Safe operating area; continuous and peak drain
currents as a function of drain-source voltage
Fig 4.
I
D
= 75 A; unclamped inductive load
Normalised drain-source non-repetitive
avalanche energy rating; avalanche energy as a
function of mounting base temperature
003aaf169
10
2
I
AV
(A)
25
°C
10
T
j
prior to avalanche = 150
°C
1
10
−3
10
−2
10
−1
1
t
AV
(ms)
10
unclamped inductive load
Fig 5.
Single-shot avalanche rating; avalanche current as a function of avalanche period
BUK7628-100A
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 2 — 26 April 2011
4 of 13
Nexperia
BUK7628-100A
N-channel TrenchMOS standard level FET
5. Thermal characteristics
Table 5.
Symbol
R
th(j-mb)
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to mounting base
thermal resistance from
junction to ambient
minimum footprint; FR4 board
Conditions
Min
-
-
Typ
-
50
Max
0.9
-
Unit
K/W
K/W
1
Z
th(j-mb)
(K/W)
10
−1
δ
= 0.5
0.2
0.1
0.05
0.02
10
−2
0
t
p
T
10
−3
10
−7
10
−6
10
−5
10
−4
10
−3
10
−2
10
−1
P
003aaf156
δ
=
t
p
T
t
1
10
t
p
(s)
Fig 6.
Transient thermal impedance from junction to mounting base as a function of pulse duration
BUK7628-100A
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 2 — 26 April 2011
5 of 13
京公网安备 11010802033920号
EEWORLD
