AT45DB321D-SU-2.5-SL383 datasheet, PDF

Datasheet> All Categories > storage> AT45DB321D-SU-2.5-SL383

AT45DB321D-SU-2.5-SL383: DescriptionIC FLASH 32M SPI 50MHZ 8SOIC; Categorystorage; File Size2MB，51 Pages; ManufacturerAdesto Technologies; Environmental Compliance

Download Datasheet Parametric Compare View All

AT45DB321D-SU-2.5-SL383 Overview

IC FLASH 32M SPI 50MHZ 8SOIC

AT45DB321D-SU-2.5-SL383 Parametric

Parameter Name	Attribute value
memory type	non-volatile
memory format	flash memory
technology	FLASH
storage	32Mb (528 bytes x 8192 pages)
Clock frequency	50MHz
Write cycle time - words, pages	6ms
memory interface	SPI
Voltage - Power	2.5 V ~ 3.6 V
Operating temperature	-40°C ~ 85°C（TC）
Installation type	surface mount
Package/casing	8-SOIC (0.209", 5.30mm wide)
Supplier device packaging	8-SOIC

Preview

Download Datasheet

View All

AT45DB321D

32Mb, 2.5V or 2.7V

DataFlash

DATASHEET

(NOT RECOMMENDED FOR NEW DESIGNS. USE AT45DB321E.)

Features

●

Single 2.5V - 3.6V or 2.7V - 3.6V supply

●

RapidS

™

serial interface: 66MHz maximum clock frequency

●

SPI compatible modes 0 and 3

●

User configurable page size

●

512 bytes per page

●

528 bytes per page

●

Page size can be factory preconfigured for 512 bytes

●

Page program operation

●

Intelligent programming operation

●

8,192 pages (512/528 bytes/page) main memory

●

Flexible erase options

●

Page erase (512 bytes)

Block erase (4KB)

Sector erase (64KB)

Chip erase (32Mb)

●

Two SRAM data buffers (512/528 bytes)

●

Allows receiving data while reprogramming the flash array

●

Continuous read capability through entire array

●

Ideal for code shadowing applications

●

Low power dissipation

●

7mA active read current ,typical

●

25µA standby current, typical

●

15µA deep power down, typical

●

Hardware and software data protection features

●

Individual sector

●

Sector lockdown for secure code and data storage

●

Individual sector

●

Security: 128-byte security register

●

64-byte user programmable space

●

Unique 64-byte device identifier

●

JEDEC standard manufacturer and device ID read

●

100,000 program/erase cycles per page, minimum

●

Data retention: 20 years

●

Industrial temperature range

●

Green (Pb/halide-free/RoHS compliant) packaging options

3597U–DFLASH–11/2017

Table 1-1.

Pin Configurations

Asserted

State

Symbol

Name and Function

Type

Chip Select:

Asserting the CS pin selects the device. When the CS pin is deasserted, the

device will be deselected and normally be placed in the standby mode (not deep power-

down mode), and the output pin (SO) will be in a high-impedance state. When the device

is deselected, data will not be accepted on the input pin (SI).

A high-to-low transition on the CS pin is required to start an operation, and a low-to-high

transition is required to end an operation. When ending an internally self-timed operation

such as a program or erase cycle, the device will not enter the standby mode until the

completion of the operation.

Low

Input

SCK

Serial Clock:

This pin is used to provide a clock to the device, and is used to control the

flow of data to and from the device. Command, address, and input data present on the SI

pin are always latched on the rising edge of SCK, while output data on the SO pin are

always clocked out on the falling edge of SCK.

Serial Input:

The SI pin is used to shift data into the device. The SI pin is used for all data

input, including command and address sequences. Data on the SI pin are always latched

on the rising edge of SCK.

Serial Output:

The SO pin is used to shift data out from the device. Data on the SO pin

are always clocked out on the falling edge of SCK.

Write Protect:

When the WP pin is asserted, all sectors specified for protection by the

sector protection register will be protected against program and erase operations,

regardless of whether the enable sector protection command has been issued or not. The

WP pin functions independently of the software controlled protection method. After the

WP pin goes low, the content of the sector protection register cannot be modified.

If a program or erase command is issued to the device while the WP pin is asserted, the

device will simply ignore the command and perform no operation. The device will return to

the idle state once the CS pin has been deasserted. The enable sector protection

command and sector lockdown command, however, will be recognized by the device

when the WP pin is asserted.

The WP pin is internally pulled high, and may be left floating if hardware controlled

protection will not be used. However, it is recommended that the WP pin also be

externally connected to V

whenever possible.

–

Input

–

Input

–

Low

Output

Input

RESET

Reset:

A low state on the reset pin (RESET) will terminate the operation in progress and

reset the internal state machine to an idle state. The device will remain in the reset

condition as long as a low level is present on the RESET pin. Normal operation can

resume once the RESET pin is brought back to a high level.

The device incorporates an internal power-on reset circuit, and so there are no restrictions

on the RESET pin during power-on sequences. If this pin and feature are not utilized, it is

recommended that the RESET pin be driven high externally.

Low

Input

RDY/BUSY

Ready/Busy:

This open drain output pin will be driven low when the device is busy in an

internally self-timed operation. This pin, which is normally in a high state (through

an external pull-up resistor), will be pulled low during programming/erase operations,

compare operations, and page-to-buffer transfers.

The busy status indicates that the flash memory array and one of the buffers cannot be

accessed; read and write operations to the other buffer can still be performed.

–

Output

Device Power Supply:

The V

pin is used to supply the source voltage to the device.

Operations at invalid V

voltages may produce spurious results and should not be

attempted.

–

Power

GND

Ground:

The ground reference for the power supply. GND should be connected to the

system ground.

–

Ground

AT45DB321D [DATASHEET]

3597U–DFLASH–11/2017

Device Operation

The device operation is controlled by instructions from the host processor. The list of instructions and their associated opcodes

are contained in

Table 13-1 on page 24

through

Table 13-7 on page 27.

A valid instruction starts with the falling edge of CS,

followed by the appropriate 8-bit opcode and the desired buffer or main memory address location. While the CS pin is low,

toggling the SCK pin controls the loading of the opcode and the desired buffer or main memory address location through the SI

(serial input) pin. All instructions, addresses, and data are transferred with the most-significant bit (msb) first.

Buffer addressing for the standard DataFlash page size (528 bytes) is referenced in the datasheet using the terminology BFA9

- BFA0 to denote the ten address bits required to designate a byte address within a buffer. Main memory addressing is

referenced using the terminology PA12 - PA0 and BA9 - BA0, where PA12 - PA0 denotes the 13 address bits required to

designate a page address and BA9 - BA0 denotes the ten address bits required to designate a byte address within the page.

For a “power of two” binary page size (512 bytes), the buffer addressing is referenced in the datasheet using the conventional

terminology BFA8 - BFA0 to denote the nine address bits required to designate a byte address within a buffer. Main memory

addressing is referenced using the terminology A21 - A0, where A21 - A9 denotes the 13 address bits required to designate a

page address and A8 - A0 denotes the nine address bits required to designate a byte address within a page.

Read Commands

By specifying the appropriate opcode, data can be read from the main memory or from either one of the two SRAM data buffers.

The DataFlash device supports RapidS protocols for Mode 0 and Mode 3. Please refer to

Section 22., Detailed Bit-level Read

Waveform – RapidS Serial Interface Mode 0/Mode 3

diagrams in this datasheet for details on the clock cycle sequences for

each mode.

4.1

Continuous Array Read (Legacy Command: E8H): Up to 66MHz

By supplying an initial starting address for the main memory array, the continuous array read command can be utilized to

sequentially read a continuous stream of data from the device by simply providing a clock signal; no additional addressing

information or control signals need to be provided. The DataFlash device incorporates an internal address counter that will

automatically increment on every clock cycle, allowing one continuous read operation without the need of additional address

sequences. To perform a continuous read from the standard DataFlash page size (528 bytes), an opcode of E8H must be

clocked into the device, followed by three address bytes (which comprise the 24-bit page and byte address sequence) and four

“don’t care” bytes. The first 13 bits (PA12 - PA0) of the 23-bit address sequence specify which page of the main memory array

to read, and the last 10 bits (BA9 - BA0) of the 23-bit address sequence specify the starting byte address within the page. To

perform a continuous read from the binary page size (512-bytes), the opcode (E8H) must be clocked into the device followed by

three address bytes and four don’t care bytes. The first 13 bits (A21 - A9) of the 22-bit sequence specify which page of the main

memory array to read, and the last 9 bits (A8 - A0) of the 22-bit address sequence specify the starting byte address within the

page. The don’t care bytes that follow the address bytes are needed to initialize the read operation. Following the don’t care

bytes, additional clock pulses on the SCK pin will result in data being output on the SO (serial output) pin.

The CS pin must remain low during the loading of the opcode, the address bytes, the don’t care bytes, and the reading of data.

When the end of a page in main memory is reached during a continuous array read, the device will continue reading at the

beginning of the next page, with no delays incurred during the page boundary crossover (the crossover from the end of one

page to the beginning of the next page). When the last bit in the main memory array has been read, the device will continue

reading back at the beginning of the first page of memory. As with crossing over page boundaries, no delays will be incurred

when wrapping around from the end of the array to the beginning of the array.

A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). The maximum SCK

frequency allowable for the continuous array read is defined by the f

CAR1

specification. The continuous array read bypasses

both data buffers and leaves the contents of the buffers unchanged.

4.2

Continuous Array Read (High Frequency Mode: 0BH): Up to 66MHz

This command can be used with the serial interface to read the main memory array sequentially in high-speed mode for any

clock frequency up to the maximum specified by f

CAR1

. To perform a continuous read array with the page size set to 528 bytes,

CS must first be asserted, and then a 0BH opcode must be clocked into the device, followed by three address bytes and a

dummy byte. The first 13 bits (PA12 - PA0) of the 23-bit address sequence specify which page of the main memory array to

read, and the last 10 bits (BA9 - BA0) of the 23-bit address sequence specify the starting byte address within the page. To

perform a continuous read with the page size set to 512 bytes, the 0BH opcode must be clocked into the device, followed by

three address bytes (A21 - A0) and a dummy byte. Following the dummy byte, additional clock pulses on the SCK pin will result

in data being output on the SO (serial output) pin.

AT45DB321D [DATASHEET]

3597U–DFLASH–11/2017

AT45DB321D-SU-2.5-SL383 Related Products

	AT45DB321D-SU-2.5-SL383	AT45DB321D-CU-SL383
Description	IC FLASH 32M SPI 50MHZ 8SOIC	IC flash 32mbit 66mhz 24cbga

Recommended Resources

Car audio power supply DC-DC converter circuit

Dual remote control circuit a

Current-Voltage Conversion Circuit

Positive 10V reference voltage source circuit diagram with filter

N-phase beat pulse source

How to ensure the accuracy of PCB circuit board milling: The milling technology of PCB circuit board CNC milling machine includes the selection of cutting direction, compensation method, positioning method, frame structure, and cutting point. These are all ...; ESD技术咨询 PCB Design

The new official takes three actions upon taking office: New official takes office, hello everyone, I am the new moderator of the PCB design section~ Actually, the above is a self-introduction and the background of the next conversation~~ I chatted with EE ...; okhxyyo Talking

Windows mobile Camera driver: I have been adjusting the camera driver these days and it is so annoying. Now it won’t even light up. I tracked the print messages. Now there is no prompt for printing messages. When I started adjusti...; 彪哥 Embedded System

Synchronous Serial Interface SSI Application Examples: [i=s]This post was last edited by YHH_LZU on 2016-4-14 20:09[/i] I am learning M4 recently and want to use SSI to make an example to realize sending and receiving. I really don’t know how to do it. Pl...; YHH_LZU Microcontroller MCU

It's shub1986's birthday, everyone cheer~~: Happy birthday shub1986~~ Here is a photo of the whole cake:...; soso Talking

The screen often goes black: I have an HP desktop computer. I don't know why. After using it for a while (about 90 minutes), the screen goes black, as if the power is off. After restarting, it works normally again. Please help me...; wbatjd Embedded System

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components