Multistage
Series
MS2,107,10,10,12,12
Thermoelectric Modules
The MS Series of thermoelectric modules (TEMs) are designed to reach cool down
temperatures that are not achievable with single stage TEMs.
This product line is available in numerous heat pumping capacities, geometric shapes
and temperature differentials. Assembled with Bismuth Telluride semiconductor material and
thermally conductive Aluminum Oxide ceramics, the MS Series is designed for higher current
and lower heat-pumping applications.
• High temperature differential
• Precise temperature control
• Reliable solid state operation
• Environmentally friendly
• DC operation
• RoHS compliant
FEATURES
• CCD cameras
• Electron microscope
• Calibration equipment
• Photonics laser systems
• Gas analyzers
• infrared (IR) Sensors
• Guidance Systems
APPLICATIONS
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C)
Qmax (Watts)
Delta Tmax (°C)
Imax (Amps)
Vmax (Volts)
25
9.6
87
2.9
9.1
SUFFIX THICKNESS
(PRIOR TO TINNING)
00
11
22
0.258”±0.008”
0.246”± 0.008”
0.258”±0.008”
FLATNESS &
PARALLELISM
0.001” / 0.004”
0.001” / 0.002”
0.001” / 0.004”
HOT
FACE
Metallized
Lapped
Pre-tinned
COLD
FACE
Metallized
Lapped
Pre-tinned
LEAD
LENGTH
7.87”
7.87”
7.87”
SEALING OPTION
SUFFIX
RT
EP
SEALANT
RTV
Epoxy
COLOR TEMP RANGE
White
Black
-60 to 204 °C
-55 to 150 °C
DESCRIPTION
Non-corrosive, silicone adhesive sealant
Low density syntactic foam epoxy encapsulant
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
Thermal-AmericasSales@lairdtech.com
www.lairdtech.com
Multistage
Series
MS2,107,10,10,12,12
Thermoelectric Modules
Performance Curves at Th = 25°C
THERMO
4.50
1.0 A
1.5 A
2.0 A
2.5 A
2.9 A
4.00
3.50
3.00
ELECTRIC
10.0
9.0
8.0
7.0
6.0
5.0
Qc (W)
2.50
2.00
1.50
1.00
0.50
0.00
4.0
3.0
2.0
1.0
0.0
100
90
80
70
60
50
40
30
20
10
0
100
90
Delta T (°C)
80
70
60
50
40
Delta T (°C)
+INPUT
(RED)
0.890 ± 0.008
[22.6 ± 0.2MM]
24 AWG UL 1569
-INPUT
(BLACK)
0.890±0.008
[22.6 ± 0.2MM]
COLD FACE
SEE TABLE
HOT FACE
SEE TABLE
96% and 100% Alumina Ceramics
• Max Operating Temperature: 80°C
• Do not exceed Imax or Vmax when
operating module
OPERATING TIPS
• Reference assembly guidelines for
recommended installation
• Solder tinning also available on
metallized ceramics
THR-DS-MS2,107,10,10,12,12 070215
Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use
and application of Laird materials rests with the end user, since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to the fitness,
merchantability or suitability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc or any of its affiliates or agents shall not be
liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time
to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Logo, and
other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of
third parties. Nothing herein provides a license under any Laird or any third party intellectual property rights.
THICKNESS
SEE TABLE
Voltage (V)
GD32 MCU
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