Default packaging is “Bulk Bag.” An ordering code C-Spec is not required for “Bulk Bag” packaging.
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking.”
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information.”
3
Reeling tape options (paper or plastic) are dependent on capacitor case size (l" x w") and thickness dimensions. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information.”
3
For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3
All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices.
For more information see "Capacitor Marking.”
Benefits
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
AEC–Q200 automotive qualified
Low dissipation factor DF < 0.1%
Low noise solution similar to C0G
Low ESR and ESL
High thermal stability
High ripple current capability
Preferred capacitance solution at line frequencies and into the MHz range
Retains over 99% of nominal capacitance at full rated voltage
Small predictable and linear capacitance change with respect to temperature
I am currently developing and producing an external digital battery, mainly used for powering or charging laptops, cameras, mobile phones, MP3 and MP4. I would like to publish it in this forum, hoping...
#include#define data00 P1 #define uchar unsigned char uchar recddata=0x00,datastore[6]={0x20,0x20,0x20,0x20,0x20,0x20},i=1,j=0; //i is the datastore data packet variable, j is the current position to ...
[i=s]This post was last edited by paulhyde on 2014-9-15 09:26[/i] Hi everyone, I am working on the SPI communication between FPGA and MCU recently, and it is giving me a headache. I have searched for ...
I have a question about USART. How do I send the specified 9th bit of data in STM32F103? This is the 9th bit of data implemented in 51 (the difference between multi-machine communication address and d...
As the title says, I am using CCSv3.3, C6713 simulator. It takes several minutes to run a program with a large amount of calculations. It only takes one or two seconds to run it directly under Windows...
TI Automotive Intelligent Processor : https://training.eeworld.com.cn/course/80Part 1: Introduction to TI's automotive application processors? ? Automotive electronics is an area where TI focuses on i...
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
In recent years, with the increasing demand for manufacturing and automated production management, industrial barcode scanners have gradually become an indispensable part of the industrial manufact...[Details]
If the ultimate form of a car is a silicon-based life form, then in
the field of
intelligent driving
, it has gradually taken on the appearance of a "veteran driver." In
the field of
the ...[Details]
Abstract:
With the increasing complexity of smart vehicle electrical and electronic architectures, the full lifecycle management of vehicle electronic control components faces multiple challe...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
According to foreign media reports, researchers at the University of Surrey have developed an artificial intelligence system that can accurately locate the location of equipment in densely populate...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
Recently, South Korean robotics giant WIRobotics launched its first general-purpose humanoid robot, ALLEX, at the Robotics Innovation Center (RIH) at the Korea University of Science and Technology....[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
HTTP is the abbreviation of Hypertext Transfer Protocol. It is an application protocol based on TCP/IP communication protocol used to transmit HTML and image files. It is an application-level objec...[Details]
For today's new energy vehicles, they have different configurations from fuel vehicles, and some configurations have also become a selling point for manufacturers. Compared with traditional vehicle...[Details]
Power technology
京公网安备 11010802033920号
EEWORLD
