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ZSSC3018BA2D ES

Description
DICE (WAFER SAWN) - WAFFLE PACK
Categoryunclassified   
File Size1MB,50 Pages
ManufacturerIDT (Integrated Device Technology, Inc.)
Websitehttp://www.idt.com/
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ZSSC3018BA2D ES Overview

DICE (WAFER SAWN) - WAFFLE PACK

Versatile, High Resolution 18-Bit
Sensor Signal Conditioner
Brief Description
The ZSSC3018 is a sensor signal conditioner (SSC) integrated
circuit for high-accuracy amplification and analog-to-digital
conversion of differential or pseudo-differential input signals.
Designed for high-resolution sensor module applications, the
ZSSC3018 can perform offset, span, and 1
st
and 2
nd
order
temperature compensation of the measured signal. Developed for
correction of resistive bridge or absolute voltage sensors, it can
also provide a corrected temperature output measured with an
internal sensor.
The measured and corrected sensor values are provided at the
digital output pins, which can be configured as I
2
C (≤ 3.4MHz) or
SPI (≤ 10MHz). Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via a 26-bit
internal digital signal processor (DSP) running a correction
algorithm. Calibration coefficients are stored on-chip in a highly
reliable, non-volatile, multiple-time programmable (MTP) memory.
Programming the ZSSC3018 is simple via the serial interface. The
interface is used for the PC-controlled calibration procedure,
which programs the set of calibration coefficients in memory. The
ZSSC3018 provides accelerated signal processing, increased
resolution, and improved noise immunity in order to support high-
speed control, safety, and real-time sensing applications with the
highest requirements for energy efficiency.
ZSSC3018
Datasheet
Benefits
Integrated 26-bit calibration math DSP
Fully corrected signal at digital output
Layout customized for die-die bonding with sensor for high-
density chip-on-board assembly
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering components required
Highly integrated CMOS design
Integrated reprogrammable non-volatile memory
Excellent for low-voltage and low-power battery applications
Optimized for operation in calibrated resistive sensor
(e.g., pressure) or calibrated absolute voltage sensor
(e.g., thermopile) modules
Physical Characteristics
Supply voltage range: 1.68V to 3.6V
Current consumption: ~1.0mA (typical) in operating mode
Features
Flexible, programmable analog front-end design; up to 18-bit
analog-to-digital converter (ADC)
Fully programmable gain amplifier with gain range from 6.6 to
216 (linear)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset; 1
st
and 2
nd
order digital compensation of sensor gain as well as of 1
st
and 2
nd
order temperature gain and offset drift
Programmable interrupt operation
High-speed sensing: e.g., 16-bit conditioned sensor signal
measurement rate >500s
-1
Typical sensor system can achieve an accuracy of better than
±
0.10% FSO*
@
-40 to 125°C
Sleep Mode current: 50nA (typical) at
125°C;
20nA (typical)
at
85°C
Temperature resolution: <0.003K/LSB
Best-in-class energy-efficiency:
with 16-bit resolution: <140pJ/step
with 18-bit resolution: <50pJ/step
Operation temperature: –40°C to +125°C
Delivery options: die or 24-PQFN (4 x 4 mm) package
*
FSO = Full Scale Output.
ZSSC3018 Application Example
Sensor Bridge
VDD
GND
ZSSC3018
24-PQFN
EOC
MISO
MOSI/SDA
SCLK/SCL
SS
© 2017 Integrated Device Technology, Inc
1
January 10, 2017

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Description DICE (WAFER SAWN) - WAFFLE PACK WAFER (UNSAWN) - BOX DICE (WAFER SAWN) - FRAME SENSOR SIGNAL CONDITIONER ZSSC3018KIT EVALUATION KIT V1.0

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