EEWORLDEEWORLDEEWORLD

Part Number

Search

MCIMX6X1AVO08AC

Description
I.MX6SX AUTO ROM P ENHAN
Categorysemiconductor    The embedded processor and controller   
File Size3MB,208 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MCIMX6X1AVO08AC Online Shopping

Suppliers Part Number Price MOQ In stock  
MCIMX6X1AVO08AC - - View Buy Now

MCIMX6X1AVO08AC Overview

I.MX6SX AUTO ROM P ENHAN

MCIMX6X1AVO08AC Parametric

Parameter NameAttribute value
core processorARM® Cortex®-A9,ARM® Cortex®-M4
Number of cores/bus width2 코어, 32 bits
speed200MHz,800MHz
Coprocessor/DSPMultimedia; NEON™ MPE
RAM controllerLPDDR2,LVDDR3,DDR3
graphics accelerationnone
display and interface controllerKeypad, LCD
Ethernet10/100/1000 Mbps(2)
SATA-
USBUSB 2.0 + PHY(1),USB 2.0 OTG + PHY(2)
Voltage - I/O1.8V,2.5V,2.8V,3.15V
Operating temperature-40°C ~ 125°C (TJ)
security featuresA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SXAEC
Rev. 3, 09/2017
MCIMX6XxAxxxxxB
MCIMX6XxAxxxxxC
i.MX 6SoloX
Automotive
and Infotainment
Applications Processors
Package Information
Plastic Package
BGA 19 x 19 mm, 0.8 mm pitch
BGA 17 x 17 mm, 0.8 mm pitch
BGA 14 x 14 mm, 0.65 mm pitch
Ordering Information
See
Table 1 on page 3
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Special Signal Considerations . . . . . . . . . . . . . . . 19
3.2 Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21
4.2 Power Supplies Requirements and Restrictions . 34
4.3 Integrated LDO Voltage Regulator Parameters . . 35
4.4 PLL Electrical Characteristics. . . . . . . . . . . . . . . . 37
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . 38
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44
4.8 Output Buffer Impedance Parameters . . . . . . . . . 47
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 50
4.10 Multi-mode DDR Controller (MMDC) . . . . . . . . . . 62
4.11 General-Purpose Media Interface (GPMI) Timing 63
4.12 External Peripheral Interface Parameters . . . . . . 71
4.13 A/D Converter. . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 120
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . 120
5.2 Boot Device Interface Allocation . . . . . . . . . . . . 122
Package Information and Contact Assignments . . . . . 130
6.1 i.MX 6SoloX Signal Availability by Package . . . . 130
6.2 Signals with Different States During Reset and After
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
6.3 19x19 mm Package Information. . . . . . . . . . . . . 133
6.4 17x17 mm Package Information. . . . . . . . . . . . . 152
6.5 14x14 mm Package Information. . . . . . . . . . . . . 187
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
1
Introduction
2
3
The i.MX 6SoloX automotive and infotainment
processors represent NXP Semiconductor’s latest
achievement in integrated multimedia-focused products
offering high-performance processing with a high degree
of functional integration. These processors are designed
considering the needs of the growing automotive
infotainment, telematics, HMI, and display-based cluster
markets.
The i.MX 6SoloX processor features NXP’s advanced
implementation of the single ARM
®
Cortex
®
-A9 core,
which operates at speeds of up to 800 MHz, in addition
to the ARM Cortex-M4 core, which operates at speeds of
up to 227 MHz. This type of heterogeneous multicore
architecture provides greater levels of system
integration, smart low-power system awareness, and fast
real-time responsiveness. The i.MX 6SoloX includes a
GPU processor capable of supporting 2D and 3D
4
5
6
7
© 2015-2017 NXP B.V.

MCIMX6X1AVO08AC Related Products

MCIMX6X1AVO08AC MCIMX6X2AVN08AB MCIMX6X1AVK08AB MCIMX6X1AVO08ACR MCIMX6X4AVM08ACR MCIMX6X1AVK08AC MCIMX6X2AVN08AC MCIMX6X4AVM08AC
Description I.MX6SX AUTO ROM P ENHAN Multilayer Ceramic Capacitors MLCC - SMD/SMT 0805 47uF 10volts X5R +/-20% Processors - Application Specialized i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 800MHz, ARM Cortex-M4 core, 166MHz, BGA I.MX6SX AUTO ROM P ENHAN I.MX6SX ROM PERF ENHAN .MX 6SX ROM PERF ENHAN I.MX 6SX ROM PERF ENHAN I.MX6SX ROM PERF ENHAN

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 591  1711  1093  2217  2709  12  35  22  45  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号