TMS320C6211GFN150 datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> TMS320C6211GFN150

TMS320C6211GFN150: DescriptionIC FIXED-POINT DSP 256-BGA; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，88 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS320C6211GFN150 Overview

IC FIXED-POINT DSP 256-BGA

TMS320C6211GFN150 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	BGA, BGA272,20X20,50
Contacts	256
Reach Compliance Code	not_compliant
ECCN code	3A001.A.3
Factory Lead Time	1 week
Other features	ALSO REQUIRES 3.3V I/O SUPPLY
Address bus width	22
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	150 MHz
External data bus width	32
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B256
length	27 mm
low power mode	YES
Number of terminals	256
Maximum operating temperature	90 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA272,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8,3.3 V
Certification status	Not Qualified
RAM (number of words)	1024
Maximum seat height	2.32 mm
Maximum supply voltage	1.89 V
Minimum supply voltage	1.71 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

TMS320C6211GFN150 Related Products

	TMS320C6211GFN150	TMS320C6211BGFN150	TMS320C6211BGFN167	TMS32C6211BGFNA150
Description	IC FIXED-POINT DSP 256-BGA	Fixed-Point Digital Signal Processor 256-BGA	Fixed-Point Digital Signal Processor 256-BGA	Fixed-Point Digital Signal Processor 256-BGA
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	BGA, BGA272,20X20,50	BGA, BGA256,20X20,50	BGA, BGA256,20X20,50	BGA, BGA256,20X20,50
Contacts	256	256	256	256
Reach Compliance Code	not_compliant	_compli	_compli	_compli
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Factory Lead Time	1 week	6 weeks	1 week	1 week
Other features	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY
Address bus width	22	22	22	22
barrel shifter	NO	NO	NO	NO
bit size	32	32	32	32
boundary scan	YES	YES	YES	YES
maximum clock frequency	150 MHz	150 MHz	167 MHz	150 MHz
External data bus width	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
length	27 mm	27 mm	27 mm	27 mm
low power mode	YES	YES	YES	YES
Number of terminals	256	256	256	256
Maximum operating temperature	90 °C	90 °C	90 °C	105 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA272,20X20,50	BGA256,20X20,50	BGA256,20X20,50	BGA256,20X20,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	220	220	220
power supply	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	1024	4096	4096	1024
Maximum seat height	2.32 mm	2.32 mm	2.32 mm	2.32 mm
Maximum supply voltage	1.89 V	1.89 V	1.89 V	1.89 V
Minimum supply voltage	1.71 V	1.71 V	1.71 V	1.71 V
Nominal supply voltage	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	27 mm	27 mm	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Maker	-	Texas Instruments	Texas Instruments	Texas Instruments
JESD-609 code	-	e0	e0	e0
Humidity sensitivity level	-	4	4	4
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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