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AR18-HZL/07-TT

Description
CONN IC DIP SOCKET 18POS GOLD
CategoryThe connector   
File Size134KB,2 Pages
ManufacturerASSMANN WSW components
Download Datasheet Parametric View All

AR18-HZL/07-TT Overview

CONN IC DIP SOCKET 18POS GOLD

AR18-HZL/07-TT Parametric

Parameter NameAttribute value
typeDIP, 0.3" (7.62mm) line spacing
Number of pins or pins (grid)18(2 x 9)
Spacing - Mating0.100"(2.54mm)
Contact surface treatment - matinggold
Contact Surface Treatment Thickness - Mating30.0µin(0.76µm)
Contact Material - Matingcopper beryllium
Installation typeThrough hole
characteristicopen framework
Terminationwelding
spacing-column0.100"(2.54mm)
Contact Surface Preparation - Columntin
Contact Surface Treatment Thickness - Column200.0µin(5.08µm)
Contact Material - Pillarcopper beryllium
Shell materialthermoplastic, polyester
Operating temperature-40°C ~ 105°C
Termination post length-
Material flammability ratingUL94 V-0
Rated current3A
Contact resistance4 milliohms
1
4
A
3
3
3
2
3
5
6
7
B
3
C
D
3
NOTES:
MATERIAL
1.Pin(outer sleeve): Brass, machined CuZn38Pb2
3
2.Clip(contact 4 finger): Beryllium copper, heat treated
3.Plating(outer sleeve): HZL: 2um/80u"nickel, 5um/200u"Tin
HGL: 2um/80u"nickel, Gold flash
4.Plating(contact): 2um/80u"nickel, Gold flash or 10u", 30u" Gold
5.Insulator Material: Glass filled PBT, UL94V-0 Black
ELECTRICAL
1.Current Rating: 3Amps/contact max.
2.Contact Resistance: 4mΩ/contact max.
3.Insulation Resistance: ≥10000MΩ at 500VAC
4.Operating Voltage: 100 VRMS/150VDC
MECHANICAL
1.Average Insertion force with steel pin of
0.43mm/0.017": <250g
2.Average Withdrawal force with steel pin of
0.43mm/0.017": >50g min.
3.Mechanical life cycle: 200 min.
4.Operation Temperature: -40°C to +105°C
5.Wave Soldering temperature: +245°C, 5-10s max.
4
A
B
C
D
Packing: Tube
Order Code:
E
No. of contact
06 ~ 64
Versions
-TT
/7-TT
Plating
HZL
HZL/01
HZL/07
HGL
AR xx- x x
- Standard
- Only for 24+28 poles*
(Dim C: 7.62)
outer sleeve / contact
- Sleeve tin / clip gold flash
- Sleeve tin / clip 10u" gold
- Sleeve tin / clip 30u" gold
- Sleeve gold flash / clip gold flash
F
2
PCB LAYOUT
Contact
06
08
10
14
16
18
20
22
24*
24
28*
Dim A
7.62
10.16
12.70
17.78
20.32
22.86
25.40
27.94
30.48
30.48
35.56
Dim B
5.08
7.62
10.16
15.24
17.78
20.32
22.86
25.40
27.94
27.94
33.02
Dim C
7.62
7.62
7.62
7.62
7.62
7.62
7.62
10.16
7.62
15.24
7.62
Dim D
Note 3
10.16
10.16
10.16 w/o bar
10.16
10.16
10.16
10.16
12.70
10.16 with bar
17.78
10.16
E
F
Scale
X.
X.X
Free
TOLERANCE
4
Update wave solder temp.
16.08.2017
Amy
Drawn
Date
23.07.2012
28
32
35.56
40.64
33.02
38.10
15.24
15.24
17.78
17.78
RoHS compliant
Unit:mm
Name
Customer-No.
G
Lucas
±0.50
±0.30
3 Update to new drawing
G
28.10.2016
Amy
Approved
16.08.2017
Amy
ASSMANN WSW-No.
±0.20
2 Add "HGL"-Version,corrected P/N code 28.01.2014 A. Plate
X.XX
X.XXX ±0.10
1
Add sheet 2
16.08.2012
Lucas
AR xx-x x
DIM
Angle
Angle
TOL
Drawing-No.
H
1
2
±
TOL
0
Id.
Drawn
Modification
23.07.2012
Date
Lucas
Name
ASS 4852 CO
rev04
H
3
4
5
Replace
Sheet
1/2
6
7

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Index Files: 2555  2597  198  2658  2499  52  53  4  54  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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