EEWORLDEEWORLDEEWORLD

Part Number

Search

BM20B(0.6)-34DS-0.4V(53)

Description
CONN RCPT 34POS 0.4MM SMD
CategoryThe connector   
File Size2MB,12 Pages
ManufacturerHirose Electric
Environmental Compliance
Download Datasheet Parametric View All

BM20B(0.6)-34DS-0.4V(53) Overview

CONN RCPT 34POS 0.4MM SMD

BM20B(0.6)-34DS-0.4V(53) Parametric

Parameter NameAttribute value
Connector typeSocket with central contact
Number of pins34
spacing0.016"(0.40mm)
Number of rows2
Installation typesurface mount
characteristicFixed solder tail
Contact platinggold
Contact plating thickness2.00µin(0.051µm)
Joint stack height0.6mm
board height0.024"(0.61mm)
0.4 mm Pitch, 0.6 and 0.8 mm Height, Board-to-Board and Board-to-FPC Connectors
BM20 Series
■Receptacle
Existing products
BM20
2.3mm
2.98mm
2.46mm
10.4mm
10.48mm
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
A 22.3%
reduction
Existing products
in size!
BM20
2.98 ∞ 10.4
=About 31.0mm
2
2.3 ∞ 10.48
= About 24.1mm
2
BM20
■Header
Existing products
■Features
1. High density mounting capability
A space saving design that keeps the connector
compact, but still maintains an adequate vacuum
area (no less than 0.7mm wide).
Depth DS: 2.3 mm DP: 1.78 mm
9.32mm
9.4mm
Board occupied area
A 27.1%
reduction
Existing products
in size!
2. Reliable contact performance
Even though the mated height is low, the BM20 still
leads it class in maximum effective mating lengths
for each mating height.
<Effective Mating Length>
Height 0.8 mm: 0.2 mm
Height 0.6 mm: 0.15 mm
The addition of the two point contact system adds
more reliability to the contacts.
BM20
2.46 ∞ 9.32
= About 22.9mm
2
1.78 ∞ 9.4
= About 16.7mm
2
Vaccum pick-up
3. No restrictions to PCB pattern design
for the 0.8 mm height connector
*1
This series utilizes a thin wall to insulate the
bottom surface of the connector and maintains an
effective mating length of 0.2 mm. This removes
any restriction for PCB pattern layout design
under the connector.
Note *1: There are some restrictions for the 0.6
mm height style.
Mating diagram (cross section)
H=0.8
2-point contact
structure
Molded Bottom
surface structure
4. Enhanced mating operations
The structure uses guide ribs to ease the mating
process and offers a self alignment range of up to
0.3 mm. A clear tactile click is used as an
indicator to the user that the mating process was
completed.
5. Drop and shock resistant structure
Dimples were designed into the contacts to
increase their retention force and to absorb the
shock delivered from a drop or other impact.
6. Debris resisting design
When mated, the connector’s design covers the
contacts which help to keep dust and other debris
away from the contacts. The SMT leads are kept
very close to the connector housing which also
helps to prevent shorts caused by debris on the
exposed contacts
H=0.6
Molded Bottom
surface structure
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
1.78
mm
2013.11②
1
Siemens LOGO! Question
I am new to simens logo!, and I have a question! Function I1 is the start/stop function interface. When I1 is high, Q1 is sent out, otherwise it is not sent out. Now it is required that Q1 is sent out...
fiercewind Embedded System
Communication problem between gprs module and microcontroller
[size=3]Recently I have been studying the communication problem between GPRS and microcontrollers..[/size] [size=3]When sending AT commands to the microcontroller[/size] [size=3]the dialed number[colo...
cjz021139 MCU
【SensorTag】Get familiar with SensorTag APP
I received the SensorTag for a while and have been working on it intermittently. I even bought a new Sony Z to get it, but the headphones were not very good, so I bought AKG 420 headphones, which caus...
mlyxlpk007 Wireless Connectivity
A software decoding method for infrared remote control based on single chip microcomputer
Abstract: This paper discusses in detail the modulation and coding methods of infrared remote control data, designs an infrared remote control decoding scheme based on MCS-51 single chip microcomputer...
xtss MCU
Grounding experience in multi-layer PCB design
According to the rule of thumb, four-layer boards are usually used in high-density and high-frequency situations, which are more than 20DB better than two-layer boards in terms of EMC. Under the condi...
ohahaha PCB Design
Strange phenomenon about ddraw: the screen can only be refreshed normally when connected to activesync
Windows Mobile 6.0 system uses ddraw, creates DDSCAPS_PRIMARYSURFACE, then locks, writes buffer, unlocks, and the return values are all correct. However, the screen can only be refreshed normally when...
gjenny Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 717  1720  1274  444  2281  15  35  26  9  46 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号