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DL5257B-TP

Description
DIODE ZENER 33V 500MW MINIMELF
Categorysemiconductor    Discrete semiconductor   
File Size627KB,5 Pages
ManufacturerMicro Commercial Co
Environmental Compliance
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DL5257B-TP Overview

DIODE ZENER 33V 500MW MINIMELF

DL5257B-TP Parametric

Parameter NameAttribute value
Voltage - Zener (nominal) (Vz)33V
Tolerance±5%
Power - Max500mW
Impedance (max) (Zzt)58 Ohms
Current at different Vr - Reverse leakage current100nA @ 25V
Voltage at different If - Forward (Vf1.1V @ 200mA
Operating temperature-65°C ~ 175°C
Installation typesurface mount
Package/casingDO-213AC, MINI-MELF, SOD-80
Supplier device packagingMini MELF
M
CC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

  !"#
$ %    !"#
DL5221
THRU
DL5267
500 mW
Zener Diode
2.4 to
75
Volts
MINIMELF
Cathode Mark
Features
Wide Voltage Range Available
Glass Package
High Temp Soldering: 260°C for 10 Seconds At Terminals
Surface Mount Package
Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
Compliant. See ordering information)
Marking
:
Cathode band denotes polarity
Maximum Ratings
Operating Temperature: -65°C to +175°C
Storage Temperature: -65°C to +175°C
500 mWatt DC Power Dissipation
Power Derating: 4.0mW/°C above 50°C
Forward Voltage @ 200mA: 1.1 Volts
Moisture Sensitivity Level 1
Figure 1 - Typical Capacitance
100
C
B
A
pf
10
At zero volts
At –2 Volts V
R
INCHES
MIN
.130
.008
.055
DIMENSIONS
MM
MIN
3.30
.20
1.40
1
0
100
V
Z
Typical Capacitance (pf) –
versus
– Zener voltage (V
Z
)
Figure 2 - Derating Curve
200
DIM
A
B
C
MAX
.146
.016
.059
MAX
3.70
.40
1.50
NOTE
SUGGESTED SOLDER
PAD LAYOUT
400
0.105
mW
200
0.075”
0.030”
75
150 175 225
Temperature
°C
Power Dissipation (mW) -
Versus
- Ambient Temperature
°C
Note:1.Lead in Glass Exemption Applied, see EU Directive Annex 5.
0
Revision:
A
www
.
mccsemi
.
com
1 of
5
2011/01/01
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