2. Zener voltage is measured with a pulse test current I
Z
at an ambient temperature of 25°C.
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2
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
TYPICAL CHARACTERISTICS
1000
T
J
= 25°C
I
Z(AC)
= 0.1 I
Z(DC)
f = 1 kHz
1000
IF, FORWARD CURRENT (mA)
Z ZT , DYNAMIC IMPEDANCE (
Ω
)
100
100
I
Z
= 1 mA
10
5 mA
10
150°C
75°C
1.0
3.0
10
V
Z
, NOMINAL ZENER VOLTAGE
80
0.4
0.5
25°C
0°C
1.1
1.2
1.0
0.6
0.7
0.8
0.9
1.0
V
F
, FORWARD VOLTAGE (V)
Figure 1. Effect of Zener Voltage on Zener Impedance
Figure 2. Typical Forward Voltage
1000
T
A
= 25°C
C, CAPACITANCE (pF)
0 V BIAS
1 V BIAS
IR, LEAKAGE CURRENT (
μ
A)
1000
100
10
1.0
0.1
0.01
+ 25°C
−55°C
0
10
20
30
40
50
60
V
Z
, NOMINAL ZENER VOLTAGE (V)
70
+150°C
100
10
BIAS AT
50% OF V
Z
NOM
0.001
0.0001
1.0
4.0
10
V
Z
, NOMINAL ZENER VOLTAGE (V)
70
0.00001
Figure 3. Typical Capacitance
Figure 4. Typical Leakage Current
100
T
A
= 25°C
I Z , ZENER CURRENT (mA)
100
IZ , ZENER CURRENT (mA)
T
A
= 25°C
10
10
1.0
1
0.1
0.1
0.01
0.01
0
2.0
4.0
6.0
8.0
V
Z
, ZENER VOLTAGE (V)
10
12
10
30
50
70
V
Z
, ZENER VOLTAGE (V)
90
Figure 5. Zener Voltage versus Zener Current
(V
Z
Up to 12 V)
Figure 6. Zener Voltage versus Zener Current
(12 V to 75 V)
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3
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
TYPICAL CHARACTERISTICS
100
80
POWER DISSIPATION (%)
60
40
20
0
0
25
50
75
100
TEMPERATURE (°C)
125
150
Figure 7. Steady State Power Derating
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4
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1
0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C
0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
H
E
2.30
2.50
2.70
STYLE 1:
PIN 1. CATHODE
2. ANODE
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
H
E
D
b
1
2
E
MIN
0.031
0.000
A3
A
L
NOTE 5
C
NOTE 3
A1
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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