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PIC18F24K42-I/MV

Description
IC MCU 8BIT 16KB FLASH 28UQFN
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size8MB,771 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance  
Download Datasheet Download user manual Parametric View All

PIC18F24K42-I/MV Overview

IC MCU 8BIT 16KB FLASH 28UQFN

PIC18F24K42-I/MV Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid8252160347
package instructionHVQCCN, LCC28,.16SQ,16
Reach Compliance Codecompliant
Country Of OriginThailand
ECCN code3A991.A.2
Factory Lead Time4 weeks
Date Of Intro2017-02-03
Samacsys Description8-bit Microcontrollers - MCU 16KB Flash, 1KB RAM, 256B EEPROM, 12-bit ADC2, Vector Interrupts, DMA, MAP, DIA, DAC, Comp, PWM, CWG, HLT, WWDT, SCAN/CRC, ZCD, PPS, UART, SPI/I2C, IDLE/DOZE/PMD
Samacsys ManufacturerMicrochip
Samacsys Modified On2023-03-07 16:10:32
YTEOL24.48
Has ADCYES
Other featuresALSO OPERATES 2.5 V MINIMUM SUPPLY AT 32 MHZ AND 2.3 V MINIMUM SUPPLY AT 16 MHZ
Address bus width
bit size8
boundary scanNO
CPU seriesPIC18
maximum clock frequency64 MHz
DAC channelYES
DMA channelYES
External data bus width
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeS-PQCC-N28
JESD-609 codee3
length4 mm
low power modeYES
Number of DMA channels2
Number of external interrupt devices3
Number of I/O lines25
Number of serial I/Os2
Number of terminals28
Number of timers10
On-chip data RAM width8
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC28,.16SQ,16
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
RAM (bytes)1024
rom(word)16384
ROM programmabilityFLASH
Maximum seat height0.55 mm
speed64 MHz
Maximum slew rate0.95 mA
Maximum supply voltage5.5 V
Minimum supply voltage3 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formNO LEAD
Terminal pitch0.4 mm
Terminal locationQUAD
width4 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
PIC18(L)F24/25K42
28-Pin, Low-Power High-Performance Microcontrollers with
XLP Technology
Description
The PIC18(L)F24/25K42 microcontrollers are available in 28-pin devices. These devices feature a 12-bit ADC with
Computation (ADC
2
) automating Capacitive Voltage Divider (CVD) techniques for advanced touch sensing, averaging,
filtering, oversampling and threshold comparison, Temperature Sensor, Vectored Interrupt Controller with fixed latency
for handling interrupts, System Bus Arbiter, Direct Memory Access capabilities, UART with support for Asynchronous,
DMX, DALI and LIN transmissions, SPI, I
2
C, memory features like Memory Access Partition (MAP) to support
customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory
calibration values to help improve temperature sensor accuracy.
Core Features
• C Compiler Optimized RISC Architecture
• Operating Speed:
- Up to 64 MHz clock input
- 62.5 ns minimum instruction cycle
• Two Direct Memory Access (DMA) Controllers
- Data transfers to SFR/GPR spaces from
either Program Flash Memory, Data
EEPROM or SFR/GPR spaces
- User-programmable source and destination
sizes
- Hardware and software-triggered data
transfers
• System Bus Arbiter with User-Configurable
Priorities for Scanner and DMA1/DMA2 with
respect to the main line and interrupt execution
• Vectored Interrupt Capability
- Selectable high/low priority
- Fixed interrupt latency
- Programmable vector table base address
• 31-Level Deep Hardware Stack
• Low-Current Power-on Reset (POR)
• Configurable Power-up Timer (PWRT)
• Brown-Out Reset (BOR)
• Low-Power BOR (LPBOR) Option
• Windowed Watchdog Timer (WWDT)
- Variable prescaler selection
- Variable window size selection
- Configurable in hardware or software
Memory
Up to 128 KB Flash Program Memory
Up to 8 KB Data SRAM Memory
Up to 1 KB Data EEPROM
Memory Access Partition (MAP)
- Configurable boot and app region sizes with
individual write-protections
• Programmable Code Protection
• Device Information Area (DIA) stores:
- Unique IDs and Device IDs
- Temp Sensor factory-calibrated data
- Fixed Voltage Reference calibrated data
• Device Configuration Information (DCI) stores:
- Erase row size
- Number of write latches per row
- Number of user rows
- Data EEPROM memory size
- Pin count
Operating Characteristics
• Operating Voltage Range:
- 1.8V to 3.6V (PIC18LF24/25K42)
- 2.3V to 5.5V (PIC18F24/25K42)
• Temperature Range:
- Industrial: -40°C to 85°C
- Extended: -40°C to 125°C
Power-Saving Functionality
• DOZE mode: Ability to run CPU core slower than
the system clock
• IDLE mode: Ability to halt CPU core while internal
peripherals continue operating
• SLEEP mode: Lowest power consumption
• Peripheral Module Disable (PMD):
- Ability to disable unused peripherals to
minimize power consumption
2016-2018 Microchip Technology Inc.
Preliminary
DS40001869C-page 1

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