EEWORLDEEWORLDEEWORLD

Part Number

Search

RCP0603W47R0GS2

Description
RES SMD 47 OHM 2% 1.5W 0603
CategoryPassive components   
File Size93KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

RCP0603W47R0GS2 Overview

RES SMD 47 OHM 2% 1.5W 0603

RCP0603W47R0GS2 Parametric

Parameter NameAttribute value
resistance47 Ohms
Tolerance±2%
Power (W)1.5W
componentthick film
characteristicMoisture proof
Temperature Coefficient±150ppm/°C
Operating temperature-55°C ~ 155°C
Package/casing0603 (1608 Metric)
Supplier device packaging603
size/dimensions0.063" long x 0.032" wide (1.60mm x 0.81mm)
Height - Installation (maximum)0.023"(0.58mm)
Number of terminals2
failure rate-
RCP
www.vishay.com
Vishay Dale
Thick Film Chip Resistors, Industrial, High Power,
Aluminum Nitride Substrate
FEATURES
• Thick film resistive element on an aluminum
nitride (AlN) substrates
• Very high thermal conductivity in a small
package size
• Termination: tin / lead wraparound termination
over nickel barrier. Also available with
lead (Pb)-free wraparound terminations.
Aluminum nitride
over 3 x more power - same size
• Capability to develop specific reliability
programs designed to customer requirements
• Operating temperature range: -65 °C to +155 °C
• High frequency performance to 6 GHz
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Available
Available
MATERIAL SPECIFICATIONS
Resistive element
Encapsulation
Substrate
Termination
Solder finish
Ruthenium oxide
Epoxy
Aluminum nitride
Solder-coated nickel barrier
Pure tin or tin / lead solder alloy
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL
MODEL
RCP0505
RCP0603
RCP1206
RCP2512
CASE
SIZE
0505
0603
1206
2512
POWER RATING
(1)
(Standard
Board Mount)
P
25 °C
W
1.4
1.5
2.4
3.5
POWER RATING
(1)
(Active
Temperature
Control)
W
5.0
3.9
11
22
MAXIMUM
WORKING
VOLTAGE
V
PxR
PxR
PxR
PxR
RESISTANCE
RANGE
10 to 2K
10 to 2K
10 to 2K
10 to 2K
TOLERANCE
±%
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
TEMPERATURE
COEFFICIENT
± ppm/°C
150
150
150
150
Notes
• Consult factory for availability of additional case sizes
(1)
The power rating depends on the maximum temperature of the resistive element. The temperature of the resistive element and adjacent
materials will rise due to the power dissipation of the resistor. The majority of this heat/energy is dissipated by conduction through the
substrate, terminations, solder joints, and printed circuit board. The maximum power rating in a particular application only applies if the
temperature of the resistive element is maintained at or below 155 °C
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: RCP1206W100RGWB (preferred part numbering format)
R
GLOBAL
MODEL
RCP0505
RCP0603
RCP1206
RCP2512
C
P
1
2
0
6
W
1
0
0
R
G
W
B
SPECIAL
Blank = standard
(dash number)
(up to 3 digits)
from
1 to 999
as
applicable
BOTTOM TERM.
W
= wide
B
= traditional
RESISTANCE
VALUE
R=
K = k
10R0
= 10
1K30
= 1.3 k
TOLERANCE
CODE
F
=±1%
G
=±2%
J
=±5%
PACKAGING CODE
TP
= tin / lead, T/R (full reel)
S3
= tin / lead, T/R (1000 pieces)
WB
= tin / lead, tray
S2
= tin / lead, T/R (500 pieces)
S6
= tin / lead, T/R (300 pieces)
EA
= lead (Pb)-free, T/R (full reel)
EB
= lead (Pb)-free, T/R (1000 pieces)
ET
= lead (Pb)-free, tray
EC
= lead (Pb)-free, T/R (500 pieces)
ED
= lead (Pb)-free, T/R (300 pieces)
Note
• For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543)
Revision: 10-Mar-17
Document Number: 31098
1
For technical questions, contact:
ff2aresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Summary of SPI bus application of NXP LPC series ARM
I recently used the SPI (SSP) bus of NXP's LPC213x/LPC214x and LPC1114. I would like to summarize here the hardware and software precautions when using the SPI bus. When I first used the LPC213x/LPC21...
zhaojun_xf NXP MCU
May I ask what do you use your microcontrollers to design?
The application range of single chip microcomputer is quite wide. I want to know its main application range. Please tell me about it....
chy211 Robotics Development
A novice asks a question about VHDL instructions
if (count_a="111") then count_a'0'); what does this sentence mean else count_a<=count_a+1; end if;...
scfor FPGA/CPLD
【Learning experience】++Learning DLP
I learned about DLP through the university hall. I had a preliminary understanding of the composition of DLP, the key points of design, and how to design it! From the optical path to the circuit. The ...
蓝雨夜 TI Technology Forum
Guoxin IC Classic Training Materials
[i=s]This post was last edited by paulhyde on 2014-9-15 09:23[/i] :lol share with you !...
colt-ma Electronics Design Contest
Software Configurable 16-Bit, Dual-Channel, Unipolar/Bipolar Voltage Outputs Using the AD5752 DAC
Software Configurable 16-Bit, Dual-Channel, Unipolar/Bipolar Voltage Outputs Using the AD5752 DAC...
蓝雨夜 ADI Reference Circuit

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2214  841  1315  222  2332  45  17  27  5  47 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号