SPC574K72E5C6FAR datasheet, PDF

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SPC574K72E5C6FAR: DescriptionTQFP 144 20X20X1.0 1; Categorysemiconductor The embedded processor and controller; File Size2MB，160 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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TQFP 144 20X20X1.0 1

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SPC574Kx

32-bit Power Architecture

based MCU for automotive applications

Datasheet

production data

eTQFP176 (24 x 24 x 1.4 mm)

eTQFP144

(20 mm × 20 mm × 1.0 mm)

Features

•

AEC-Q100 qualified

•

Two main 32-bit Power Architecture

VLE

compliant CPU core (e200z4), dual issue,

running in lockstep

– Single-precision floating point operations

– 16 KB local instruction SRAM and 64 KB

local data SRAM

– 4 KB I-Cache and 2 KB D-Cache

•

One 32-bit Power Architecture

VLE compliant

I/O processor core (e200z2)

– Single-precision floating point operations

– Lightweight Signal Processing Auxiliary

Processing Unit (LSP APU) instruction

support for digital signal processing (DSP)

– 16 KB local instruction SRAM and 48 KB

local data SRAM

•

2624 KB on-chip flash memory

– Supporting EEPROM emulation (64 KB)

•

64 KB on-chip general-purpose SRAM

(+112 KB data RAM included in the CPUs)

•

Multi-channel direct memory access controller

(eDMA) with 32 channels

•

Dual interrupt controller (INTC)

•

Dual phase-locked loops, including one

Frequency-modulated

•

System integration unit lite (SIUL)

•

Boot Assist Flash (BAF) supports factory

programming using a serial bootload through

the asynchronous CAN or LIN/UART

•

Generic timer module (GTM122)

– Intelligent complex timer module

– 88 channels (24 input and 64 output)

– 3 programmable fine grain multi-threaded

cores

– 26 KB of dedicated SRAM

– Hardware support for engine control, motor

control and safety related applications

•

Enhanced analog-to-digital converter system

with:

– 1 supervisor 12-bit SAR analog converter

– 4 separate fast 12-bit SAR analog

converters

– 2 separate 16-bit Sigma-Delta analog

converters

•

5 Deserial Serial Peripheral Interface (DSPI)

modules

•

5 LIN and UART communication interface

(LINFlexD) modules

•

3 MCAN interfaces with advanced shared

memory scheme, two supporting ISO CAN-FD

and one supporting TTCAN

•

One Ethernet controller 10/100 Mbps,

compliant IEEE 802.3-2008

•

Dual-channel FlexRay controller

•

Nexus development interface (NDI) per IEEE-

ISTO 5001-2003 standard, with partial support

for 2010 standard

•

Device and board test support per Joint Test

Action Group (JTAG) (IEEE 1149.1)

•

Single 5 V +/-10% Power supply supporting

cold start conditions (down to 3.0 V)

•

Designed for eTQFP144 and eLQFP176

July 2017

This is information on a product in full production.

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SPC574Kx

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

1.1

1.2

1.3

1.4

1.5

Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Device feature summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Feature overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 17

2.1

2.2

Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2.2.1

2.2.2

2.2.3

2.2.4

Power supply and reference voltage pins . . . . . . . . . . . . . . . . . . . . . . . 19

System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

LVDS pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Generic pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Electromagnetic compatibility (EMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3.4.1

BISS port and power supply limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Temperature profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

DC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

I/O pad specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

3.9.1

3.9.2

I/O input DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

I/O output DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

3.10

3.11

3.12

I/O pad current specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Reset pad (PORST, ESR0) electrical characteristics . . . . . . . . . . . . . . . . 48

Oscillator and FMPLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

3.12.1

FMPLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

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Contents

3.12.2

3.12.3

SPC574Kx

External oscillator (XOSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Internal oscillator (IRCOSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

ADC input description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

SAR ADC electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

S/D ADC electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

3.13

ADC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

3.13.1

3.13.2

3.13.3

3.14

3.15

Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

LVDS Fast Asynchronous Serial Transmission (LFAST) pad electrical

characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

3.15.1

3.15.2

3.15.3

LFAST interface timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

LFAST and MSC/DSPI LVDS interface electrical characteristics . . . . . 74

LFAST PLL electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

3.16

3.17

Aurora LVDS electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Power management: PMC, POR/LVD, sequencing . . . . . . . . . . . . . . . . . 79

3.17.1

3.17.2

3.17.3

3.17.4

Power management integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Main voltage regulator electrical characteristics . . . . . . . . . . . . . . . . . . 80

Device voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Power up/down sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Flash read wait state and address pipeline control settings . . . . . . . . . 88

Debug and calibration interface timing . . . . . . . . . . . . . . . . . . . . . . . . . 89

DSPI timing with CMOS and LVDS pads . . . . . . . . . . . . . . . . . . . . . . . . 96

FEC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

FlexRay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

PSI5 timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

UART timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

I2C timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

GPIO delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

3.18

3.19

Flash memory electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 85

3.18.1

3.19.1

3.19.2

3.19.3

3.19.4

3.19.5

3.19.6

3.19.7

3.19.8

AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

4.1

4.2

4.3

4.4

4.5

ECOPACK

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

eTQFP144 case drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

eLQFP176 case drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

FusionQuad

case drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

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SPC574K72E5C6FAR Related Products

	SPC574K72E5C6FAR	SPC574K72E7C6FAR	SPC574K72E5C6FAY	SPC574K72E7C6FAY
Description	TQFP 144 20X20X1.0 1	32-bit Microcontrollers - MCU 32-bit Power Architecture MCU for Automotive Applications	32-bit Microcontrollers - MCU 32-bit Power Architecture MCU for Automotive Applications	LQFP 176L 24X24X1.4

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