EEWORLDEEWORLDEEWORLD

Part Number

Search

CLP-118-02-F-D-TR

Description
.050" X .050
CategoryThe connector    The connector   
File Size810KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

CLP-118-02-F-D-TR Online Shopping

Suppliers Part Number Price MOQ In stock  
CLP-118-02-F-D-TR - - View Buy Now

CLP-118-02-F-D-TR Overview

.050" X .050

CLP-118-02-F-D-TR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSAMTEC
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
Factory Lead Time2 weeks
Samacsys Description36 Position Connector Header, Center Strip Contacts Surface Mount
Other featuresE.L.P., LOW PROFILE, TIGER CLAW CONTACT
body width0.12 inch
subject depth0.09 inch
body length0.567 inch
Body/casing typeSOCKET
Connector typeBOARD CONNECTOR
Contact to complete cooperationNOT SPECIFIED
Contact completed and terminatedTin (Sn) - with Nickel (Ni) barrier
Contact point genderFEMALE
Contact materialNOT SPECIFIED
contact modeRECTANGULAR
Contact resistance10 mΩ
Contact styleSQ PIN-SKT
DIN complianceNO
Filter functionNO
IEC complianceNO
maximum insertion force1.112 N
Insulator colorBLACK
insulator materialLIQUID CRYSTAL POLYMER (LCP)
JESD-609 codee3
MIL complianceNO
Plug contact pitch0.05 inch
Match contact row spacing0.05 inch
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded1
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
PCB contact row spacing3.2258 mm
Plating thicknessFLASH inch
Rated current (signal)3.3 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal pitch1.27 mm
Termination typeSURFACE MOUNT
Total number of contacts36
Evacuation force-minimum value.556 N
F-218 (Rev 14DEC17)
CLP–115–02–L–D
CLP–107–02–F–D–P
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
CLP–130–02–L–D
CLP–116–02–F–DH
(1.27 mm) .050"
CLP SERIES
LOW-PROFILE DUAL WIPE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLP
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating (CLP/FTSH):
3.4 A per pin
(2 pins powered)
Voltage Rating:
280 VAC/395 VDC
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
Top Entry = (1.40 mm) .055"
minimum, Bottom Entry =
(2.41 mm) .095" minimum
plus board thickness
DH Entry = (2.31 mm) .091"
to (2.67 mm) .105"
Normal Force:
60 grams (0.59 N) average
Max Cycles:
100 with 10 µ" (0.25 µm) Au
RoHS Compliant:
Yes
Mates with:
FTSH, FTS, FW
High-reliability
Tiger Claw
contacts
(1.27 mm x 1.27 mm)
.050" x .050"
micro pitch
APPLICATIONS
CLP
FTSH
Low-profile
(2.21 mm)
.087"
HORIZONTAL
Surface
mount
PASS-THRU
Suitable for pass-through
applications
CLP
1
NO. PINS
PER ROW
02
PLATING
OPTION
ROW
OPTION
OTHER
OPTION
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-35)
(0.15 mm) .006" max (36-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
02 thru 50
= Gold flash on
contact, Matte
Tin on tail
–F
–L
= Double
Row
–D
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
No. of Positions
x (1.27) .050 + (0.43) .017
100
(1.27)
.050
(0.41)
.016
= 10 µ" (0.25 µm)
Gold
(–D only)
(4.32)
.170
–G
= Double
Horizontal
(Requires
FTSH–01
and
FTSH–04
lead styles)
– DH
= Bottom Entry
(Required for bottom entry
applications)
–BE
–A
= Alignment Pin
(Not available with –PA option)
(05, 06, 07, 08, 10, 12, 15,
20, 25, 30, 40 positions only)
(–DH option and other sizes.
Contact Samtec.)
02
(4.57) (3.05)
.180 .120
ALSO AVAILABLE
(MOQ Required)
• Single row
• Other platings
Contact Samtec.
(3.43)
.135
99
01
(6.35)
.250
x
(3.18)
.125
(2.54)
.100
= (4.00 mm) .157" DIA
Polyimide film Pick & Place Pad
(5 positions min.)
–K
–P
(1.27)
.050
(2.29)
.090
–P OPTION
= Pick & Place Pad
(5 positions min. –D only)
(Not always necessary
for auto placement.
See Flex Processing.)
–DH
–D
(1.40)
.055
(8.25)
.325
(3.07)
.121
(0.89)
.035 DIA
(7.00)
.275
–PA OPTION
A
PIN/ROW
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
04-15
16-50
A
(3.56) .140
(7.11) .280
If odd pins/row, alignment
pins are on middle position
on centerline of the part.
If even pins/row, then
alignment pins are between
middle two positions.
= Pick & Place Pad
with Alignment Pin
(–D only)
(Not Available with –A option)
–PA
= Tape & Reel
– TR
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Usage problem!!!!
I'm new to launchpad for msp430. Every time I burn the program into the microcontroller, the test LED above doesn't work. I need to disconnect the development board from the computer first and then re...
acer1992 Microcontroller MCU
List of basic instruments and main components for the 2008 'ZLG Cup' Shandong Province Undergraduate Electronic Design Competition
[i=s]This post was last edited by paulhyde on 2014-9-15 09:46[/i] 1. Basic instrument list Dual-trace 20MHz ordinary oscilloscope; 60MHz dual-trace digital oscilloscope; low-frequency signal generator...
maker Electronics Design Contest
Switching power supply for MSP430 microcontroller
: [color=#000][backcolor=rgb(245, 245, 245)][font=宋体][size=12px]Author:[/size][/font][/backcolor][/color][font=宋体][color=#000000][size=12px]Freedomz[/size][/color][/font][color=#000][backcolor=rgb(245...
qwqwqw2088 Energy Infrastructure?
STM32F4 data, very good stuff
...
楞伽山人 stm32/stm8
I would like to share the cracker of quartusII 8.0/8.1/9.1/12.0 with you, let’s encourage each other!
quartusII 8.0 quartusII 8.1 quartusII 9.0 quartusII 12.0 are all free, let's work together!!!...
W1Z1Q FPGA/CPLD
Timeout when connecting host and target using tornado
My target machine has been correctly booted with the floppy disk, but when connecting the host and target machines, it always shows a timeout and cannot connect? What should I do? What should I pay at...
leoyang Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2397  1200  204  956  899  49  25  5  20  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号