POR Specifications....................................................................................................................................................83
AS Configuration Timing............................................................................................................................................89
DCLK Frequency Specification in the AS Configuration Scheme....................................................................................... 90
Minimum Configuration Time Estimation......................................................................................................................94
Remote System Upgrades......................................................................................................................................... 96
User Watchdog Internal Circuitry Timing Specifications..................................................................................................96
Document Revision History for the Intel Arria 10 Device Datasheet.........................................................................................101
Intel
®
Arria
®
10 Device Datasheet
2
A10-DATASHEET | 2018.06.15
Intel
®
Arria
®
10 Device Datasheet
This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and I/O timing
for Intel
®
Arria
®
10 devices.
Intel Arria 10 devices are offered in extended, industrial, and automotive grades. Extended devices are offered in –E1
(fastest), –E2, and –E3 speed grades. Industrial grade devices are offered in the –I1, –I2, and –I3 speed grades. Automotive
devices are offered in the –A3 speed grade and transceiver speed grade 4.
Note:
The specifications for the automotive devices are preliminary, pending characterization.
The suffix after the speed grade denotes the power options offered in Intel Arria 10 devices.
•
•
•
•
L—Low static power
S—Standard power
V—Supported with the SmartVID feature (lowest static power)
H—High performance power
Related Information
Intel Arria 10 Device Overview
Provides more information about the densities and packages of devices in the Intel Arria 10 family.
Electrical Characteristics
The following sections describe the operating conditions and power consumption of Intel Arria 10 devices.
Intel Corporation. All rights reserved. Intel, the Intel logo, Altera, Arria, Cyclone, Enpirion, MAX, Nios, Quartus and Stratix words and logos are trademarks of Intel
Corporation or its subsidiaries in the U.S. and/or other countries. Intel warrants performance of its FPGA and semiconductor products to current specifications in
accordance with Intel's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Intel assumes no
responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by
Intel. Intel customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for
products or services.
*Other names and brands may be claimed as the property of others.
ISO
9001:2008
Registered
Intel
®
Arria
®
10 Device Datasheet
A10-DATASHEET | 2018.06.15
Operating Conditions
Intel Arria 10 devices are rated according to a set of defined parameters. To maintain the highest possible performance and
reliability of the Intel Arria 10 devices, you must consider the operating requirements described in this section.
Absolute Maximum Ratings
This section defines the maximum operating conditions for Intel Arria 10 devices. The values are based on experiments
conducted with the devices and theoretical modeling of breakdown and damage mechanisms. The functional operation of the
device is not implied for these conditions.
Caution:
Table 1.
Conditions outside the range listed in the following table may cause permanent damage to the device. Additionally, device
operation at the absolute maximum ratings for extended periods of time may have adverse effects on the device.
Absolute Maximum Ratings for Intel Arria 10 Devices
Symbol
V
CC
V
CCP
V
CCERAM
V
CCPT
V
CCBAT
V
CCPGM
V
CCIO
Core voltage power supply
Periphery circuitry and transceiver fabric interface power supply
Embedded memory power supply
Power supply for programmable power technology and I/O pre-driver
Battery back-up power supply for design security volatile key register
Configuration pins power supply
I/O buffers power supply
Description
Condition
—
—
—
—
—
(1)
Minimum
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
Maximum
1.21
1.21
1.36
2.46
2.46
2.46
4.10
2.46
2.46
1.34
1.34
2.46
Unit
V
V
V
V
V
V
V
V
V
V
V
V
continued...
3 V I/O
LVDS I/O
V
CCA_PLL
V
CCT_GXB
V
CCR_GXB
V
CCH_GXB
Phase-locked loop (PLL) analog power supply
Transmitter power supply
Receiver power supply
Transceiver output buffer power supply
—
—
—
—
(1)
The LVDS I/O values are applicable to all dedicated and dual-function configuration I/Os.
Intel
®
Arria
®
10 Device Datasheet
4
Intel
®
Arria
®
10 Device Datasheet
A10-DATASHEET | 2018.06.15
Symbol
V
CCL_HPS
V
CCIO_HPS
Description
HPS core voltage and periphery circuitry power supply
HPS I/O buffers power supply
Condition
—
3 V I/O
LVDS I/O
Minimum
–0.50
–0.50
–0.50
–0.50
–0.50
–25
(2)(3)(4)(5)
(6)
Maximum
1.27
4.10
2.46
2.46
2.46
25
125
150
Unit
V
V
V
V
V
mA
°C
°C
V
CCIOREF_HPS
V
CCPLL_HPS
I
OUT
T
J
T
STG
HPS I/O pre-driver power supply
HPS PLL power supply
DC output current per pin
Operating junction temperature
Storage temperature (no bias)
—
—
—
—
—
–55
–65
Related Information
•
•
AN 692: Power Sequencing Considerations for Intel Cyclone 10 GX, Intel Arria 10, and Intel Stratix 10 Devices
Provides the power sequencing requirements for Intel Arria 10 devices.
Power-Up and Power-Down Sequences, Power Management in Intel Arria 10 Devices chapter
Provides the power sequencing requirements for Intel Arria 10 devices.
Maximum Allowed Overshoot and Undershoot Voltage
During transitions, input signals may overshoot to the voltage listed in the following table and undershoot to –2.0 V for input
currents less than 100 mA and periods shorter than 20 ns.
(2)
The maximum current allowed through any LVDS I/O bank pin when the device is not turned on or during power-up/power-down
conditions is 10 mA.
Total current per LVDS I/O bank must not exceed 100 mA.
Voltage level must not exceed 1.89 V.
Applies to all I/O standards and settings supported by LVDS I/O banks, including single-ended and differential I/Os.
Applies only to LVDS I/O banks. 3 V I/O banks are not covered under this specification and must be implemented as per the power
sequencing requirement. For more details, refer to
AN 692: Power Sequencing Considerations for Intel Cyclone
®
10 GX, Intel Arria 10,
and Intel Stratix
®
10 Devices
and
Power Management in Intel Arria 10 Devices chapter.
Some careful friends had already noticed that we had been missing for a few days. Hehe, we went to Lijiang for a group trip.When I arrived in Lijiang, I found that the sky was blue, the mountains were...
Below is the download of relevant materials of RIoTboard development board. I would like to share it with you and hope it will be helpful to you. RIoTboard User Manual_Chinese:dl.vmall.com/c09taytfdw ...
I am a beginner in WinCE programming and want to build a platform using Platform Builder. I followed the instructions in an article step by step. At the end, the emulator terminal appeared, but there ...
At first, I took the feedback from the auxiliary winding and found that the output voltage changes by about 1.2V with the input voltage. Now I have built a circuit for feedback from the output voltage...
In the following code, it is found that after the INTSRC_CAM interrupt is generated, if BIT_SUB_CAM_P and BIT_SUB_CAM_C are not triggered, the code marked with "//Questionable code" will be executed, ...
How do you know if a machine is operating properly? The answer: by leveraging deep learning to detect anomalies in routine vibration data from industrial machines. Anomaly detection has many uses, ...[Details]
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
Capable of providing precise and efficient thermal management for artificial intelligence computing power, intelligent sensing and autonomous driving systems
Shenzhen, ...[Details]
When discussing autonomous driving technology, there are often two extremes: on the one hand, there's the vision of "fully autonomous driving," while on the other, there's concern about potential s...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
One of the most core components of electric vehicles is the motor. The power supply provides electrical energy to the motor, which converts this electrical energy into mechanical energy, which in t...[Details]
With the increasing number of new energy vehicles on the road, the deployment of supporting facilities for these vehicles has accelerated, and new energy vehicles have gradually entered the vision ...[Details]
Based on the commutation technology, thyristor rectifiers are classified into two main types. Line-commutated and force-commutated inverters are commonly used, while other commutated inverters, nam...[Details]
Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
My career has been closely tied to the semiconductor industry. From product management to content marketing, I've provided countless forecasts and predictions across a variety of roles. Whethe...[Details]
China, August 21, 2025 – STMicroelectronics (NYSE: STM), a world-leading semiconductor company serving a wide range of electronics applications, has published its IFRS 2025 semi-annual financial re...[Details]
MQTT Ethernet I/O modules primarily collect I/O port information and transmit data over the network. In addition to being a TCP server, Ethernet I/O modules can also function as TCP clients. Furthe...[Details]
Plug-in hybrid vehicles (PHEVs) utilize two powertrains. Their pure electric range is typically inferior to that of pure electric vehicles, often reaching less than half that. Currently, mainstream...[Details]