W25X40LSSCG datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> W25X40LSSCG

W25X40LSSCG: Description1M X 8 FLASH 2.7V PROM, PDSO8; Categorystorage storage; File Size1MB，45 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

Download Datasheet Parametric View All

W25X40LSSCG Overview

1M X 8 FLASH 2.7V PROM, PDSO8

W25X40LSSCG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	SOIC
package instruction	SOP, SOP8,.3
Contacts	8
Reach Compliance Code	unknow
ECCN code	EAR99
Other features	SYNCHRONOUS MODE ALSO POSSIBLE
Maximum clock frequency (fCLK)	33 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	S-PDSO-G8
JESD-609 code	e3
length	5.27 mm
memory density	4194304 bi
Memory IC Type	FLASH
memory width	1
Humidity sensitivity level	3
Number of functions	1
Number of terminals	8
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX1
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.3
Package shape	SQUARE
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	2.16 mm
Serial bus type	SPI
Maximum standby current	0.00001 A
Maximum slew rate	0.025 mA
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	5.27 mm
write protect	HARDWARE/SOFTWARE

Preview

Download Datasheet

View All

W25X10, W25X20, W25X40, W25X80

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT

SERIAL FLASH MEMORY WITH

4KB SECTORS AND DUAL OUTPUT SPI

-1-

Publication Release Date: September 22, 2006

Preliminary - Revision I

W25X10, W25X20, W25X40, W25X80

Table of Contents-

GENERAL DESCRIPTION ......................................................................................................... 4

FEATURES ................................................................................................................................. 4

PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5

PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5

PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5

PIN CONFIGURATION WSON 6X5-MM .................................................................................... 6

PIN DESCRIPTION..................................................................................................................... 6

7.1

7.2

7.3

7.4

7.5

7.6

7.7

Package Types ............................................................................................................... 7

Chip Select (/CS) ............................................................................................................ 7

Serial Data Output (DO) ................................................................................................. 7

Write Protect (/WP)......................................................................................................... 7

HOLD (/HOLD) ............................................................................................................... 7

Serial Clock (CLK) .......................................................................................................... 7

Serial Data Input / Output (DIO) ..................................................................................... 7

BLOCK DIAGRAM ...................................................................................................................... 8

FUNCTIONAL DESCRIPTION ................................................................................................... 9

9.1

SPI OPERATIONS ......................................................................................................... 9

9.1.1

9.1.2

9.1.3

SPI Modes ........................................................................................................................9

Dual Output SPI................................................................................................................9

Hold Function ...................................................................................................................9

Write Protect Features....................................................................................................10

9.2

10.

WRITE PROTECTION.................................................................................................. 10

9.2.1

CONTROL AND STATUS REGISTERS................................................................................... 11

10.1

STATUS REGISTER .................................................................................................... 11

10.1.1

10.1.2

10.1.3

10.1.4

10.1.5

10.1.6

10.1.7

BUSY............................................................................................................................11

Write Enable Latch (WEL) ............................................................................................11

Block Protect Bits (BP2, BP1, BP0)..............................................................................11

Top/Bottom Block Protect (TB) .....................................................................................11

Reserved Bits ...............................................................................................................11

Status Register Protect (SRP) ......................................................................................12

Status Register Memory Protection ..............................................................................13

Manufacturer and Device Identification.........................................................................14

Instruction Set

(1)

...........................................................................................................15

Write Ensable (06h)......................................................................................................16

Write Disable (04h).......................................................................................................16

10.2

INSTRUCTIONS........................................................................................................... 14

10.2.1

10.2.2

10.2.3

10.2.4

-2-

W25X10, W25X20, W25X40, W25X80

10.2.5

10.2.6

10.2.7

10.2.8

10.2.9

10.2.10

10.2.11

10.2.12

10.2.13

10.2.14

10.2.15

10.2.16

10.2.17

Read Status Register (05h) ..........................................................................................17

Write Status Register (01h) ..........................................................................................18

Read Data (03h) ...........................................................................................................19

Fast Read (0Bh) ...........................................................................................................20

Fast Read Dual Output (3Bh) .......................................................................................21

Page Program (02h) ...................................................................................................22

Sector Erase (20h) .....................................................................................................23

Block Erase (D8h) ......................................................................................................24

Chip Erase (C7h)........................................................................................................25

Power-down (B9h) ......................................................................................................26

Release Power-down / Device ID (ABh) .....................................................................27

Read Manufacturer / Device ID (90h) .........................................................................29

JEDEC ID (9Fh)..........................................................................................................30

11.

ELECTRICAL CHARACTERISTICS (PRELIMINARY) (4) ....................................................... 31

11.1 Absolute Maximum Ratings (1) .................................................................................... 31

11.2

11.3

11.4

11.5

11.6

11.7

11.8

11.9

11.10

11.11

Operating Ranges......................................................................................................... 31

Endurance and Data Retention .................................................................................... 32

Power-up Timing and Write Inhibit Threshold .............................................................. 32

DC Electrical Characteristics ........................................................................................ 33

AC Measurement Conditions........................................................................................ 34

AC Electrical Characteristics ........................................................................................ 35

AC Electrical Characteristics (cont’d) ........................................................................... 36

Serial Output Timing ..................................................................................................... 37

Input Timing................................................................................................................. 37

Hold Timing ................................................................................................................. 37

8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38

8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39

8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40

8-contact 6x5 WSON .................................................................................................... 41

8-contact 6x5 WSON Cont’d. ....................................................................................... 42

12.

PACKAGE SPECIFICATION .................................................................................................... 38

12.1

12.2

12.3

12.4

12.5

13.

14.

ORDERING INFORMATION

(1)

................................................................................................. 43

REVISION HISTORY ................................................................................................................ 44

-3-

Publication Release Date: September 22, 2006

Preliminary - Revision I

W25X10, W25X20, W25X40, W25X80

1. GENERAL DESCRIPTION

The W25X10 (1M-bit), W25X20 (2M-bit), W25X40 (4M-bit) and W25X80 (8M-bit) Serial Flash

memories provide a storage solution for systems with limited space, pins and power. The 25X series

offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code

download applications as well as storing voice, text and data. The devices operate on a single 2.7V to

3.6V power supply with current consumption as low as 5mA active and 1µA for power-down. All

devices are offered in space-saving packages.

The W25X10/20/40/80 array is organized into 512/1024/2048/4096 programmable pages of 256-bytes

each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can

be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip (chip erase).

The W25X10/20/40/80 has 32/64/128/256 erasable sectors and 2/4/8/16 erasable blocks respectively.

The small 4KB sectors allow for greater flexibility in applications that require data and parameter

storage. (See figure 2.)

The W25X10/20/40/80 supports the standard Serial Peripheral Interface (SPI), and a high

performance dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial

Data Out. SPI clock frequencies of up to 75MHz are supported allowing equivalent clock rates of

150MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to

those of 8 and 16-bit Parallel Flash memories.

A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control

features, provide further control flexibility. Additionally, the device supports JEDEC standard

manufacturer and device identification.

2. FEATURES

•

Family of Serial Flash Memories

–

W25X10: 1M-bit / 128K-byte (131,072)

–

W25X20: 2M-bit / 256K-byte (262,144)

–

W25X40: 4M-bit / 512K-byte (524,288)

–

W25X80: 8M-bit / 1M-byte (1,048,576)

– 256-bytes per programmable page

– Uniform 4K-byte Sectors / 64K-byte Blocks

•

SPI with Single or Dual Outputs

– Clock, Chip Select, Data I/O, Data Out

– Optional Hold function for SPI flexibility

•

Data Transfer up to 150M-bits / second

– Clock operation to 75MHz

– Fast Read Dual Output instruction

–

Auto-increment Read capability

•

Flexible Architecture with 4KB sectors

– Sector Erase (4K-bytes)

– Block Erase (64K-byte)

–

Page program up to 256 bytes <2ms

–

Up to 100,000 erase/write cycles

–

20-year retention

•

Low Power Consumption, Wide

Temperature Range

– Single 2.7 to 3.6V supply

– 5mA active current, 1µA Power-down (typ)

– -40° to +85°C operating range

•

Software and Hardware Write Protection

– Write-Protect all or portion of memory

– Enable/Disable protection with /WP pin

–

Top or bottom array protection

•

Space Efficient Packaging

– 8-pin SOIC 150-mil (W25X10/20/40)

– 8-pin SOIC 208-mil (W25X40/80)

– 8-pin PDIP 300-mil (W25X10/20/40/80)

– 8-pin WSON 6x5-mm (W25X10/20/40/80)

-4-

Recommended Resources

Photoelectric control electronic birthday cake circuit

LM3578A used as a buck regulator circuit diagram

Usb mouse circuit diagram

Full wave control circuit of series motor

875p computer motherboard circuit diagram_057

Computer motherboard circuit diagram 815 1_07

The Year of the Sheep is here, I wish EEWORLD all the best in the Year of the Sheep!: [i=s] This post was last edited by damiaa on 2015-2-20 09:15 [/i] [b][size=3][color=#ff0000]Happy New Year, and I wish EEWORLD good luck in the Year of the Goat! [/color] [color=#008000] E-forum is do...; damiaa ADI Reference Circuit

Do you know how to measure pH? See how ADI teaches you: The content is very exciting...; gaoyang9992006 ADI Reference Circuit

In circuit design, how to name various networks reasonably?: A few days ago, a new member of a PCB study group I was in asked a simple question, but it drove all the experts crazy. It turned out that the classmate had drawn a circuit diagram filled with all kin...; okhxyyo PCB Design

How to measure the speed of DC motor in protues simulation: [b]If there is no good method, use the encoder motor motor-encoder. I use a 52 single-chip microcomputer and an l298 motor driver. Now I am measuring the speed and using a 1602 display. I don't know h...; wzd8200835 51mcu

Automotive electric motors put to the test: After taking off, an airplane can fly for hours under almost the same environmental conditions, while a car will be continuously affected by various possible interference factors during the entire dri...; frozenviolet Automotive Electronics

Can someone help me, it's been a day and no one has been able to solve it: My keil compilation environment is normal, but after I start debug session, the debug window is covered by the output window. The output window is full screen, but I can't shrink it. I can't find the ...; qincai0066 MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components