Chip Card & Security ICs
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SRF 55V02P
Intelligent 2.5 Kbit EEPROM
with Contactless Interface compliant to ISO/IEC 15693
and ISO/IEC 18000-3 mode 1
®
Plain Mode Operation
Short Product Information
July 2007
SRF 55V02P Short Product Information
Revision History:
Previous Releases:
Page
Current Version 2007-07-02
2002-07-30
Ref.: SRF55V02P_ShortProductInfo_2007-06.doc
Subjects (changes since last revision)
Editorial changes
Important:
For further information please contact:
Infineon Technologies AG in Munich, Germany,
Chip Card & Security ICs,
Fax +49 (0)89 / 234-955 9372
E-Mail: security.chipcard.ics@infineon.com
Published by Infineon Technologies AG, CC Applications Group
D-81726 München
© Infineon Technologies AG 2007
All Rights Reserved.
To our valued customers
We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional
amount of time to ensure that this document is correct. However, we realise that we may have missed a few things. If
you find any information that is missing or appears in error, please use the contact section above to inform us. We
appreciate your assistance in making this a better document.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of
that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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SRF 55V02P
Intelligent 2.5 Kbit EEPROM
with Contactless Interface (ISO/IEC 15693 and ISO/IEC 18000-3 mode 1)
Features
Contactless Interface
•
Physical Interface and Anticollision compliant to ISO/IEC 15693 and ISO/IEC 18000-3 mode 1
—
contactless transmission of data and supply energy
—
carrier frequency: 13.56 MHz
—
data rate up to 26 kbit/s
—
anticollision with identification of up to 30 tags/sec
—
read / write distance up to 150 cm depending on reader antenna configuration
2.5 Kbit EEPROM
•
•
•
•
•
•
ISO mode – block organization of memory
—
up to 56 blocks of user memory (block size 4 bytes)
Custom mode – page organization of memory
—
up to 32 pages of user memory (page size 8 bytes)
Unique chip identification number (UID)
EEPROM programming time per block/page < 4 ms
EEPROM endurance > 100,000 erase/write cycles
1)
Data retention > 10 years
1)
Value Counters: up to 65536
(value range from 0 to 2
16
-1)
—
—
each page in the User Area is configurable as a Value Counter
support of Anti-Tearing
Electrical characteristics
•
ESD protection minimum 2 kV
•
Ambient temperature –25
…
+70°C (for the chip)
1)
Values are temperature dependent
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SRF 55V02P
Development Tool
―
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Evaluation Kit including my-d
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Manager Software
1
Table 1:
Type
Ordering and Packaging information
Ordering Information
Package
1)
Sawn wafer
NiAu bump wafer
P-MCC2-2-1
256 bytes
64 bytes
32
Memory
User
Admin.
Pages
Ordering Code
SP000009363
SP000089856
SP000010033
SP000009367
SRF 55V02P C
SRF 55V02P NB
SRF 55V02P MCC2
SRF 55V02P MFCC1 S-MFCC1-2-1
For more ordering information (wafer thickness and height of NiAu-Bump) please contact your local
Infineon sales office.
Pin Description
Figure 1: Pin Configuration Module Contactless Card – MFCC1 (top / bottom view)
Figure 2: Pin Configuration Module Contactless Card – MCC2 (top view)
1)
Available as a Module Flip Chip Contactless (MFCC1), Module Contactless Card (MCC) for embedding in plastic
cards, as NiAu-bump version (NB) or as a die on sawn / unsawn wafer for customer packaging
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SRF 55V02P
L
A
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SRF 55V02P
L
B
Figure 3: Pad Configuration Die
Table 2
Symbol
L
A
L
B
Pin Definitions and Functions
Function
Antenna connection
Antenna connection
Short Product Information
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