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BZX84C3V9-TP

Description
DIODE ZENER 3.9V 350MW SOT23
Categorysemiconductor    Discrete semiconductor   
File Size364KB,6 Pages
ManufacturerMicro Commercial Co
Environmental Compliance
Download Datasheet Parametric View All

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BZX84C3V9-TP Overview

DIODE ZENER 3.9V 350MW SOT23

BZX84C3V9-TP Parametric

Parameter NameAttribute value
Voltage - Zener (nominal) (Vz)3.9V
Tolerance±5%
Power - Max350mW
Impedance (max) (Zzt)90 Ohms
Current at different Vr - Reverse leakage current3µA @ 1V
Voltage at different If - Forward (Vf900mV @ 10mA
Operating temperature-55°C ~ 150°C
Installation typesurface mount
Package/casingTO-236-3,SC-59,SOT-23-3
Supplier device packagingSOT-23
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

  !"#
$ %    !"#
BZX84C2V4
THRU
BZX84C(B)51
Silicon
350 mWatt
Zener Diodes
Features
Planar Die construction
350mW Power Dissipation
Zener Voltages from 2.4V - 51V
Ideally Suited for Automated Assembly Processes
Halogen
free available upon request by adding suffix "-HF"
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Weight: 0.008 grams (approx.)
F
E
A
D
SOT-23
C
B
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Maximum Forward
V
F
Voltage@IF=10mA
Power Dissipation
P
(AV)
(NoteA)
Operation And
T
J
, T
STG
Storage
Temperature
Peak Forward Surge I
FSM
Current(NoteB)
Thermal Resistance
(Note C)
Rthja
0.9
350
-55 C to
+150
o
C
2.0
357
o
V
mWatt
G
K
H
J
L
DIMENSIONS
o
A
C/W
DIM
A
B
C
D
E
F
G
H
J
K
L
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
.007
MAX
.120
.104
.055
.041
.081
.024
.0039
.044
.007
.020
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
.20
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
.50
NOTE
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or
equivalent square wave, duty cycle = 4 pulses per
minute maximum.
C. Valid provided the terminals are kept at ambient
temperature
*Pin Configuration - Top View
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision: D
www.mccsemi.com
1 of
6
2014/04/23
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