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BU240Z-178-HT

Description
CONN IC DIP SOCKET 24POS GOLD
CategoryThe connector   
File Size48KB,1 Pages
ManufacturerOn Shore Technology Inc.
Environmental Compliance
Download Datasheet Parametric View All

BU240Z-178-HT Overview

CONN IC DIP SOCKET 24POS GOLD

BU240Z-178-HT Parametric

Parameter NameAttribute value
typeDIP, 0.6" (15.24mm) line spacing
Number of pins or pins (grid)24(2 x 12)
Spacing - Mating0.100"(2.54mm)
Contact surface treatment - matinggold
Contact Surface Treatment Thickness - Mating78.7µin(2.00µm)
Contact Material - Matingcopper beryllium
Installation typesurface mount
characteristicopen framework
Terminationwelding
spacing-column0.100"(2.54mm)
Contact Surface Preparation - Columncopper
Contact Surface Treatment Thickness - Columnflash memory
Contact Material - Pillarbrass
Shell materialPolybutylene terephthalate (PBT), glass fiber reinforced
Operating temperature-55°C ~ 125°C
Termination post length0.059"(1.50mm)
Material flammability ratingUL94 V-0
Rated current1A
Contact resistance7 milliohms
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