Operating Temperature Range ......................... -40°C to +125°C
Storage Temperature ....................................... -65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature ...................................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
μMAX
Junction-to-Ambient Thermal Resistance (θ
JA
) ........180°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............42°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
MAX6072_50 Electrical Characteristics (V
REF1
: V
OUT1F
= 5V, V
REF2
: V
OUT2F
= 2.5V)
(V
IN1
= V
EN1
= V
IN2
= V
EN2
= +5.5V, I
OUT
= 0mA, C
OUT
= 0.1μF, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
=+25°C.) (Note 2)
PARAMETER
OUTPUT
Output Voltage Accuracy (OUT1F
and OUT2F)
Output Voltage Temperature Drift
(OUT1F and OUT2F) (Note 3)
Output Voltage Temperature Drift
Tracking (OUT1F and OUT2F)
(Note 3)
SYMBOL
CONDITIONS
MAX6072A_50, T
A
= +25°C
MAX6072B_50, T
A
= +25°C
MAX6072A_50
MAX6072B_50
MAX6072A_50
MAX6072B_50
OUT1F, 5.2V
< V
IN1
< 5.5V
T
A
= +25°C
T
A
= -40°C to
+125°C
T
A
= +25°C
T
A
= -40°C to
+125°C
MIN
-0.05
-0.08
TYP
MAX
+0.05
+0.08
UNITS
%
ppm/°C
TCV
OUT
1.5
2.0
0.4
0.4
200
6
8
∆TC
ppm/°C
620
700
Line Regulation
OUT2F, 2.8V
< V
IN2
< 5.5V
0mA < I
OUT
< 10mA, sink
0mA < I
OUT
<
10mA, source
0mA < I
OUT
< 10mA, sink
0mA < I
OUT
<
10mA, source
60
260
275
μV/V
160
OUT1F
160
80
OUT2F
75
290
350
μV/mA
185
190
Load Regulation
www.maximintegrated.com
Maxim Integrated
│
2
MAX6072
High-Precision, Dual-Output Series
Voltage Reference
MAX6072_50 Electrical Characteristics (V
REF1
: V
OUT1F
= 5V, V
REF2
: V
OUT2F
= 2.5V)
(continued)
PARAMETER
SYMBOL
CONDITIONS
I
OUT
= 10mA,
T
A
= -40°C to
+125°C
I
OUT
I
SC
Sourcing to ground
Sinking from V
IN
OUT1F
OUT2F
OUT2F to OUT1F
OUT1F, 1000 hours at
T
A
= +25°C
OUT2F, 1000 hours at
T
A
= +25°C
OUT1F
(Note 6)
OUT2F
(Note 4)
-10
25
25
85
85
2.5
15
ppm
15
5
1/f noise,
0.1Hz to
10Hz, C
OUT
=
0.1μF
Thermal
noise, 10Hz to
10kHz, C
OUT
= 0.1μF
Thermal
noise, f=
1kHz, C
OUT
=
0.1μF
Frequency =
60Hz
t
R
Settling to
0.01%, C
OUT
= 0.1μF
Settling to
0.01%, C
OUT
= 0.1μF
ppm
MIN
TYP
60
110
MAX
150
mV
230
+10
mA
mA
ppm
ppm
UNITS
(V
IN1
= V
EN1
= V
IN2
= V
EN2
= +5.5V, I
OUT
= 0mA, C
OUT
= 0.1μF, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
=+25°C.) (Note 2)
Dropout Voltage
Output Current (OUT1F and
OUT2F)
Short-Circuit Current (OUT1F and
OUT2F)
Thermal Hysteresis (Note 5)
Thermal Hysteresis Tracking
(Note 5)
Long-Term Stability
Long-Term Drift Tracking
DYNAMIC CHARACTERISTICS
OUT1F
OUT2F
OUT1F
OUT2F
OUT1F
OUT2F
OUT1F
OUT2F
OUT1F
OUT2F
OUT1F
OUT2F
9
4.8
15
6
120
nV/√Hz
60
74
84
50
30
100
75
dB
μV
RMS
μV
P-P
Noise Voltage
e
OUT
Noise Voltage Spectral Density
Ripple Rejection
Turn- On Settling Time
μs
Enable Settling Time
t
EN
μs
www.maximintegrated.com
Maxim Integrated
│
3
MAX6072
High-Precision, Dual-Output Series
Voltage Reference
MAX6072_50 Electrical Characteristics (V
REF1
: V
OUT1F
= 5V, V
REF2
: V
OUT2F
= 2.5V)
(continued)
PARAMETER
Capacitive-Load Stability Range
(OUT1F, OUT2F)
INPUT (IN1 and IN2)
Supply Voltage
V
IN
Guaranteed
by line
regulation
T
A
= +25°C
T
A
= -40°C to +125°C
T
A
= +25°C
T
A
= -40°C to +125°C
V
EN
= 0V
0.85
150
OUT1F
OUT2F
5.2
2.8
160
5.5
5.5
270
350
245
320
28
V
SYMBOL
CONDITIONS
I
OUT
≤ 10mA
MIN
0.1
TYP
MAX
10
UNITS
μF
(V
IN1
= V
EN1
= V
IN2
= V
EN2
= +5.5V, I
OUT
= 0mA, C
OUT
= 0.1μF, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
=+25°C.) (Note 2)
REF1 Quiescent Supply Current
REF2 Quiescent Supply Current
Shutdown Supply Current per
Reference
ENABLE (EN1 and En2)
Enable Input Current
Enable Logic- High
Enable Logic- Low
I
IN
I
IN
I
SD
μA
μA
μA
I
EN
V
IH
V
IL
-1
0.7 x V
IN
+1
0.3 x V
IN
μA
V
V
MAX6072_41 Electrical Characteristics (V
REF1
: V
OUT1F
= 4.096V, V
REF2
: V
OUT2F
=
2.048V)
PARAMETER
OUTPUT
Output Voltage Accuracy (OUT1F
and OUT2F)
Output Voltage Temperature Drift
(OUT1F and OUT2F) (Note 3)
Output Voltage Temperature Drift
Tracking (OUT1F and OUT2F)
(Note 3)
TCV
OUT
MAX6072A_41, T
A
= +25°C
MAX6072B_41, T
A
= +25°C
MAX6072A_41
MAX6072B_41
MAX6072A_41
MAX6072B_41
OUT1F, 4.3V
< V
IN1
< 5.5V
Line Regulation
OUT2F, 2.7V
< V
IN2
< 5.5V
T
A
= +25°C
T
A
= -40°C to
+125°C
T
A
= +25°C
T
A
= -40°C to
+125°C
50
-0.05
-0.08
1.5
2.0
0.4
0.4
100
450
485
250
270
μV/V
+0.05
+0.08
6
8
%
SYMBOL
CONDITIONS
MIN
TYP
MAX
(V
IN1
= V
EN1
= V
IN2
= V
EN2
= +5V, I
OUT
= 0mA, C
OUT
= 0.1μF, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
=+25°C.) (Note 2)
UNITS
ppm/°C
∆TC
ppm/°C
www.maximintegrated.com
Maxim Integrated
│
4
MAX6072
High-Precision, Dual-Output Series
Voltage Reference
MAX6072_41 Electrical Characteristics (V
REF1
: V
OUT1F
= 4.096V, V
REF2
: V
OUT2F
=
2.048V) (continued)
PARAMETER
SYMBOL
CONDITIONS
0mA < I
OUT
<
10mA, sink
0mA < I
OUT
<
10mA, source
0mA < I
OUT
<
10mA, sink
0mA < I
OUT
<
10mA, source
Dropout Voltage
Output Current (OUT1F and
OUT2F)
Short-Circuit Current (OUT1F and
OUT2F)
Thermal Hysteresis (Note 5)
Thermal Hysteresis Tracking
(Note 5)
MIN
TYP
125
OUT1F
135
135
OUT2F
135
250
300
MAX
260
(V
IN1
= V
EN1
= V
IN2
= V
EN2
= +5V, I
OUT
= 0mA, C
OUT
= 0.1μF, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
Find Broadcom 802.11b/g WLAN, suitable for sniffer capture upgrade driver. The driver name starts with "atheros". Reference address: http://www.wildpackets.com/support/product...ropeek/hardware...
The designed network port has such a problem now. Through the Freescale KDS software experiment, the network port device can be detected and can receive UDP, but the network debugging assistant finds ...
[i=s]This post was last edited by bjby81 on 2017-3-13 10:26[/i] If you are interested, please contact [url=mailto:bjby81@hotmail.com]bjby81@hotmail.com[/url] for details....
I have a question for you guys. If I make an electrical component and I connect it to a voltage of 220v or 110v, how should I judge it if I know it can be used at that voltage? For example, if I conne...
[font=新宋体][size=4]I didn't know Python before, and it took me a long time to figure out how to use uPyLoader. However, when transferring files, there are always transmission errors, and it can only su...
In the past few days, the news that ZTE was "banned" by the US Department of Commerce has triggered widespread reflection and concern in various domestic industries about the lack of independent co...[Details]
Entering the information age after the millennium, the huge demand for semiconductor chips has made China the world's largest semiconductor market. According to relevant data, the scale of my count...[Details]
In our common sense, the word technology often has two definitions. The first is the technology sealed in the laboratory. They are like flowers on the mountain top. Only a few people on the mountai...[Details]
On April 20, Alibaba Group announced that it would acquire
the
chip
company Zhongtian Microelectronics and invest in six
chip
companies. Yesterday, JD.com CEO Liu Qiangdong said in a...[Details]
1. Principle 1. Infrared emission protocol There are many infrared communication protocols. This experiment uses the NEC protocol. This protocol uses PWM modulation and uses pulse width to represen...[Details]
Today, under the guidance of a low-level expert, I learned how to configure the PWM module! Woof! First open the file configured last time, as follows: Then, we need to use TIM1 to set PWM: Then,...[Details]
I have always wanted to write some posts and blogs, but I just couldn't bear to do it as I just graduated. After some preparation, I decided to write down some of the things I learned in the past few...[Details]
Time flies. Since the beginning of 2018, news related to home appliance companies have repeatedly made headlines, and competition in the home appliance market continues to intensify. In order to be...[Details]
Since the second half of 2017,
the market share of
quantum dot
displays has dropped significantly, with global sales falling from 3.42 million in 2016 to 2 million in 2017, a 42% decrease; d...[Details]
A few days ago, Hanergy Chairman Li held a grand launch of Hanwa new products, which once again attracted the attention of the mass media to the development of photovoltaics. The unique Hanergy has gr...[Details]
Leading Chinese PV inverter manufacturer Huawei said it is supplying string inverters to a 75MW fully digital utility-scale solar project in Brazil, which it claims is the first of its kind in the cou...[Details]
Superconductors have physical properties such as zero resistance effect, Meissner effect and Josephson effect, which make them have broad application prospects and unparalleled advantages in many b...[Details]
The adoption rate of serverless
cloud
computing
is gradually increasing, but it has not yet reached people's expectations. Various surveys show that serverless
is
still
an eme...[Details]
This routine is also a classic routine on the development board. I modified the framework of the program to make it more suitable for future calls. The specific 4*4 keyboard scanning principle is rel...[Details]
The ARM11 (S3C6410) processor is selected as the hardware platform, the embedded Linux operating system is used as the software platform, the background difference method and the frame difference...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
