Only Reflow Soldering
Chip Monolithic Ceramic Capacitor High-Q Type for General
GJM0335C1H3R8BB01_ (0201, C0G:EIA, 3.8pF, DC50V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor High-Q Type used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
Reference Sheet
2.MURATA Part NO. System
(Ex.)
GJM
03
(1)L/W
Dimensions
3
(2)T
Dimensions
5C
(3)Temperature
Characteristics
1H
(4)Rated
Voltage
3R8
(5)Nominal
Capacitance
B
(6)Capacitance
Tolerance
B01
(7)Murata’s Control
Code
D
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
0.6±0.03
(1)-2 W
0.3±0.03
(2) T
0.3±0.03
e
0.1 to 0.2
(Unit:mm)
g
0.2 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
0±30 ppm/°C
25 to 125 °C
(25 °C)
DC 50 V
3.8 pF
±0.1 pF
-55 to 125 °C
5.Package
mark
D
W
J
(8) Packaging
f180mm
Reel
PAPER W8P2
f180mm
Reel
PAPER W8P1
f330mm
Reel
PAPER W8P2
Packaging Unit
15000 pcs./Reel
30000 pcs./Reel
50000 pcs./Reel
Product specifications in this catalog are as of Mar.9,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GJM0335C1H3R8BB01-01
1
■
Specifications and Test Methods
No
1
Item
Rated Voltage
Shown in Rated value.
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
V
P-P
or V
O-P
, whichever is larger, should be maintained
within the rated voltage range.
2
3
4
Appearance
Dimension
Voltage proof
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using Measuring instrument of dimension.
Measurement Point
Test Voltage
Applied Time
: Between the terminations
: 300% of the rated voltage
: 1s to 5 s
Charge/discharge current : 50mA max.
5
Insulation Resistance(I.R.)
C≦0.047µF:More than 10000MΩ
C＞0.047µF:More than 500Ω·F
C:Nominal Capacitance
Measurement Point
: Between the terminations
Measurement Voltage :
Charging Time
DC Rated Voltage
: 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6
7
Capacitance
Q
Shown in Rated value.
30pF and over:Q≧1000
30pF and below:Q≧400+20C
C:Nominal Capacitance(pF)
8
Temperature Characteristics
of Capacitance
Nominal values of the temperature coefficient is shown in Rated value. The capacitance change should be measured after 5 minutes
But,the Capacitance Change under 20℃ is shown in Table A.
Capacitance Drift
Within +/-0.2% or +/-0.05pF
(Whichever is larger.)
The capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
Step
1
2
3
4
5
Temperature(C)
Reference Temp.+/-2
Min. Operating Temp.+/-3
Reference Temp.+/-2
Max. Operating Temp.+/-3
Reference Temp.+/-2
Measurement Temperature : Room Temperature
Capacitance
C≦1000pF
Frequency
1.0+/-0.1MHz
Voltage
0.5 to 5.0Vrms
at each specified temp. stage.
Capacitance value as a reference is the value in step 3.
9
Adhesive Strength
of Termination
Step
1
2
3
4
5
No removal of the terminations or other defect
Temperature(C)
Reference Temp.+/-2
Min. Operating Temp.+/-3
Reference Temp.+/-2
Max. Operating Temp.+/-3
Reference Temp.+/-2
the capacitor on the test substrate shown in Fig.3.
Solder
Type
GJM02
GJM03
GJM15
Applied Force(N)
1
2
5
should occur.
Holding Time
: 10+/-1s
the capacitor side.
Applied Direction : In parallel with the test substrate and vertical with
10 Vibration
Appearance
Capacitance
Q
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration
Total amplitude
: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
: 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate
Bending test
Capacitance
Change
Within +/-5% or +/-0.5pF
(Whichever is larger)
Pressurization method : Shown in Fig.2
Flexure
Holding Time
Soldering Method
12 Solderability
95% of the terminations is to be soldered evenly and continuously.
Test Method
Flux
Preheat
Solder
Solder Temp.
Immersion time
:
1mm
:
5+/-1s
: Reflow soldering
: Solder bath method
Solution of rosin ethanol 25(mass)%
: 80℃ to 120℃ for 10s to 30s
: Sn-3.0Ag-0.5Cu
: 245+/-5℃
: 2+/-0.5s
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.1.
JEMCGS-03120B
2
No
13 Resistance to
Item
Appearance
Capacitance
Change
Q
I.R.
No defects or abnormalities.
Within +/-2.5% or +/- 0.25pF
(Whichever is larger)
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
<GJM02 size only>
Test Method
Solder
Solder Temp.
Reflow Time
Test Substrate
Exposure Time
Preheat
<GJM03/GJM15 size>
Test Method
Solder
Solder Temp.
Immersion time
Exposure Time
Preheat
: Solder bath method
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
: 10+/-0.5s
: 24+/-2h
: 120℃ to 150℃ for 1 min
: Reflow soldering (hot plate)
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
: 10+/-0.5s
: Glass epoxy PCB
: 24+/-2h
: 120℃ to 150℃ for 1 min
Soldering Heat
Within the specified initial value.
Within the specified initial value.
Voltage proof No defects.
14 Temperature
Sudden Change
Appearance
Capacitance
Change
Q
I.R.
No defects or abnormalities.
Within +/-2.5% or +/- 0.25pF
(Whichever is larger)
Within the specified initial value.
Within the specified initial value.
Solder the capacitor on the test substrate shown in Fig.3.
Perform the five cycles according to the four heat treatments
shown in the following table.
Step
1
2
3
Temp.(C)
Min.Operating Temp.+0/-3
Room Temp.
Max.Operating Temp.+3/-0
Room Temp
Time (min)
30+/-3
2 to 3
30+/-3
2 to 3
Voltage proof No defects.
4
Exposure Time
15 High
Temperature
High Humidity
(Steady)
Capacitance
Change
Q
Within +/-7.5% or +/-0.75pF
(Whichever is larger)
30pF and over
: Q≧200
Test Temperature
Test Humidity
Test Time
Applied Voltage
Exposure Time
C:Nominal Capacitance(pF)
I.R.
More than 500MΩ or 25Ω·F (Whichever is smaller)
30pF and below : Q≧100+10C/3
Appearance
No defects or abnormalities.
: 24+/-2h
Solder the capacitor on the test substrate shown in Fig.3.
: 40+/-2℃
: 90%RH to 95%RH
: 500+/-12h
: DC Rated Voltage
: 24+/-2h
Charge/discharge current : 50mA max.
16 Durability
Appearance
Capacitance
Change
Q
No defects or abnormalities.
Within +/-3% or +/-0.3pF
(Whichever is larger)
30pF and over : Q≧350
10pF and over , 30pF and below : Q≧275+5C/2
10pF and below : Q≧200+10C
C:Nominal Capacitance (pF)
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Time
Applied Voltage
Exposure Time
: Max. Operating Temp. +/-3℃
: 1000+/-12h
: 100% of the rated voltage
: 24+/-2h
Charge/discharge current : 50mA max.
I.R.
17 ESR
(GJM02)
More than 1,000MΩ or 50Ω·F (Whichever is smaller)
0.2pF
≦
C
≦
1pF : 700mΩ/C below
1pF < C
≦
2pF : 600mΩ below
2pF < C
≦
5pF : 500mΩ below
5pF < C
≦
10pF : 300mΩ below
10pF < C
≦
22pF : 350mΩ below
C:Nominal Capacitance (pF)
Measurement Frequency : 1.0+/-0.1GHz
Measurement Temperature : Room Temp.
Measurement Instrument
: Equivalent to E4991A
ESR
(GJM03/GJM15)
0.1pF
≦
C
≦
1pF : 350mΩ/C below
1pF
5pF
< C
≦
5pF : 300mΩ below
< C
≦10pF
: 250mΩ below
Measurement Frequency : 1.0+/-0.2GHz
Measurement Temperature : Room Temp.
Measurement Instrument
: Equivalent to BOONTON Model 34A
C:Nominal Capacitance (pF)
10pF < C
≦
47pF : 400mΩ below
Measurement Frequency : 500+/-50MHz
Measurement Temperature : Room Temp.
Measurement Instrument
: Equivalent to HP8753B
JEMCGS-03120B
3
Table A
Char.
1C
2C
3C
4C
5C
6C
Max.
0.54
0.82
1.37
2.56
0.58
0.87
-55℃
Capacitance Change from Value at Reference temp.
-30
-25℃
Min.
Max.
Min.
Max.
Min.
-0.23
-
-
0.33
-0.14
-0.45
-
-
0.49
-0.27
-0.90
-
-
0.82
-0.54
-1.88
-
-
1.54
-1.13
-0.24
0.40
-0.17
-
-
-0.48
0.59
-0.33
-
-
(%)
-10℃
Max.
0.22
0.33
0.55
1.02
0.25
0.38
Min.
-0.09
-0.18
-0.36
-0.75
-0.11
-0.21
Recommended derating conditions on voltage and temperature
These
Part Numbers are designed for use in the circuits w here
continuous
applied voltage to the capacitor is derated than rated
voltage,
and guarantee Durability Test w ith 100% × rated voltage
as
testing voltage at the maximum operating temperature.
The
voltage and temperature derating conditions on the left are
recommended
for use to ensure the same reliability level as
normal
specification.
JEMCGS-03120B
4
Substrate Bending test
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness :0.8mm
:
Solder resist
(Coat with heat resistant resin for solder)
for GJM02
for GJM03/15
Land
b
f4.5
*1,2：2.0±0.05
4.0±0.1
＊1
Type
40
c
c
a
100
GJM02
GJM03
GJM15
a
0.2
0.3
0.4
Dimension (mm)
b
0.56
Ａ
0.9
1.5
φ1.5
+0.1
-0
＊2
c
0.23
0.3
0.5
Ｂ
0.05以下
Copper foil thickness : 0.018mm
Fig.1
Copper
foil thickness : 0.035mm
(in mm)
Kind of Solder
・Test
substrate : Sn-3.0Ag-0.5Cu
Pressurization
・Test
substrate method
20
50 min.
Pressurization
speed
1.0mm/s
acitor
R5
Pressurize
45
Support
Capacitance meter
45
45
Flexure
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
Kind of Solder
・Test
substrate : Sn-3.0Ag-0.5Cu
Land Dimensions
・Test
substrate
Chip Capacitor
Land
Type
c
b
a
Solder Resist
GJM02
GJM03
GJM15
Fig.3
a
0.2
0.3
0.4
Dimension (mm)
b
0.56
0.9
1.5
c
0.23
0.3
0.5
JEMCGS-03120B
5
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