8-HCS133-04TT datasheet, PDF - EEWORLD Datasheet

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8-HCS133-04TT: DescriptionIC Socket, PGA133, 133 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,; Categorysocket; File Size146KB，2 Pages; ManufacturerAdvanced Interconnections Corp.

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8-HCS133-04TT Overview

IC Socket, PGA133, 133 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

8-HCS133-04TT Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Advanced Interconnections Corp.
Reach Compliance Code	compliant
ECCN code	EAR99
Is Samacsys	N
Other features	2.5 OZ. AVG. INSERTION FORCE
body width	1.3 inch
subject depth	0.12 inch
body length	1.3 inch
Contact structure	13X13
Contact to complete cooperation	SN-PB ON NI
Contact completed and terminated	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact material	BE-CU
Contact style	RND PIN-SKT
Device slot type	IC SOCKET
Type of equipment used	PGA133
Shell material	GLASS FILLED THERMOPLASTIC
JESD-609 code	e0
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	133
Maximum operating temperature	260 °C
Minimum operating temperature	-60 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.1 mm
Terminal pitch	2.54 mm
Termination type	SOLDER
Base Number Matches	1

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Low Insertion Force

PGA Sockets

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

Molded & FR-4 Low Insertion Force PGA Sockets

.100

(2.54)

.062

(1.57)

Molded

PC Board

FR-4

PC Board

Features:

• As low as 1 oz.(28.34 g) average insertion

force per pin.

• Multiple finger contacts for reliability.

• Over 500 PGA footprints available.

• Closed bottom terminal for 100% anti-

wicking of solder.

• Tapered entry for ease of insertion.

• To fit .100” (2.54 mm) grid.

• Easily customized to fit your application.

How To Order

1 oz. (28.34 g) Average Insertion Force Sockets

Footprint Dash #

If Applicable*

Body Type

CIS - Standard Molded

HCIS - High Temp. Molded

FIS - FR-4

Number of Pins

004 to 484

*See pages 37 - 64

for PGA footprints

CIS

068

-01

Contact Plating

G - Gold

T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Terminal Type

See next page

for terminal types

Terminals and Contacts:

Terminal: Brass - Copper Alloy (C36000)

ASTM-B-16

Contact: Beryllium Copper (C17200)

ASTM-B-194

How To Order

2.5 oz. (70.85 g) Average Insertion Force Sockets

Footprint Dash #

If Applicable*

Body Type

CS - Standard Molded

HCS - High Temp. Molded

FS - FR-4

Number of Pins

004 to 484

*See pages 37 - 64

for PGA footprints

Solder Preform:

63% Tin, 37% Lead

068

-01

Contact Plating

G - Gold

T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Plating:

Terminal: Gold over Nickel or

Tin-Lead over Nickel

Contact: Gold over Nickel or

Tin-Lead over Nickel

Gold per MIL-G-45204

Tin-Lead per MIL-P-81728

Nickel per QQ-N-290

Terminal Type

See next page

for terminal types

Sealant Options

RTV

Seal

Body Material:

CS/CIS -

Glass Filled Thermoplastic

Polyester (P.B.T.), U.L. Rated 94V-O,

-60˚C to 140˚C (-76˚F to 284˚F)

HCS/HCIS -

High Temp. Glass Filled

Thermoplastic (P.P.S.) , U.L. Rated 94V-O,

-60˚C to 260˚C (-76˚F to 500˚F)

FS/FIS -

FR-4 Fiberglass Epoxy Board,

U.L. Rated 94V-O, Index 140˚C (284˚F)

RTV Sealed

To order: Add RTV to end of part #

Note: RTV not available with HCS or HCIS Insulators

Tape Sealed

To order: Add 3M to end of part #

Page 32

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

inch/(mm)

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