MX29GL256FLT2I-90Q datasheet, PDF

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MX29GL256FLT2I-90Q: DescriptionIC FLASH 256M PARALLEL 56TSOP; Categorystorage storage; File Size950KB，72 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx; Environmental Compliance

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MX29GL256FLT2I-90Q Overview

IC FLASH 256M PARALLEL 56TSOP

MX29GL256FLT2I-90Q Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Macronix
Parts packaging code	TSOP1
package instruction	TSOP1, TSSOP56,.8,20
Contacts	56
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Factory Lead Time	16 weeks
Maximum access time	100 ns
Spare memory width	8
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G56
length	18.4 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	256
Number of terminals	56
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP56,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
page size	8/16 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	128K
Maximum standby current	0.00001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	14 mm

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MX29GL256F

DATASHEET

P/N:PM1544

REV. 1.5, OCT. 30, 2013

MX29GL256F

Contents

FEATURES ............................................................................................................................................................. 5

GENERAL FEATURES .................................................................................................................................. 5

PERFORMANCE ........................................................................................................................................... 5

SOFTWARE FEATURES............................................................................................................................... 5

HARDWARE FEATURES .............................................................................................................................. 5

PIN CONFIGURATION ........................................................................................................................................... 6

PIN DESCRIPTION ................................................................................................................................................. 7

BLOCK DIAGRAM.................................................................................................................................................. 8

BLOCK DIAGRAM DESCRIPTION ........................................................................................................................ 9

BLOCK STRUCTURE........................................................................................................................................... 10

Table 1. MX29GL256F SECTOR ARCHITECTURE ................................................................................... 10

BUS OPERATION ................................................................................................................................................. 11

Table 2-1. BUS OPERATION ....................................................................................................................... 11

Table 2-2. BUS OPERATION ....................................................................................................................... 12

FUNCTIONAL OPERATION DESCRIPTION ....................................................................................................... 13

READ OPERATION ..................................................................................................................................... 13

PAGE READ ................................................................................................................................................ 13

WRITE OPERATION ................................................................................................................................... 13

DEVICE RESET .......................................................................................................................................... 13

STANDBY MODE ........................................................................................................................................ 13

OUTPUT DISABLE ...................................................................................................................................... 14

BYTE/WORD SELECTION.......................................................................................................................... 14

HARDWARE WRITE PROTECT ................................................................................................................. 14

ACCELERATED PROGRAMMING OPERATION ....................................................................................... 14

WRITE BUFFER PROGRAMMING OPERATION ....................................................................................... 14

SECTOR PROTECT OPERATION .............................................................................................................. 15

AUTOMATIC SELECT BUS OPERATIONS ................................................................................................ 15

SECTOR LOCK STATUS VERIFICATION .................................................................................................. 15

READ SILICON ID MANUFACTURER CODE ............................................................................................ 16

READ INDICATOR BIT (Q7) FOR SECURITY SECTOR ............................................................................ 16

INHERENT DATA PROTECTION ................................................................................................................ 16

COMMAND COMPLETION ......................................................................................................................... 16

LOW VCC WRITE INHIBIT.......................................................................................................................... 16

WRITE PULSE "GLITCH" PROTECTION ................................................................................................... 16

LOGICAL INHIBIT........................................................................................................................................ 16

POWER-UP SEQUENCE ............................................................................................................................ 17

POWER-UP WRITE INHIBIT ....................................................................................................................... 17

POWER SUPPLY DECOUPLING................................................................................................................ 17

P/N:PM1544

REV. 1.5, OCT. 30, 2013

MX29GL256F

COMMAND OPERATIONS ................................................................................................................................... 18

READING THE MEMORY ARRAY .............................................................................................................. 18

AUTOMATIC PROGRAMMING OF THE MEMORY ARRAY ...................................................................... 18

ERASING THE MEMORY ARRAY............................................................................................................... 19

SECTOR ERASE ......................................................................................................................................... 19

CHIP ERASE .............................................................................................................................................. 20

ERASE SUSPEND/RESUME ...................................................................................................................... 21

SECTOR ERASE RESUME ........................................................................................................................ 21

PROGRAM SUSPEND/RESUME ............................................................................................................... 22

PROGRAM RESUME .................................................................................................................................. 22

BUFFER WRITE ABORT ............................................................................................................................. 22

AUTOMATIC SELECT OPERATIONS ......................................................................................................... 23

AUTOMATIC SELECT COMMAND SEQUENCE ........................................................................................ 23

READ MANUFACTURER ID OR DEVICE ID .............................................................................................. 24

RESET ........................................................................................................................................................ 24

ADVANCED SECTOR PROTECTION/UN-PROTECTION.......................................................................... 25

Figure 1. Advance Sector Protection/Unprotection SPB Program Algorithm ............................................... 25

Figure 2. Lock Register Program Algorithm ................................................................................................. 26

Figure 3. SPB Program Algorithm................................................................................................................ 28

SECURITY SECTOR FLASH MEMORY REGION ...................................................................................... 31

TABLE 3. COMMAND DEFINITIONS .......................................................................................................... 32

COMMON FLASH MEMORY INTERFACE (CFI) MODE ..................................................................................... 35

QUERY COMMAND AND COMMAND FLASH MEMORY INTERFACE (CFI) MODE ................................ 35

Table 4-1. CFI mode: Identification Data Values

(Note 1)

................................................................................ 35

Table 4-2. CFI mode: System Interface Data Values ................................................................................... 35

Table 4-3. CFI mode: Device Geometry Data Values .................................................................................. 36

Table 4-4. CFI mode: Primary Vendor-Specific Extended Query Data Values

............................................ 37

ELECTRICAL CHARACTERISTICS .................................................................................................................... 38

ABSOLUTE MAXIMUM STRESS RATINGS ............................................................................................... 38

OPERATING TEMPERATURE AND VOLTAGE .......................................................................................... 38

Maximum Negative Overshoot Waveform

................................................................................................... 38

Maximum Positive Overshoot Waveform

..................................................................................................... 38

DC CHARACTERISTICS............................................................................................................................. 39

SWITCHING TEST CIRCUITS .................................................................................................................... 40

Test Condition ............................................................................................................................................. 40

SWITCHING TEST WAVEFORMS ............................................................................................................. 40

AC CHARACTERISTICS ............................................................................................................................. 41

WRITE COMMAND OPERATION......................................................................................................................... 43

Figure 4. COMMAND WRITE OPERATION ................................................................................................ 43

READ/RESET OPERATION ................................................................................................................................. 44

Figure 5. READ TIMING WAVEFORMS ...................................................................................................... 44

Figure 6. RESET# TIMING WAVEFORM ................................................................................................... 45

P/N:PM1544

REV. 1.5, OCT. 30, 2013

MX29GL256F

ERASE/PROGRAM OPERATION ........................................................................................................................ 46

Figure 7. AUTOMATIC CHIP ERASE TIMING WAVEFORM ....................................................................... 46

Figure 8. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART ............................................................ 47

Figure 9. AUTOMATIC SECTOR ERASE TIMING WAVEFORM ................................................................ 48

Figure 10. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART .................................................... 49

Figure 11. ERASE SUSPEND/RESUME FLOWCHART ............................................................................. 50

Figure 12. AUTOMATIC PROGRAM TIMING WAVEFORMS...................................................................... 51

Figure 13. ACCELERATED PROGRAM TIMING DIAGRAM....................................................................... 51

Figure 14. CE# CONTROLLED WRITE TIMING WAVEFORM ................................................................... 52

Figure 15. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART .................................................... 53

Figure 16. SILICON ID READ TIMING WAVEFORM .................................................................................. 54

WRITE OPERATION STATUS .............................................................................................................................. 55

Figure 17. DATA# POLLING TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS) .................. 55

Figure 18. STATUS POLLING FOR WORD PROGRAM/ERASE................................................................ 56

Figure 19. STATUS POLLING FOR WRITE BUFFER PROGRAM ............................................................. 57

Figure 20. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)........................ 58

Figure 21. TOGGLE BIT ALGORITHM ........................................................................................................ 59

Figure 22. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from byte mode to

word mode) ................................................................................................................................................. 60

Figure 23. PAGE READ TIMING WAVEFORM............................................................................................ 61

Figure 24. DEEP POWER DOWN MODE WAVEFORM ............................................................................ 62

Figure 25. WRITE BUFFER PROGRAM FLOWCHART ............................................................................. 63

RECOMMENDED OPERATING CONDITIONS .................................................................................................... 64

At Device Power-Up .................................................................................................................................... 64

ERASE AND PROGRAMMING PERFORMANCE ............................................................................................... 65

DATA RETENTION ............................................................................................................................................... 65

LATCH-UP CHARACTERISTICS ......................................................................................................................... 65

PIN CAPACITANCE .............................................................................................................................................. 65

ORDERING INFORMATION ................................................................................................................................. 66

PART NAME DESCRIPTION ................................................................................................................................ 67

PACKAGE INFORMATION ................................................................................................................................... 68

REVISION HISTORY ............................................................................................................................................ 71

P/N:PM1544

REV. 1.5, OCT. 30, 2013

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