Digital Input Voltage .................... –0.3V to (V
DD
+ 0.3V)
Digital Output Voltage ................. –0.3V to (V
DD
+ 0.3V)
Power Dissipation ...............................................100mW
Operation Temperature Range
LTC1407C/LTC1407AC ............................. 0°C to 70°C
LTC1407I/LTC1407AI ...........................– 40°C to 85°C
LTC1407H/LTC1407AH .......................– 40°C to 125°C
Storage Temperature Range...................–65°C to 150°C
Lead Temperature (Soldering, 10 sec) .................. 300°C
MSE PACKAGE
10-LEAD PLASTIC MSOP
T
JMAX
= 150°C,
θ
JA
= 40°C/W
EXPOSED PAD (PIN #) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LTC1407CMSE#PBF
LTC1407IMSE#PBF
LTC1407HMSE#PBF
LTC1407ACMSE#PBF
LTC1407AIMSE#PBF
LTC1407AHMSE#PBF
TAPE AND REEL
LTC1407CMSE#TRPBF
LTC1407IMSE#TRPBF
LTC1407HMSE#TRPBF
LTC1407ACMSE#TRPBF
LTC1407AIMSE#TRPBF
LTC1407AHMSE#TRPBF
PART MARKING*
LTBDQ
LTBDR
LTBDR
LTAFE
LTAFF
LTAFF
PACKAGE DESCRIPTION
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
–40°C to 125°C
0°C to 70°C
–40°C to 85°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. With internal reference, V
DD
= 3V.
PARAMETER
Resolution (No Missing Codes)
Integral Linearity Error
Offset Error
Offset Match from CH0 to CH1
Gain Error
Gain Match from CH0 to CH1
Gain Tempco
(Notes 5, 17)
(Notes 4, 17)
(Note 17)
(Notes 4, 17)
(Note 17)
Internal Reference (Note 4)
External Reference
l
CONVERTER CHARACTERISTICS
CONDITIONS
l
l
l
MIN
12
–2
–10
–5
–30
–5
LTC1407
LTC1407A
LTC1407H
LTC1407AH
TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
14
±0.25
±1
±0.5
±5
±1
±15
±1
2
10
5
30
5
–4
–20
–10
–10
±0.5
±2
±1
±2
±15
±1
4
20
10
60
10
12
–2
–20
–5
–40
–5
±0.25
±1
±0.5
±5
±1
±15
±1
2
20
5
40
5
14
–4
–30
–10
–10
±0.5
±2
±1
±2
±15
±1
4
30
10
80
10
UNITS
Bits
LSB
LSB
LSB
LSB
LSB
ppm/°C
ppm/°C
–60 ±10
–80 ±10
1407fb
2
LTC1407/LTC1407A
The
l
denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at T
A
= 25°C. With internal reference, V
DD
= 3V.
SYMBOL PARAMETER
V
IN
V
CM
I
IN
C
IN
t
ACQ
t
AP
t
JITTER
t
SK
CMRR
Analog Differential Input Range (Notes 3, 9)
Analog Common Mode + Differential
Input Range (Note 10)
Analog Input Leakage Current
Analog Input Capacitance
Sample-and-Hold Acquisition Time
Sample-and-Hold Aperture Delay Time
Sample-and-Hold Aperture Delay Time Jitter
Sample-and-Hold Aperture Skew from CH0 to CH1
Analog Input Common Mode Rejection Ratio
f
IN
= 1MHz, V
IN
= 0V to 3V
f
IN
= 100MHz, V
IN
= 0V to 3V
(Note 6)
l
l
ANALOG INPUT
CONDITIONS
2.7V ≤ V
DD
≤ 3.3V
MIN
TYP
0 to 2.5
0 to V
DD
MAX
UNITS
V
V
1
13
39
1
0.3
200
–60
–15
μA
pF
ns
ns
ps
ps
dB
dB
DYNAMIC ACCURACY
SYMBOL PARAMETER
SINAD
Signal-to-Noise Plus
Distortion Ratio
The
l
denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at T
A
= 25°C. With internal reference, V
DD
= 3V.
CONDITIONS
100kHz Input Signal
750kHz Input Signal
750kHz Input Signal (H Grade)
100kHz Input Signal, External V
REF
= 3.3V, V
DD
≥ 3.3V
750kHz Input Signal, External V
REF
= 3.3V, V
DD
≥ 3.3V
100kHz First 5 Harmonics
750kHz First 5 Harmonics
750kHz First 5 Harmonics (H Grade)
100kHz Input Signal
750kHz Input Signal
1.25V to 2.5V 1.40MHz into CH0
+
, 0V to 1.25V,
1.56MHz into CH0
–
. Also Applicable to CH1
+
and CH1
–
V
REF
= 2.5V (Note 17)
V
IN
= 2.5V
P-P
, SDO = 11585LSB
P-P
(–3dBFS) (Note 15)
S/(N + D) ≥ 68dB
l
l
LTC1407/LTC1407H LTC1407A/LTC1407AH
MIN
TYP MAX MIN
TYP MAX
68
67
70.5
70.5
70.5
72.0
72.0
–87
–83
–82
87
83
–82
0.25
50
5
–77
–76
70
69
73.5
73.5
73.5
76.3
76.3
–90
–86
–85
90
86
–82
1
50
5
–80
–79
UNITS
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
LSB
RMS
MHz
MHz
THD
Total Harmonic
Distortion
Spurious Free
Dynamic Range
Intermodulation
Distortion
Code-to-Code
Transition Noise
Full Power Bandwidth
Full Linear Bandwidth
l
l
SFDR
IMD
INTERNAL REFERENCE CHARACTERISTICS
T
A
= 25°C. V
DD
= 3V.
PARAMETER
V
REF
Output Voltage
V
REF
Output Tempco
V
REF
Line Regulation
V
REF
Output Resistance
V
REF
Setting Time
V
DD
= 2.7V to 3.6V, V
REF
= 2.5V
Load Current = 0.5mA
CONDITIONS
I
OUT
= 0
MIN
TYP
2.5
15
600
0.2
2
MAX
UNITS
V
ppm/°C
μV/V
Ω
ms
1407fb
3
LTC1407/LTC1407A
DIGITAL INPUTS AND DIGITAL OUTPUTS
SYMBOL
V
IH
V
IL
I
IN
C
IN
V
OH
V
OL
I
OZ
C
OZ
I
SOURCE
I
SINK
PARAMETER
High Level Input Voltage
Low Level Input Voltage
Digital Input Current
Digital Input Capacitance
High Level Output Voltage
Low Level Output Voltage
Hi-Z Output Leakage D
OUT
Hi-Z Output Capacitance D
OUT
Output Short-Circuit Source Current
Output Short-Circuit Sink Current
V
OUT
= 0V, V
DD
= 3V
V
OUT
= V
DD
= 3V
V
DD
= 3V, I
OUT
= –200μA
V
DD
= 2.7V, I
OUT
= 160μA
V
DD
= 2.7V, I
OUT
= 1.6mA
V
OUT
= 0V to V
DD
l
l
l
The
l
denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at T
A
= 25°C. V
DD
= 3V.
CONDITIONS
V
DD
= 3.3V
V
DD
= 2.7V
V
IN
= 0V to V
DD
l
l
l
MIN
2.4
TYP
MAX
0.6
±10
UNITS
V
V
μA
pF
V
V
V
μA
pF
mA
mA
5
2.5
2.9
0.05
0.10
1
20
15
0.4
±10
POWER REQUIREMENTS
SYMBOL
V
DD
I
DD
PARAMETER
Supply Voltage
Supply Current
The
l
denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at T
A
= 25°C. With internal reference, V
DD
= 3V.
CONDITIONS
Active Mode, f
SAMPLE
= 1.5Msps
Active Mode (LTC1407H/LTC1407AH)
Nap Mode
Nap Mode (LTC1407H/LTC1407AH)
Sleep Mode (LTC1407/LTC1407H)
Sleep Mode (LTC1407A/LTC1407AH)
Active Mode with SCK in Fixed State (Hi or Lo)
l
l
l
l
MIN
2.7
TYP
4.7
5.2
1.1
1.2
2.0
2.0
12
MAX
3.6
7.0
8.0
1.5
1.8
15
10
UNITS
V
mA
mA
mA
mA
μA
μA
mW
PD
The
l
denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at T
A
= 25°C. V
DD
= 3V.
SYMBOL
f
SAMPLE(MAX)
t
THROUGHPUT
t
SCK
t
CONV
t
1
t
2
t
3
t
4
t
5
t
6
PARAMETER
Maximum Sampling Frequency per Channel
(Conversion Rate)
Minimum Sampling Period (Conversion + Acquisiton Period)
Clock Period
Conversion Time
Minimum Positive or Negative SCLK Pulse Width
CONV to SCK Setup Time
SCK Before CONV
Minimum Positive or Negative CONV Pulse Width
SCK to Sample Mode
CONV to Hold Mode
(Note 16)
(Note 6)
(Note 6)
(Notes 6, 10)
(Note 6)
(Note 6)
(Note 6)
(Notes 6, 11)
CONDITIONS
l
l
l
TIMING CHARACTERISTICS
MIN
1.5
TYP
MAX
UNITS
MHz
667
19.6
32
2
3
0
4
4
1.2
10000
34
10000
ns
ns
SCLK cycles
ns
ns
ns
ns
ns
ns
1407fb
4
LTC1407/LTC1407A
The
l
denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at T
A
= 25°C. V
DD
= 3V.
SYMBOL
t
7
t
8
t
9
t
10
t
12
PARAMETER
32nd SCK↑ to CONV↑ Interval (Affects Acquisition Period)
Minimum Delay from SCK to Valid Bits 0 Through 11
SCK to Hi-Z at SDO
Previous SDO Bit Remains Valid After SCK
V
REF
Settling Time After Sleep-to-Wake Transition
CONDITIONS
(Notes 6, 7, 13)
(Notes 6, 12)
(Notes 6, 12)
(Notes 6, 12)
(Notes 6, 14)
MIN
45
8
6
2
2
TYP
MAX
UNITS
ns
ns
ns
ns
ms
TIMING CHARACTERISTICS
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
All voltage values are with respect to ground GND.
Note 3:
When these pins are taken below GND or above V
DD
, they will be
clamped by internal diodes. This product can handle input currents greater
than 100mA below GND or greater than V
DD
without latchup.
Note 4:
Offset and range specifications apply for a single-ended CH0
+
or CH1
+
input with CH0
–
or CH1
–
grounded and using the internal 2.5V reference.
Note 5:
Integral linearity is tested with an external 2.55V reference and is
defined as the deviation of a code from the straight line passing through
the actual endpoints of a transfer curve. The deviation is measured from
the center of quantization band.
Note 6:
Guaranteed by design, not subject to test.
Note 7:
Recommended operating conditions.
Note 8:
The analog input range is defined for the voltage difference
between CH0
+
and CH0
–
or CH1
+
and CH1
–
.
Note 9:
The absolute voltage at CH0
+
, CH0
–
, CH1
+
and CH1
–
must be
within this range.
Note 10:
If less than 3ns is allowed, the output data will appear one
clock cycle later. It is best for CONV to rise half a clock before SCK, when
running the clock at rated speed.
Note 11:
Not the same as aperture delay. Aperture delay (1ns) is the
difference between the 2.2ns delay through the sample-and-hold and the
1.2ns CONV to Hold mode delay.
Note 12:
The rising edge of SCK is guaranteed to catch the data coming
out into a storage latch.
Note 13:
The time period for acquiring the input signal is started by the
32nd rising clock and it is ended by the rising edge of CONV.
Note 14:
The internal reference settles in 2ms after it wakes up from Sleep
mode with one or more cycles at SCK and a 10μF capacitive load.
Note 15:
The full power bandwidth is the frequency where the output code
swing drops by 3dB with a 2.5V
P-P
input sine wave.
Note 16:
Maximum clock period guarantees analog performance during
conversion. Output data can be read with an arbitrarily long clock period.
Note 17:
The LTC1407A is measured and specified with 14-bit resolution
(1LSB = 152μV) and the LTC1407 is measured and specified with 12-bit
[font=微软雅黑][size=4]According to the EEWORLD moderator rules and moderator operation manual, the list of moderators who received awards in February 2015 is as follows: [/size][/font][/align][align=left...
[color=rgb(0,0,0)][font=SimSun][size=11pt]Parts packaging technology Insertion packaging technology (Through Hole Technology) Place the parts on one side of the board and solder the pins on the other ...
I recently installed ucgui on FPGA and finished the soft IP. I added it to QUARTUSII and an error occurred during compilation.I had no problem doing this before. This time, I used an ALT_PLL and multi...
Tesla and BYD, vying for dominance in the global electric vehicle market, are reportedly considering adopting Samsung's AMOLED (active-matrix organic light-emitting diode) technology for their next...[Details]
introduction
With the development of digital and network technologies, broadcasting technology has become increasingly diversified, with the most significant trend being the transition from an...[Details]
As more and more consumers purchase new energy vehicles, the safety of electric vehicles has become a major concern. This has been particularly prominent following a series of electric vehicle fire...[Details]
"Have you set your calendar reminder?"
On August 24, Nvidia Robotics' official account posted a photo of a black gift box on a social media platform, with an attached greeting card sig...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
With the support and encouragement of national policies, some Internet car manufacturers have also joined the new energy vehicle manufacturing industry. From the perspective of new car manufacturer...[Details]
1. Introduction
In 2015, Apple's new MacBook and Apple Watch both featured force-sensing technology, which Apple calls Force Touch. Each time a user presses the touchpad, the device not only p...[Details]
On August 20, Huawei Device announced that the all-new M7 is the first to feature an in-cabin laser vision solution. This solution offers enhanced active safety capabilities compared to primary vis...[Details]
Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]
introduction
In recent years, with the increasing number of high-rise buildings, the demand for elevators has also increased. Currently, the elevators we use most often use LED dot array displ...[Details]
Reasons for the wear of the roller press reducer shaft:
1. Since the expansion sleeve is subjected to a large torque, the mating surfaces of the shaft and the sleeve move relative to each other...[Details]
Naxin Micro releases the NS800RT737x high-performance real-time control MCU (DSP), enabling core control in the industrial and energy sectors.
In power electronics and electric drive...[Details]
August 18, 2025—
Advantech, a global leader in IoT intelligent systems and embedded platforms, today announced a collaboration with LitePoint, a global provider of wireless test solutions, to d...[Details]
When we use electric cars on the highway, we do need to pay attention to more aspects than fuel cars.
First, we need to charge our electric vehicles in advance. Compared to fuel vehicles...[Details]
Challenges come from multiple dimensions, and data centers on wheels require more rigorous testing.
Comparing the past, present, and future of automobiles, one clear trend emerges: cars ...[Details]
Suggestions & Announcements
京公网安备 11010802033920号
EEWORLD
