Revision History ............................................................................................................................................ 2
Overview and Key Features ......................................................................................................................... 4
Features & Benefits.................................................................................................................................................4
3.1 Power Consumption ....................................................................................................................................12
3.2 Typical Current Consumption in mA ............................................................................................................12
4.2 SPI Bus .........................................................................................................................................................14
4.4 General Purpose I/O and ADC .....................................................................................................................14
8.2 Power Exposure Information .......................................................................................................................25
8.4 Industry Canada (IC) Warning: .....................................................................................................................27
8.5 CE Regulatory ...............................................................................................................................................28
9 EU Declarations of Conformity ........................................................................................................... 29
11 Ordering Information .......................................................................................................................... 32
11.1 General Comments ......................................................................................................................................32
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth
3
CONN-HIG-BT730_1
Class 1 Bluetooth v2.0 Module
Hardware Integration Guide
O
VERVIEW AND
K
EY
F
EATURES
Every BT730 series Bluetooth
®
module from Laird Technologies is designed to add robust, long-range
Bluetooth data connectivity to any device. Based on the market-leading Cambridge Silicon Radio (CSR) BC04
chipset, BT730 modules provide exceptionally low power consumption with outstanding Class 1 range via 18
dBm of transmit power. A broad range of Bluetooth profiles and other vital features make BT730 modules
superior to other Bluetooth modules.
With a compact footprint of 15.29 x 28.71 mm, the modules deliver maximum range with minimum size.
Another integration advantage is the inclusion of a complete Bluetooth v2.0 protocol stack with support for
multi-point connections and numerous Bluetooth profiles including Serial Port Profile (SPP), Dial Up
Networking (DUN), FTP Client plus partial support for Headset (HSP) and HandsFree (HFP). BT730 modules are
fully qualified as Bluetooth end products, enabling designers to integrate the modules in devices without the
need for further Bluetooth qualification.
An integrated AT command processor interfaces to the host system over a serial port using an extensive
range of AT commands. The AT command set abstracts the Bluetooth protocol from the host application,
saving many months of programming and integration time. It provides extremely short integration times for
data oriented Bluetooth applications.
The included firmware provides programming support for multi-point applications that use up to three
simultaneous data connections to and from the robust BT730 module. A low-cost developer’s kit makes it
easy for an OEM to integrate the module and guarantees the fastest route to prototype and then mass
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FPGA/CPLD
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