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796065

Description
97SC 400 2% 0.38 DIA
CategoryTools and equipment   
File Size74KB,2 Pages
ManufacturerMulticore
Environmental Compliance
Download Datasheet Parametric View All

796065 Overview

97SC 400 2% 0.38 DIA

796065 Parametric

Parameter NameAttribute value
typebonding wire
componentSn96.5Ag3Cu0.5(96.5/3/0.5)
diameter0.015"(0.38mm)
melting point423°F(217°C)
Flux typeNo cleaning required
Wire gauge27 AWG,28 SWG
CraftsmanshipLead-free
formSpool, 8.8 oz (250g)
shelf lifenot applicable
Shelf life start date-
delivery information-
weight-
Technical Data Sheet
LOCTITE C 400
September
-2015
PRODUCT DESCRIPTION
LOCTITE C 400 provides the following product characteristics:
Technology
Product Benefits
Cored solder wire
● Halide free
● No clean
● Clear residue
● Good wetting
● Fast soldering
● Heat stable
● Mild odor
● Pb-free and SnPb alloys available
ROL0
Soldering - Cored wire
Copper, Brass and Nickel
IPC/J-STD-004
Classification
Application
Surface Finishes
Soldering Iron:
● Good results can be obtained using a range of tip
temperatures. However, the optimum tip temperature and
heat capacity required for a hand-soldering process is a
function of both soldering iron design and the nature of
the task.
● Care should be exercised to avoid unnecessarily high tip
temperatures for extensive periods of time.
● A high tip temperature may increase any tendency to flux
spitting and it may produce some residue darkening.
● The tip of the soldering iron should be properly tinned.
Severely contaminated soldering iron tips should be
cleaned with Multicore® Tip Tinner/Cleaner.
● Wipe the tip on a clean, damp sponge before re-tinning
with LOCTITE C 400 wire.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron
tip should contact both the base material and the lead at
the same time to heat both surfaces properly. It should
take no more than a fraction of a second to heat both
surfaces adequately.
2. Apply LOCTITE C 400 flux cored wire to a part of the joint
surface away from the soldering iron and allow to form a
joint fillet. This will be virtually instantaneous. Do not
apply excessive solder to the joint as this will not improve
joint integrity and it will leave excess flux residues on the
surface.
3. Remove solder from the work piece and then remove the
iron tip.
4. The total process will be very rapid, depending upon
thermal mass, tip temperature, tip configuration and the
solderability of the surfaces to be joined.
5. The resin and flux systems are designed to leave
relatively low residues and to minimize residual activity.
This is achieved by ensuring some decomposition and
volatilization takes place during the soldering process
Cleaning:
LOCTITE C 400 flux cored solder wire has been formulated to
leave amber flux residues and resist spitting and fuming. In
most industrial and consumer electronics applications,
cleaning will not be required. The product may, therefore, be
used to complement a no-clean wave soldering or reflow
process or to allow repairs to cleaned boards without the need
for a second cleaning process. In high-reliability applications,
the residues should be removed.
Should cleaning be required, this is best achieved using
SC-01™ cleaner.
LOCTITE C 400 cored solder wire has been specially
formulated to complement no clean wave and reflow soldering
processes. LOCTITE C 400 wires provide fast soldering on
copper, brass, and solder coated materials.
TYPICAL PROPERTIES
Solder Cored Wire
Alloys - Tin/lead
Alloys - Lead Free
Acid Value
Halide content
Flux Content (%)
● SN63
● SN60
● Sn62
● 97SC (SAC305)
● 96SC (SAC387)
● SAC0307
● 99C (SnCu)
● 95A (SnSb)
● 96S (SnAg)
205 to 220 mg KOH/g
Zero
2.2
ALLOYS:
The alloys used in LOCTITE C 400 cored solder wires conform to the
purity requirements of the common national and international
standards.
FLUX:
LOCTITE C 400 solid flux is based on modified rosin and carefully
selected activators. In practice they exhibit a mild rosin odor and leave
a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with LOCTITE C 400 does not require any special
methods or deviation from standard hand soldering practices.
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