A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
Hello everyone: When I buy a development board, I often hear people ask whether this development board can support a certain operating system, such as the VxWorks operating system. I am a novice, and ...
Then I selected the Pocket PC 2003 platform, and EVC got stuck. It couldn't respond and I had to reinstall EVC and Pocket PC 2003 SDK several times....
[i=s]This post was last edited by qwerghf on 2016-11-23 08:36[/i] My first PIC development board, gift to someone in need, with onboard downloader and two PIC chips...
C:\WINCE500\PBWorkspaces\simu3\WINCE500\Emulator_x86\cesysgen\sdk\lib\x86etail\ceshell.lib (5K) C:\WINCE500\PUBLIC\SHELL\OAK\LIB\X86\RETAIL\ceshell.lib (1150K) My HPC is ported from an old version of ...
Atmel|SMART MPU based on Cortex core (Part 3) : https://training.eeworld.com.cn/course/17??? Atmel ARM-based embedded MPUs - Embedded MPUs based on ARM Cortex-A5 and ARM926EJ-S are easy to use and ide...
As the main model among new energy vehicles, pure electric vehicles have received strong support and encouragement from the country in recent years, and their development is changing with each pass...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Limited vocabulary recognition
According to the number of characters, words or short sentences in the vocabulary, it can be roughly divided into: less than 100 is small vocabulary; 100-1000 is...[Details]
White light LEDs are voltage-sensitive devices. In actual operation, their upper limit is 20mA. However, the current often increases due to various reasons during use. If no protective measures are...[Details]
The Automotive Testing and Quality Assurance Expo (ATE 2025) will open on August 27th. At the expo, Rohde & Schwarz (R&S) will showcase six automotive testing solutions, themed "Intelligently Drivi...[Details]
Electric vehicles' 12V batteries don't rely on a generator to power them. Only gasoline-powered vehicles rely on the engine to drive a generator to generate electricity while driving, which is used...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
Lightweighting of automobiles is still a relatively unfamiliar term for automobiles. With the continuous improvement of environmental protection requirements, relevant regulations have also put for...[Details]
As the range of electric vehicles continues to increase, driving electric vehicles for long-distance travel has become a trend. For high-speed travel, how much impact will high-speed driving of ele...[Details]
Nascent Micro is launching devices covering a wide range of power applications, including gallium nitride (GaN) drivers, dual-channel automotive drivers, and battery protection MOSFETs.
...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
On August 18th, China's largest expressway
charging station,
the G25 Changshen Expressway Tonglu Service Area (South Area), officially opened and launched its integrated solar-storage-charg...[Details]
Traditionally, electrical energy is transmitted primarily through wires, requiring direct physical contact between the power source and the load. With the increasing number of electrical devices in...[Details]